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AMD XC2VP7-5FFG672I
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- Part No.:
- XC2VP7-5FFG672I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 672-BBGA, FCBGA
- Datasheet:
-
XC2VP7-5FFG672I.pdf
- Description:
- IC FPGA 396 I/O 672FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,149
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Product details
Overview
XC2VP7-5FFG672I from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, eight RocketIO multi-gigabit transceivers, 11,088 logic cells, 44 18×18-bit multipliers, and 396 user I/Os in a 672-pin flip-chip fine-pitch BGA package. It operates at -5 speed grade (300 MHz PowerPC, 2.0 Gb/s RocketIO), with 1.5 V core supply and industrial temperature range (–40°C to +100°C), deployed in telecom line cards requiring embedded processing and serial backplane interconnect.
For engineers reviewing the XC2VP7-5FFG672I datasheet, pinout, applications, or equivalent options, key selection considerations include verified RocketIO transceiver compliance with Fibre Channel and Gigabit Ethernet, confirmed PowerPC 405 cache/MMU support for real-time OS deployment, validated DCM-based clock management for jitter-sensitive interfaces, and documented FF672 package I/O mapping for PCB layout reuse.
Technical Context
The XC2VP7-5FFG672I implements a hybrid architecture combining hard IP blocks-PowerPC 405 core with 16 KB instruction and 16 KB data caches, MMU, and OCM interface-with programmable fabric including Configurable Logic Blocks (CLBs), Block SelectRAM+ (18 Kb dual-port RAM), and dedicated 18×18 multipliers. Its RocketIO transceivers operate at up to 2.0 Gb/s per channel with 8B/10B encoding, on-chip 50 Ω termination, and per-channel loopback for protocol validation.
Digital Clock Manager (DCM) modules provide phase-shifting, frequency synthesis, and deskew compensation across 16 global clock nets; Active Interconnect routing ensures predictable delay independent of fanout. The device uses SRAM-based configuration with IEEE 1532 support, Triple-DES bitstream encryption, and boundary-scan (IEEE 1149.1) for test and debug.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 11,088 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| PowerPC Core | One 300 MHz PowerPC 405 - provides embedded RISC execution with 16 KB I-cache, 16 KB D-cache, and MMU for OS support |
| RocketIO Transceivers | 8 channels @ 2.0 Gb/s - enables full-duplex serial links compliant with Fibre Channel, Gigabit Ethernet, and XAUI |
| Block RAM | 396 Kb (22 × 18 Kb SelectRAM+) - supports large on-chip buffering, FIFOs, or coefficient storage for DSP pipelines |
| I/O Count | 396 user I/Os - accommodates high-pin-count parallel buses, DDR memory interfaces, and mixed-voltage signaling |
| DCM Modules | 4 units - deliver jitter-tolerant clock distribution, multiplication/division, and ±180° phase adjustment for timing-critical paths |
| Package | FF672 flip-chip BGA, 27×27 mm, 1.0 mm pitch - enables high-density routing and thermal performance suitable for industrial environments |
| Temperature Grade | Industrial (–40°C to +100°C) - qualified for deployment in base station RF units and industrial control cabinets |
Pinout & Package
XC2VP7-5FFG672I is housed in a 672-ball flip-chip fine-pitch BGA (FF672) package with 1.0 mm ball pitch and 27 mm × 27 mm body size. This package supports high-speed signal integrity via controlled impedance routing and low-inductance power delivery, optimized for industrial temperature operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration state machine during master serial or SelectMAP programming |
| DONE | Configuration Status Output | Signals completion of bitstream loading and initialization of I/Os and logic |
| M0–M2 | Mode Selection Inputs | Set configuration mode (e.g., slave serial, master SelectMAP) at power-up |
| PROG_B | Program Initiate Input | Resets configuration memory and initiates reconfiguration sequence |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | Enables IEEE 1149.1-compliant testing, debugging, and partial reconfiguration |
| DXP/DXN | Differential Clock Input Pair | Accepts LVDS or LVPECL reference clocks for DCM synchronization and transceiver PLL lock |
| RXP0–RXN0 … RXP7–RXN7 | RocketIO Receiver Differential Pairs | Terminate incoming serial data at 50 Ω; support AC coupling and programmable equalization |
| TXP0–TXN0 … TXP7–TXN7 | RocketIO Transmitter Differential Pairs | Drive differential output swing from 200 mV to 1600 mV pp; support pre-emphasis for channel loss compensation |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PowerPC 405 Core | Hardened RISC processor with 32×32-bit GPRs, hardware multiply/divide, and MMU enabling Linux/uClinux boot without external CPU |
| RocketIO Transceivers | Eight 2.0 Gb/s SERDES with 8B/10B encode/decode, on-chip 50 Ω termination, and per-channel loopback for production test coverage |
| Digital Clock Manager (DCM) | Four fully digital DCMs providing zero-delay buffer, ±180° phase shift in 1/256-cycle steps, and frequency synthesis for jitter-sensitive interfaces |
| SelectIO-Ultra I/O | 396 pins supporting LVDS, SSTL-2, HSTL, PCI-X, and digitally controlled impedance (DCI) for automated on-die termination matching |
| Security & Configuration | Triple-DES bitstream encryption, readback capability, and IEEE 1532-compliant boundary-scan for secure, traceable, and field-upgradable designs |
| Memory Architecture | 22 × 18 Kb Block SelectRAM+ (396 Kb total) + distributed RAM - enables true dual-port buffers, FIR filters, and frame stores without external memory |
Applications
| Wireless Baseband Processing | Industrial Protocol Gateway |
|---|---|
Use Scenario: Real-time modulation/demodulation and channel coding in 3G/LTE remote radio heads using custom HDL accelerators alongside embedded software. IC Role / Device Role / Timing Role: XC2VP7-5FFG672I serves as the system-on-chip host, executing protocol stack in PowerPC while offloading FFT, Viterbi, and CRC in FPGA fabric with synchronized 200 MHz clocks. Use Value: Integrated RocketIO links to fronthaul CPRI interfaces at 2.4576 Gb/s; DCM-controlled clock domains ensure <150 ps skew between ADC/DAC sampling and processing logic. | Use Scenario: Bridging Modbus TCP, PROFINET, and EtherCAT in factory automation controllers requiring deterministic latency and firmware update security. IC Role / Device Role / Timing Role: XC2VP7-5FFG672I acts as protocol translation engine, running real-time OS on PowerPC while FPGA logic handles packet parsing, timestamping, and cyclic redundancy checks. Use Value: On-chip 396 Kb Block RAM stores protocol stacks and configuration tables; Triple-DES encryption prevents unauthorized firmware modification during over-the-air updates. |
| Medical Imaging Data Acquisition | Avionics Data Concentrator |
Use Scenario: High-fidelity ultrasound beamforming where analog front-end channels feed digitized samples to centralized processing. IC Role / Device Role / Timing Role: XC2VP7-5FFG672I functions as central aggregator, receiving 64-channel LVDS data streams and performing real-time filtering, compression, and PCIe packetization. Use Value: 396 user I/Os accommodate parallel LVDS receivers; RocketIO transceivers route processed data to host via XAUI-compatible 3.125 Gb/s link with 8B/10B error detection. | Use Scenario: ARINC 664 (AFDX) end-system in flight control computers consolidating sensor inputs and actuator commands across redundant networks. IC Role / Device Role / Timing Role: XC2VP7-5FFG672I implements AFDX endpoint logic with time-triggered scheduling, CRC-32 generation, and bandwidth allocation enforcement in FPGA fabric. Use Value: PowerPC 405 executes partitioned DO-178C certifiable software; DCM-synchronized clocks meet AFDX jitter requirements (<1 µs deviation over 100 ms). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based embedded processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP7-6FF672I | Higher speed grade (-6): 350 MHz PowerPC, 2.5 Gb/s RocketIO; same logic count, I/O, and package | Required for designs needing >300 MHz processor clock or >2.0 Gb/s transceiver rates under industrial conditions | Select when higher timing margin is needed for complex RTOS workloads or extended backplane reach |
| XC2VP4-5FF672I | Lower density: 6,768 logic cells, 4 RocketIO, 1 PowerPC, 348 I/Os; identical -5 speed grade and FF672 package | Suitable for cost-optimized gateways or controllers with reduced protocol concurrency or memory bandwidth needs | Choose for footprint-compatible migration path when design scale allows resource reduction |
Compared with XC2VP7-5FFG672I, the XC2VP7-6FF672I delivers higher transceiver and processor performance within identical packaging-enabling drop-in timing upgrades-while the XC2VP4-5FF672I offers verified pin compatibility with reduced logic and transceiver count for scalable product families.
Availability
XC2VP7-5FFG672I is available at Aetrix Electronics and suitable for wireless infrastructure, industrial automation, and medical imaging systems requiring stable component supply and long-term industrial-grade reliability.
Supply support for XC2VP7-5FFG672I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures with embedded processors and high-speed transceivers.
The Virtex-II Pro family was designed to integrate hard processor cores and multi-gigabit serial I/O into high-density FPGAs for telecommunications, aerospace, and industrial embedded systems demanding both programmable logic and deterministic processing.
FAQ
What is the maximum operating frequency of the PowerPC 405 core in XC2VP7-5FFG672I?
The XC2VP7-5FFG672I PowerPC 405 core is rated for 300 MHz operation under industrial temperature conditions (–40°C to +100°C) at the -5 speed grade. This frequency is guaranteed with proper decoupling, thermal management, and voltage regulation per DS083 specifications. The XC2VP7-5FFG672I datasheet confirms this limit applies to both single- and dual-processor configurations in industrial grade devices.
Does XC2VP7-5FFG672I support JTAG boundary-scan testing?
Yes, XC2VP7-5FFG672I fully supports IEEE 1149.1 boundary-scan testing via dedicated TCK, TMS, TDI, and TDO pins. The device implements standard instructions including EXTEST, INTEST, SAMPLE, and BYPASS, enabling board-level interconnect verification and in-system programming. This capability is documented in Module 4 of DS083 and validated for the FF672 package variant of XC2VP7-5FFG672I.
Can XC2VP7-5FFG672I be configured using SPI flash memory?
No, XC2VP7-5FFG672I does not support native SPI flash configuration. It requires configuration through Master Serial, Slave Serial, or SelectMAP modes using parallel or serial PROMs compatible with Xilinx's Platform Flash or third-party devices meeting IEEE 1532 timing. SPI interface support was introduced in later Virtex families; XC2VP7-5FFG672I relies on dedicated configuration pins (CCLK, DIN, PROG_B) as specified in DS083 Module 1.
What transceiver protocols are supported by the RocketIO blocks in XC2VP7-5FFG672I?
The XC2VP7-5FFG672I RocketIO transceivers support Fibre Channel, Gigabit Ethernet, 10G Fibre Channel, XAUI, and InfiniBand protocols at up to 2.0 Gb/s per channel. These are enabled via 8B/10B encoding, programmable comma detection, and channel bonding. Protocol compliance is confirmed in DS083 Table 4 and Module 2 functional descriptions for non-X variants like XC2VP7-5FFG672I.
Is XC2VP7-5FFG672I pin-compatible with other Virtex-II Pro devices in FF672 packaging?
XC2VP7-5FFG672I shares the FF672 package footprint with XC2VP20-5FF672I and XC2VP30-5FF672I, but pin functions differ due to varying RocketIO counts, I/O allocations, and power pin distributions. While ball grid layout is identical, direct replacement requires verification of signal mapping against DS083 Module 4 pinout tables. XC2VP7-5FFG672I has 396 user I/Os; XC2VP20-5FF672I has 564, confirming non-interchangeable I/O assignments.
XC2VP7-5FFG672I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 672-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1232
- Number of Logic Elements/Cells:
- 11088
- Total RAM Bits:
- 811008
- Number of I/O:
- 396
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 672-FCBGA (27x27)
XC2VP7-5FFG672I FAQ
1.How can I place an order for XC2VP7-5FFG672I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP7-5FFG672I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP7-5FFG672I reliable?
The price and inventory of XC2VP7-5FFG672I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP7-5FFG672I is usually 5 days.
3.What payment methods are accepted for XC2VP7-5FFG672I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP7-5FFG672I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP7-5FFG672I?
XC2VP7-5FFG672I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP7-5FFG672I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP7-5FFG672I?
For technical support, including XC2VP7-5FFG672I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP7-5FFG672I requirements.
6.How does Aetrix verify that XC2VP7-5FFG672I is sourced from the original manufacturer or authorized distributors?
All XC2VP7-5FFG672I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP7-5FFG672I meets industry standards.
7.What is the process for return or replacement of XC2VP7-5FFG672I?
All XC2VP7-5FFG672I units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP7-5FFG672I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP7-5FFG672I part is unused and in its original packaging.
Return procedure for XC2VP7-5FFG672I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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