AMD XC2VP7-5FGG456C

Overview

XC2VP7-5FGG456C from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, eight RocketIO multi-gigabit transceivers (2.5 Gb/s max in wire-bond packages), 11,088 logic cells, and 396 user I/Os in a 456-pin Fine-Pitch BGA (FGG456) package. It targets high-speed serial interconnect, embedded processing, and reconfigurable telecom infrastructure.

For engineers reviewing the XC2VP7-5FGG456C datasheet, pinout, applications, or equivalent options, key selection considerations include its -5 speed grade (300 MHz PowerPC, 2.5 Gb/s transceivers), FGG456 wire-bond BGA mechanical compatibility, dual-voltage I/O support (1.5V core / 2.5V auxiliary), and integrated DCM-based clock management for deterministic timing closure.

Technical Context

This device implements a hardened PowerPC 405 core with 16 KB instruction and 16 KB data caches, MMU, and CoreConnect bus interface - enabling real-time embedded software execution alongside programmable logic. Its eight RocketIO transceivers operate at up to 2.5 Gb/s per channel in the FGG456 package and support 8B/10B encoding, channel bonding, and on-chip 50 Ω termination.

The FPGA fabric includes Configurable Logic Blocks (CLBs) with dual 4-input LUTs and flip-flops, 18 × 18-bit dedicated multipliers, 18 Kb Block SelectRAM+ modules (up to 396 Kb total), and twelve Digital Clock Managers (DCMs) for phase-shifting, frequency synthesis, and deskew - all built on a 0.13 µm copper process with 1.5 V core supply.

Key Specifications

Pinout & Package

XC2VP7-5FGG456C uses the FGG456 wire-bond fine-pitch BGA package (23 × 23 mm, 1.0 mm pitch, Pb-free). Pin definitions are documented across 302 pages in DS083 Module 4, covering dedicated configuration pins (e.g., CCLK, DONE, M[0:2], PROG_B), JTAG TAP signals (TCK/TDI/TDO/TMS), PowerPC debug interface (JTAGPPC), RocketIO differential pairs (RXN/TXN, RXP/TXP), and 396 user-configurable I/O banks supporting SelectIO-Ultra standards.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP7-5FGG456C, the -6 variant offers higher guaranteed operating frequency for both CPU and transceivers but consumes more power; the XC2VP4-5FGG456C reduces logic, I/O, and transceiver count while maintaining pin compatibility - enabling scalable design reuse across product tiers.

Availability

XC2VP7-5FGG456C is available at Aetrix Electronics and suitable for wireless infrastructure, optical networking, industrial video transport, and defense radar signal processing requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP7-5FGG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-standard FPGA architectures and design tools for high-performance reconfigurable computing.

The Virtex-II Pro family was engineered to unify hard processor cores, high-speed serial I/O, and flexible logic in a single die - targeting telecom, aerospace, and high-end embedded systems where ASIC-level performance meets FPGA-level reprogrammability.

FAQ

What is the maximum guaranteed operating frequency of the PowerPC 405 core in XC2VP7-5FGG456C?

The XC2VP7-5FGG456C has a -5 speed grade, specifying a maximum guaranteed PowerPC 405 core frequency of 300 MHz under commercial temperature conditions. This rating is validated across voltage and process corners per DS083 Table 4. The XC2VP7-5FGG456C datasheet confirms this limit applies to both single- and dual-processor configurations in the -5 grade, with derating required above 85°C ambient.

Does XC2VP7-5FGG456C support 10 Gigabit Ethernet (10GbE) physical layer interfacing?

Yes, XC2VP7-5FGG456C supports 10GbE via its RocketIO transceivers operating at 2.5 Gb/s per lane. While native 10GbE requires 10.3125 Gb/s, the XC2VP7-5FGG456C can implement XAUI (10 Gb Attachment Unit Interface) - a 4-lane, 3.125 Gb/s standard compliant with IEEE 802.3ae. However, the -5 grade limits RocketIO to 2.5 Gb/s in wire-bond packages like FGG456, so full XAUI requires the -6 or -7 grade variants.

What configuration modes are supported by XC2VP7-5FGG456C?

XC2VP7-5FGG456C supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Configuration is initiated via mode pins M[0:2] at power-up. The XC2VP7-5FGG456C also includes an on-chip DES decryptor for bitstream encryption, and supports partial reconfiguration and readback of configuration memory, flip-flops, and block RAM for in-system verification.

Is XC2VP7-5FGG456C pin-compatible with other Virtex-II Pro devices in the FGG456 package?

No, XC2VP7-5FGG456C is not fully pin-compatible with other Virtex-II Pro devices in the FGG456 package. While the FGG456 footprint is shared across XC2VP4, XC2VP7, and XC2VP20, I/O bank assignments, transceiver pinouts, and dedicated function pin locations (e.g., RocketIO, PPC debug) differ between densities. DS083 Module 4 explicitly lists unique pin definitions per device - meaning PCB layout must be verified against the XC2VP7-5FGG456C-specific pinout table before substitution.

What is the role of Digitally Controlled Impedance (DCI) in XC2VP7-5FGG456C?

Digitally Controlled Impedance (DCI) in XC2VP7-5FGG456C provides on-die series termination for single-ended I/O standards including LVCMOS, SSTL, and HSTL. It dynamically matches output driver impedance to transmission line characteristics (typically 50 Ω), eliminating the need for external series resistors. DCI is configured per I/O bank via configuration bits and operates without external calibration components - improving signal integrity and reducing BOM count in high-speed parallel interfaces.