AMD XC2VP7-6FF896I

Overview

XC2VP7-6FF896I from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, eight RocketIO multi-gigabit transceivers (3.125 Gb/s), 11,088 logic cells, four Digital Clock Managers (DCMs), and 396 user I/Os in an FF896 flip-chip BGA package. It delivers embedded processing, high-speed serial connectivity, and programmable logic for telecom backplane interfaces, wireless baseband processing, and network packet inspection systems.

For engineers reviewing the XC2VP7-6FF896I datasheet, pinout, applications, or equivalent options, key selection criteria include verified RocketIO transceiver performance at -6 speed grade, PowerPC 405 clocking constraints up to 350 MHz, DCI-enabled I/O termination compatibility with LVDS/HSTL/SSTL standards, and FF896 package thermal and routing requirements.

Technical Context

The XC2VP7-6FF896I implements a hardened PowerPC 405 core with 16 KB instruction and 16 KB data caches, MMU support, and CoreConnect bus interface - all operating at up to 350 MHz under -6 industrial speed grade. Its eight RocketIO transceivers provide full-duplex SERDES operation from 600 Mb/s to 3.125 Gb/s with 8B/10B encoding, on-chip 50 Ω/75 Ω termination, and per-channel loopback modes.

FPGA fabric includes 4,928 CLB slices, 44 dedicated 18×18 multipliers, 44 Block SelectRAM+ modules (18 Kb each), and twelve global clock networks fed by four DCMs supporting phase shifting, frequency synthesis, and deskew. I/O subsystem supports 22 single-ended and 10 differential standards via SelectIO-Ultra with Digitally Controlled Impedance (DCI) and built-in DDR register support.

Key Specifications

Pinout & Package

XC2VP7-6FF896I is housed in a 31 mm × 31 mm FF896 flip-chip fine-pitch BGA package with 1.0 mm ball pitch, optimized for thermal dissipation and signal integrity in high-speed serial applications. The package supports 396 user I/Os plus dedicated configuration, clock, JTAG, and power pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.

Compared with XC2VP7-6FF896I, XC2VP7-7FF896C enables higher processor clocking but lacks industrial temperature qualification, while XC2VP4-6FF672I reduces I/O count and transceiver count to fit compact form factors - both require PCB redesign due to different package footprints and thermal profiles.

Availability

XC2VP7-6FF896I is available at Aetrix Electronics and suitable for telecom infrastructure, defense electronics, and industrial video analytics requiring stable component supply across extended product lifecycles.

Supply support for XC2VP7-6FF896I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGAs, adaptive SoCs, and software tools for high-performance computing, networking, and embedded systems.

The Virtex-II Pro family was designed to integrate hard processor cores and multi-gigabit transceivers into high-density FPGA fabric - enabling complete system-on-chip solutions for demanding communications and signal processing applications.

FAQ

What is the maximum operating frequency of the PowerPC 405 core in XC2VP7-6FF896I?

The PowerPC 405 core in XC2VP7-6FF896I is rated for up to 350 MHz under the -6 industrial speed grade. This frequency assumes proper decoupling, thermal management, and adherence to XAPP755 guidelines when operating above 300 MHz in dual-processor configurations. The XC2VP7-6FF896I datasheet specifies this limit in Table 4 of DS083 (v5.0), and actual achievable frequency depends on design-specific timing closure and voltage stability.

Does XC2VP7-6FF896I support 8B/10B encoding in its RocketIO transceivers?

Yes, XC2VP7-6FF896I supports 8B/10B encoding in all eight RocketIO transceivers, as confirmed in Module 2 of DS083 (v5.0). This encoding is mandatory for Fibre Channel, Gigabit Ethernet, and XAUI compliance. The encoding/decoding logic is embedded within each RocketIO block and configurable via FPGA configuration bitstream - no external IC is required for protocol framing.

What I/O standards are supported by XC2VP7-6FF896I with on-chip termination?

XC2VP7-6FF896I supports on-chip termination for LVDS, BLVDS, ULVDS, and LDT differential standards, plus all single-ended standards (LVCMOS, LVTTL, SSTL, HSTL, GTL) via Digitally Controlled Impedance (DCI). DCI automatically calibrates termination resistance between 50 Ω and 130 Ω per I/O bank, eliminating external resistors and improving signal integrity across temperature and voltage variations.

Can XC2VP7-6FF896I be configured via JTAG, and what are the supported modes?

Yes, XC2VP7-6FF896I supports IEEE 1149.1 JTAG configuration in Boundary-Scan mode per IEEE 1532. It also supports slave-serial, master-serial, slave SelectMAP, and master SelectMAP modes. JTAG enables in-system programming, readback verification, and ChipScope ILA debugging - all accessible through the TCK/TMS/TDI/TDO pins defined in the FF896 pinout table of DS083.

Is XC2VP7-6FF896I recommended for new designs, and what is its lifecycle status?

No, XC2VP7-6FF896I is marked "Product Not Recommended For New Designs" per DS083 (v5.0) cover page and Module 1. It remains available for legacy program support and obsolescence management, but Xilinx recommends Virtex-5 or newer families for new development. Aetrix Electronics maintains active inventory and provides long-term supply assurance for existing production programs using XC2VP7-6FF896I.