AMD XC2VP7-5FG456I

Overview

XC2VP7-5FG456I from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, eight RocketIO multi-gigabit transceivers (2.5 Gb/s max in wire-bond FG456 package), 11,088 logic cells, and 44 18×18-bit multipliers. It operates at -5 speed grade with industrial temperature range (–40°C to +100°C) and targets high-reliability telecom backplane interfaces and embedded DSP subsystems.

For engineers reviewing the XC2VP7-5FG456I datasheet, pinout, applications, or equivalent options, key selection criteria include verified RocketIO transceiver performance at 2.5 Gb/s in FG456 packaging, PowerPC 405 clocking up to 350 MHz under industrial conditions, DCM-based clock management for synchronous I/O timing, and compatibility with SelectIO-Ultra standards including LVDS and PCI-X.

Technical Context

The XC2VP7-5FG456I implements a hybrid architecture combining hard IP blocks (PowerPC 405, RocketIO SERDES) with SRAM-based configurable logic. Its eight RocketIO transceivers support full-duplex operation from 600 Mb/s to 2.5 Gb/s per channel in wire-bond packages, with monolithic CDR, 8B/10B encoding, and programmable pre-emphasis.

The embedded PowerPC 405 core delivers 350 MHz operation in industrial-grade -5 speed grade, backed by 16 KB instruction and 16 KB data caches, MMU with 64-entry TLB, and dedicated OCM interface. Clock integrity is maintained via twelve Digital Clock Managers supporting phase shifting, frequency synthesis, and deskew across 16 global clock nets.

Key Specifications

Pinout & Package

XC2VP7-5FG456I uses the FG456 wire-bond fine-pitch BGA package (23×23 mm, 1.0 mm pitch), with 396 user I/O pins plus dedicated configuration, clock, and power pins. Pin definitions are fully documented in DS083 Module 4 (Pinout Information), covering all I/O banks, transceiver pairs (MGTREFCLK, TXP/TXN, RXP/RXN), PowerPC JTAG, and DCM control signals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP7-5FG456I, XC2VP7-6FG456I offers timing margin at commercial temperature but no functional upgrade, while XC2VP7-5FF672I expands I/O and transceiver count in a physically larger footprint - neither is pin-compatible, and both require PCB redesign.

Availability

XC2VP7-5FG456I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, medical imaging, and defense electronics requiring stable component supply across extended lifecycle programs.

Supply support for XC2VP7-5FG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures with embedded processors and high-speed transceivers.

The Virtex-II Pro family was designed to integrate hard IP (PowerPC, RocketIO) with flexible FPGA fabric for system-on-chip solutions in high-performance wired communications and embedded computing.

FAQ

What is the maximum RocketIO transceiver data rate supported by XC2VP7-5FG456I?

The XC2VP7-5FG456I supports RocketIO transceivers up to 2.5 Gb/s per channel in the FG456 wire-bond package. This limit is defined by package construction and speed grade; the -5 industrial grade does not support the 3.125 Gb/s rate achievable in -6/-7 commercial variants. All eight transceivers on XC2VP7-5FG456I operate within this 2.5 Gb/s bound under specified thermal and voltage conditions.

Does XC2VP7-5FG456I include an embedded processor core?

Yes, XC2VP7-5FG456I integrates one IBM PowerPC 405 RISC processor core running at up to 350 MHz in industrial temperature conditions. The core includes 16 KB instruction and 16 KB data caches, MMU with 64-entry TLB, and dedicated OCM interface for low-latency memory access - enabling real-time embedded software execution alongside FPGA logic.

What package type and pin count does XC2VP7-5FG456I use?

XC2VP7-5FG456I uses the FG456 wire-bond fine-pitch BGA package: 456 balls, 1.0 mm pitch, 23×23 mm body size. It provides 396 user I/O pins, plus dedicated configuration, clock, JTAG, and power pins. This package is distinct from flip-chip alternatives like FF672 and is optimized for cost-sensitive industrial applications requiring proven reliability.

Can XC2VP7-5FG456I perform partial reconfiguration?

Yes, XC2VP7-5FG456I supports partial reconfiguration through its SRAM-based configuration architecture and dedicated ICAP (Internal Configuration Access Port). This allows dynamic replacement of logic sections without resetting the PowerPC 405 core or disrupting active RocketIO transceiver links - critical for applications requiring runtime adaptation or fault recovery in mission-critical systems.

Is XC2VP7-5FG456I suitable for industrial temperature operation?

Yes, XC2VP7-5FG456I is rated for industrial temperature range (–40°C to +100°C) and carries the 'I' suffix denoting industrial grade. Its -5 speed grade guarantees timing compliance across this full range, including PowerPC 405 operation at 350 MHz and RocketIO transceivers at 2.5 Gb/s - validated per DS083 specifications and factory-tested per Xilinx quality protocols.