AMD XC2VP7-6FFG672C

Overview

XC2VP7-6FFG672C from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, eight RocketIO multi-gigabit transceivers (MGTs), 11,088 logic cells, 44 18×18-bit multipliers, and 396 user I/Os in a 672-pin flip-chip fine-pitch BGA package. It operates at up to 350 MHz CPU frequency and supports 3.125 Gb/s per transceiver channel for telecom and networking applications.

For engineers reviewing the XC2VP7-6FFG672C datasheet, pinout, applications, or equivalent options, key selection criteria include embedded processor capability, transceiver count and speed grade (-6), I/O count and DCI support, and compatibility with legacy Xilinx design tools and IP cores.

Technical Context

The XC2VP7-6FFG672C implements a hybrid architecture combining programmable logic fabric with hard IP blocks: a single IBM PowerPC 405 core running at up to 350 MHz (speed grade -6), eight RocketIO transceivers supporting 600 Mb/s to 3.125 Gb/s full-duplex operation, and twelve Digital Clock Manager (DCM) modules for clock synthesis, phase shifting, and deskew.

Its logic fabric includes Configurable Logic Blocks (CLBs) with dual 4-input LUTs and flip-flops, 18 Kb Block SelectRAM+ memory modules (44 total), and dedicated 18×18-bit signed multipliers. I/O subsystem features SelectIO-Ultra with Digitally Controlled Impedance (DCI), supporting LVDS, SSTL, HSTL, and PCI-X standards with on-chip termination.

Key Specifications

Pinout & Package

XC2VP7-6FFG672C uses the FF672 flip-chip fine-pitch BGA package (27 mm × 27 mm, 1.0 mm pitch), with 672 solder balls arranged in a 26×26 array excluding corner blanks. The package supports thermal dissipation via central thermal pad and provides dedicated VCCINT (1.5 V), VCCAUX (2.5 V), and multiple VCCO banks for mixed-voltage I/O operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XC2VP7-6FFG672C, the -7 variant delivers higher guaranteed clock frequencies but requires stricter power delivery and thermal management, while the XC2VP4-6FFG672C offers identical footprint and toolchain compatibility at lower logic density and transceiver count-enabling scalable design reuse across product tiers.

Availability

XC2VP7-6FFG672C is available at Aetrix Electronics and suitable for wireless infrastructure, optical transport, industrial video, and avionics applications requiring stable component supply and long-term obsolescence mitigation.

Supply support for XC2VP7-6FFG672C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures with embedded processors and high-speed transceivers.

The Virtex-II Pro family was designed for high-performance system integration in telecommunications and networking, combining FPGA flexibility with hardened PowerPC and RocketIO IP to reduce system-level complexity and bill-of-materials cost.

FAQ

What is the maximum guaranteed operating frequency of the PowerPC 405 core in XC2VP7-6FFG672C?

The XC2VP7-6FFG672C PowerPC 405 core is rated for up to 350 MHz operation under commercial conditions (speed grade -6). This frequency is validated across voltage (1.425–1.575 V VCCINT) and temperature (0–85°C) ranges per DS083 v5.0. The XC2VP7-6FFG672C achieves this using static timing analysis with worst-case process corners and includes margin for on-chip clock skew and routing delay.

Does XC2VP7-6FFG672C support JTAG boundary-scan testing?

Yes, XC2VP7-6FFG672C fully complies with IEEE 1149.1 and supports boundary-scan testing via dedicated TCK, TMS, TDI, and TDO pins. The device implements standard instructions (EXTEST, INTEST, SAMPLE, PRELOAD) and supports real-time I/O pin state capture and drive control. This capability is documented in Module 1 of DS083 and verified in Xilinx ISE toolchain diagnostics for XC2VP7-6FFG672C.

Can XC2VP7-6FFG672C be configured via SPI flash memory?

No, XC2VP7-6FFG672C does not support native SPI flash configuration. It supports Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 (JTAG) modes only. SPI flash interfacing requires an external microcontroller or CPLD to emulate SelectMAP or serial configuration protocol-this is confirmed in DS083 Section "Configuration" and XAPP388 application note for XC2VP7-6FFG672C.

What I/O standards are supported by XC2VP7-6FFG672C with on-chip termination?

XC2VP7-6FFG672C supports on-chip termination for LVDS, LVDS Extended, ULVDS, LDT, and all LVCMOS variants (1.5 V, 1.8 V, 2.5 V, 3.3 V) via Digitally Controlled Impedance (DCI). Termination values are programmable to 50 Ω or 75 Ω for differential standards and matched to line impedance for single-ended I/O. This is specified in DS083 Module 1 Table on IOB features and validated in Xilinx UG070 for XC2VP7-6FFG672C.

Is XC2VP7-6FFG672C pin-compatible with other Virtex-II Pro devices in FF672 package?

XC2VP7-6FFG672C shares the FF672 package footprint and ball map with XC2VP20-6FFG672C and XC2VP4-6FFG672C, but I/O function assignment differs due to varying resource counts (e.g., RocketIO placement, DCM locations, and I/O bank allocations). Pin compatibility is limited to mechanical fit-not electrical or logical equivalence-as confirmed in DS083 Table 3 and Xilinx Packaging Specification for XC2VP7-6FFG672C.