AMD XC2VP7-6FF672I

Overview

XC2VP7-6FF672I from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, eight RocketIO multi-gigabit transceivers (MGTs), 11,088 logic cells, 44 18×18-bit multipliers, and 44 Block SelectRAM+ modules (792 Kb total). It operates at up to 350 MHz CPU frequency and supports 3.125 Gb/s serial transceiver data rates in the -6 speed grade. Used in high-speed telecom and networking line cards requiring embedded processing and serial interconnect.

For engineers reviewing the XC2VP7-6FF672I datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed RocketIO channel count, PowerPC 405 integration, FF672 flip-chip BGA package compatibility, DCI-enabled I/O support, and DCM-based clock management for deterministic timing closure.

Technical Context

The XC2VP7-6FF672I implements a hardened PowerPC 405 core with 16 KB instruction and 16 KB data caches, MMU, and CoreConnect bus interface - enabling real-time embedded software execution alongside programmable logic. Its eight RocketIO transceivers operate at up to 3.125 Gb/s per channel with 8B/10B encoding, on-chip 50 Ω termination, and channel bonding support.

Configurable logic resources include 4,928 CLB slices, distributed SelectRAM+, and dedicated 18×18-bit multipliers optimized for DSP filtering. Clocking uses twelve Digital Clock Manager (DCM) modules for phase shifting, multiplication/division, and deskew - all synchronized to the 1.5 V core supply and 2.5 V auxiliary rails.

Key Specifications

Pinout & Package

XC2VP7-6FF672I is housed in a 672-pin flip-chip fine-pitch BGA (FF672) package with 1.0 mm pitch, optimized for thermal performance and signal integrity in high-density PCB layouts. Pin definitions follow Xilinx DS083 Module 4, with dedicated banks for VCCINT (1.5 V), VCCAUX (2.5 V), VCCO (1.5/1.8/2.5/3.3 V), differential pairs, JTAG, and configuration signals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP7-6FF672I, the XC2VP7-5FF672I trades serial bandwidth and CPU speed for lower power and cost, while the XC2VP20-6FF672I scales logic, memory, and processing capacity without changing PCB layout - making both viable alternatives depending on performance headroom and system partitioning requirements.

Availability

XC2VP7-6FF672I is available at Aetrix Electronics and suitable for wireless infrastructure, optical transport, industrial video, and defense radar applications requiring stable component supply across extended product lifecycles.

Supply support for XC2VP7-6FF672I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and IP-based platform solutions for high-performance digital systems.

The Virtex-II Pro family, including XC2VP7-6FF672I, was designed to integrate hard processor cores and high-speed serial transceivers into SRAM-based FPGAs - targeting telecom, aerospace, and high-end embedded applications demanding both software flexibility and hardware acceleration.

FAQ

What is the maximum operating frequency of the PowerPC 405 core in XC2VP7-6FF672I?

The XC2VP7-6FF672I PowerPC 405 core operates at up to 350 MHz in the -6 speed grade under commercial temperature conditions. This frequency assumes proper decoupling, thermal management, and adherence to Xilinx's recommended PCB layout guidelines for the FF672 package. The actual achievable clock rate depends on cache hit rate, bus contention, and peripheral interface timing constraints within the user design.

Does XC2VP7-6FF672I support 10 Gigabit Ethernet (10GbE) physical layer interfacing?

Yes, XC2VP7-6FF672I supports 10GbE via its RocketIO transceivers, which comply with XAUI (10 Gigabit Attachment Unit Interface) at 3.125 Gb/s per lane. Four lanes can be bonded to implement full 10GbE MAC-to-PHY connectivity. The device includes built-in 8B/10B encoding/decoding and elastic buffers required for XAUI alignment, eliminating need for external serializer/deserializer chips.

What I/O standards are supported by XC2VP7-6FF672I with on-chip termination?

XC2VP7-6FF672I supports Digitally Controlled Impedance (DCI) for on-chip series or parallel termination across LVCMOS (1.5 V, 1.8 V, 2.5 V, 3.3 V), SSTL, and HSTL single-ended I/O standards. For differential standards, it provides on-chip 50 Ω termination for LVDS, BLVDS, ULVDS, and LDT - verified in DS083 Module 1 Section "SelectIO-Ultra Technology" and Module 2 "Input/Output Blocks".

Is XC2VP7-6FF672I pin-compatible with other Virtex-II Pro devices in the FF672 package?

No, XC2VP7-6FF672I is not pin-compatible with higher-density Virtex-II Pro devices (e.g., XC2VP20-6FF672I) despite sharing the FF672 package. While pin count and mechanical footprint match, I/O bank assignments, voltage rail allocations, and RocketIO pin mappings differ between device densities. Xilinx specifies distinct pinout tables per device in DS083 Module 4, confirming no universal pin mapping across the family.

What configuration modes does XC2VP7-6FF672I support?

XC2VP7-6FF672I supports five configuration modes: Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 Boundary-Scan. Configuration is initiated via PROG_B, with mode selected by M0–M2 pins. Bitstream encryption using Triple-DES is optional, and readback capability allows verification of configuration memory, flip-flops, and Block SelectRAM+ contents post-configuration.