AMD XC2VP7-5FFG896C

Overview

XC2VP7-5FFG896C from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, eight RocketIO multi-gigabit transceivers (MGTs), 11,088 logic cells, four Digital Clock Managers (DCMs), and 396 user I/Os in an 896-pin flip-chip fine-pitch BGA package. It supports 3.125 Gb/s serial transceiver operation, 300 MHz PowerPC execution, and 1.5 V core voltage - deployed in telecom line cards, high-speed data acquisition systems, and embedded networking interfaces.

For engineers reviewing the XC2VP7-5FFG896C datasheet, pinout, applications, or equivalent options, key selection considerations include verified RocketIO transceiver compliance with Fibre Channel and Gigabit Ethernet, PowerPC 405 cache configuration (16 KB instruction + 16 KB data), DCM phase-shifting resolution (1/256 clock period), and FF896 package thermal performance under sustained 300 MHz CPU load.

Technical Context

The XC2VP7-5FFG896C implements a hardened PowerPC 405 core with MMU, two-way set-associative 16 KB instruction and data caches, and hardware multiply/divide - all operating at up to 300 MHz in -5 speed grade. Its eight RocketIO transceivers support full-duplex 600 Mb/s to 3.125 Gb/s operation with 8B/10B encoding, channel bonding (2–20 channels), and on-chip 50 Ω termination.

FPGA fabric includes 4,928 CLB slices, 154 dedicated 18×18-bit multipliers, 44 Block SelectRAM+ modules (18 Kb each), and twelve global clock multiplexer buffers. Active Interconnect routing provides predictable delay independent of fanout, while Digitally Controlled Impedance (DCI) enables dynamic on-die termination for LVCMOS, SSTL, and HSTL I/O standards.

Key Specifications

Pinout & Package

XC2VP7-5FFG896C uses the FF896 flip-chip fine-pitch BGA package (31 mm × 31 mm, 1.0 mm pitch), optimized for high I/O count and thermal dissipation. Pin definitions follow Xilinx DS083 Module 4, with dedicated banks for MGT differential pairs, PowerPC bus signals (PLB/OPB), configuration pins (CCLK, DONE, M[0:2]), and dual-voltage I/O banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.

Compared with XC2VP7-5FFG896C, the -6 variant offers guaranteed higher clock margins for thermal-limited deployments, while the XC2VP20-5FF896C provides scalable compute headroom via dual PowerPC cores and 88% more logic - both retain identical FF896 packaging and RocketIO feature set but differ in silicon binning and resource allocation.

Availability

XC2VP7-5FFG896C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for XC2VP7-5FFG896C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA architecture with SRAM-based reconfigurable logic, embedded processors, and high-speed transceivers - enabling adaptive computing for aerospace, communications, and test equipment.

The Virtex-II Pro family was designed for system-on-chip integration in bandwidth-intensive applications, combining FPGA flexibility with hardened PowerPC cores and multi-gigabit serial I/O - targeting protocols like Fibre Channel, Gigabit Ethernet, and SONET.

FAQ

What is the maximum guaranteed operating frequency of the PowerPC 405 core in XC2VP7-5FFG896C?

The XC2VP7-5FFG896C PowerPC 405 core is rated for 300 MHz operation in the -5 speed grade, as confirmed in DS083 Table 4. This frequency is guaranteed across commercial temperature range (0°C to 85°C) with proper 1.5 V VCCINT regulation and cooling. The XC2VP7-5FFG896C does not support 350 MHz operation - that requires the -6 speed grade variant (XC2VP7-6FF896C).

Does XC2VP7-5FFG896C support 10 Gigabit Ethernet (10GbE) physical layer connectivity?

XC2VP7-5FFG896C RocketIO transceivers operate up to 3.125 Gb/s, which supports 10GbE only in XAUI mode (4 lanes × 3.125 Gb/s). It does not support single-lane 10.3125 Gb/s 10GBASE-R. For full 10GBASE-R compliance, a Virtex-4 FX or later device with 10+ Gb/s transceivers is required. The XC2VP7-5FFG896C is validated for Gigabit Ethernet (1.25 Gb/s) and XAUI.

Can XC2VP7-5FFG896C be configured via JTAG boundary scan without external configuration memory?

Yes, XC2VP7-5FFG896C supports IEEE 1532 boundary-scan configuration mode, allowing full bitstream loading through TCK/TMS/TDI/TDO pins without external PROM or Flash. This is used for prototyping and debug. Production systems typically use Master SelectMAP or Slave Serial modes with external configuration memory, but JTAG remains fully functional for programming and verification of XC2VP7-5FFG896C.

What I/O standards are supported by the XC2VP7-5FFG896C with Digitally Controlled Impedance (DCI)?

XC2VP7-5FFG896C DCI supports on-die termination for LVCMOS (1.5V, 1.8V, 2.5V, 3.3V), SSTL (1.8V/2.5V Class I/II), and HSTL (1.5V/1.8V Class I–IV) single-ended standards. DCI does not apply to differential standards - LVDS, BLVDS, and LVPECL use separate on-chip 100 Ω differential termination. All DCI configurations are per-I/O bank and require VREF pins.

Is partial reconfiguration supported on XC2VP7-5FFG896C, and what tools enable it?

Yes, XC2VP7-5FFG896C supports partial reconfiguration using Xilinx Foundation and Alliance Series design tools, as documented in DS083 Module 1. Partial bitstreams can reload specific CLB columns or Block RAM regions without resetting the PowerPC core or RocketIO transceivers. Implementation requires floorplanning with modular design partitioning and use of the Xilinx PAR tool with "-pr" option - verified for dynamic filter coefficient updates and protocol stack swapping in XC2VP7-5FFG896C.