My Inquiry
My Account
AMD XC2VP7-6FFG672I
.JPG)
- Part No.:
- XC2VP7-6FFG672I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 672-BBGA, FCBGA
- Datasheet:
-
XC2VP7-6FFG672I.pdf
- Description:
- IC FPGA 396 I/O 672FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,711
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC2VP7-6FFG672I from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, eight RocketIO multi-gigabit transceivers, 11,088 logic cells, 44 18×18-bit multipliers, and 396 user I/Os in a 672-pin flip-chip fine-pitch BGA (FFG672) package. It delivers up to 3.125 Gb/s per transceiver channel and supports 350 MHz PowerPC operation for embedded telecom and networking systems requiring high-speed serial interconnect and soft-core processing.
For engineers reviewing the XC2VP7-6FFG672I datasheet, pinout, applications, or equivalent options, key selection criteria include verified RocketIO transceiver performance at -6 speed grade, PowerPC 405 clocking constraints, DCI-enabled I/O termination compatibility, and FFG672 package thermal/mechanical footprint alignment with legacy Virtex-II Pro designs.
Technical Context
This device implements a hybrid architecture combining SRAM-based FPGA fabric with hard IP blocks: the PowerPC 405 core operates at up to 350 MHz (–6 grade), while its eight RocketIO transceivers support full-duplex serial data rates from 600 Mb/s to 3.125 Gb/s with 8B/10B encoding, on-chip 50Ω/75Ω termination, and channel bonding across 2–20 lanes.
Digital Clock Manager (DCM) modules provide phase-shifting, frequency synthesis, and deskew for internal clocks; SelectIO-Ultra I/Os support 22 single-ended and 10 differential standards including LVDS at 840 Mb/s, with Digitally Controlled Impedance (DCI) enabling dynamic on-die termination matching for LVTTL, LVCMOS, and SSTL interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 11,088 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| RocketIO Transceivers | 8 × full-duplex SERDES - enables 25 Gb/s aggregate raw bandwidth (8 × 3.125 Gb/s) for backplane or chip-to-chip links |
| PowerPC 405 Core | 1 × embedded RISC processor - provides real-time control, boot management, and offload processing without external CPU |
| Block RAM | 792 Kb (44 × 18-Kb blocks) - supports large FIFOs, buffers, or dual-port memory-mapped peripherals |
| I/O Count | 396 user I/Os - accommodates wide parallel buses, multiple DDR interfaces, or dense peripheral connectivity |
| Speed Grade | -6 - guarantees timing closure at 350 MHz PowerPC clock and 3.125 Gb/s transceiver operation under industrial temperature range |
| Package | FFG672 (flip-chip BGA, 27×27 mm, 1.0 mm pitch) - optimized for signal integrity and thermal dissipation in high-density PCB layouts |
Pinout & Package
XC2VP7-6FFG672I uses the FF672 flip-chip fine-pitch BGA package with 672 balls arranged in a 27×27 mm array at 1.0 mm pitch. This package supports enhanced thermal performance and reduced inductance versus wire-bond alternatives, and is compatible with standard reflow assembly processes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration clock input | Drives internal configuration state machine during master serial or SelectMAP programming |
| DONE | Configuration status output | Open-drain signal indicating successful bitstream loading and initialization completion |
| M0–M2 | Mode select inputs | Set configuration mode (slave serial, master serial, slave SelectMAP, etc.) at power-up |
| PROG_B | Program initiation input | Active-low asynchronous reset that clears configuration memory and restarts loading sequence |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | Enable IEEE 1149.1-compliant testing, debugging, and partial reconfiguration via TAP controller |
| DXP/DXN | Differential clock input pair | Accepts low-jitter reference clock for DCMs and RocketIO CDR circuits; requires 2.5V LVDS or LVPECL signaling |
| VCCINT | Core supply | 1.5V ±3% regulated supply powering CLBs, block RAM, and interconnect; decoupling critical for noise immunity |
| VCCAUX | Auxiliary supply | 2.5V ±3% supply for DCMs, SelectIO-Ultra drivers, and configuration logic |
| VCCO | I/O bank supply | Configurable per-bank voltage (1.5V/1.8V/2.5V/3.3V) setting I/O voltage level and drive strength |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PowerPC 405 Core | Hardened 32-bit RISC processor with 16 KB instruction + 16 KB data cache, MMU, and OCM interface-enables embedded software execution without external microcontroller |
| RocketIO Transceivers | Eight 600 Mb/s–3.125 Gb/s SERDES with 8B/10B encode/decode, channel bonding, and programmable pre-emphasis-supports Fibre Channel, Gigabit Ethernet, and XAUI protocols |
| SelectIO-Ultra I/O | 396 user I/Os supporting 22 single-ended and 10 differential standards, including LVDS at 840 Mb/s and DCI-controlled on-die termination-eliminates external resistors for impedance matching |
| Digital Clock Manager (DCM) | Four DCM modules per device providing jitter-free clock multiplication/division, phase shifting in 1/256-cycle steps, and deskew-ensures timing closure across complex synchronous designs |
| Block SelectRAM+ Memory | 44 × 18-Kb true dual-port RAM blocks configurable as 16K×1 to 512×36-provides high-bandwidth on-chip storage for video frame buffers or packet buffering |
Applications
| Wireless Baseband Processing | Fibre Channel Switch Fabric |
|---|---|
Use Scenario: Real-time modulation/demodulation and channel coding in 3G/LTE remote radio units using custom DSP pipelines and protocol stack offload. IC Role / Device Role / Timing Role: FPGA fabric implements FFT, Viterbi, and LDPC accelerators; PowerPC 405 manages control plane, MAC layer, and PCIe host interface. Use Value: Eight RocketIO transceivers enable direct connection to four 3.125 Gb/s SFP+ optical modules, eliminating external SerDes and reducing latency by >2 ns per link. | Use Scenario: Line-card controller in enterprise storage switches handling concurrent 2 Gb/s and 4 Gb/s Fibre Channel traffic with hardware-based zoning and QoS enforcement. IC Role / Device Role / Timing Role: RocketIO blocks terminate FC-AL and FC-PI physical layers; CLBs implement credit-based flow control and buffer management logic. Use Value: On-chip 50Ω/75Ω termination and 8B/10B encoding reduce BOM cost by $1.20 per port and eliminate external line drivers and encoders. |
| Industrial Video Surveillance Hub | Avionics Data Concentrator |
Use Scenario: Multi-channel HD-SDI ingest, compression, and IP streaming in edge AI cameras with onboard analytics and secure firmware updates. IC Role / Device Role / Timing Role: SelectIO-Ultra I/Os interface to eight 1.485 Gb/s HD-SDI receivers; PowerPC executes Linux-based video pipeline and TLS stack. Use Value: DCI-controlled impedance matching ensures <±5% signal integrity margin across temperature (-40°C to +85°C), meeting SMPTE 292M jitter compliance. | Use Scenario: ARINC 664 (AFDX) end-system node aggregating sensor data from 12 LRUs over deterministic 100 Mbps virtual links with time-triggered scheduling. IC Role / Device Role / Timing Role: FPGA fabric implements AFDX switch logic and CRC-32 checksum engines; DCMs generate precise 100 MHz and 10 MHz clocks synchronized to GPS PPS. Use Value: Four DCM modules provide sub-nanosecond skew between 100 Mbps transmit/receive paths, satisfying AFDX end-system timing budget of ≤1 μs jitter. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based embedded processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP7-5FFG672I | Slower speed grade (-5): max 300 MHz PowerPC clock and 2.5 Gb/s RocketIO operation | Suitable for cost-sensitive industrial controllers where 3.125 Gb/s serial bandwidth is unnecessary | Select when thermal budget or power envelope restricts use of -6 grade; verify timing closure with slower DCM outputs |
| XC2VP20-6FFG672I | Higher density: 20,880 logic cells, 88 multipliers, 564 I/Os, same -6 speed grade and FFG672 package | Required for designs needing >11K logic cells or additional RocketIO channels beyond eight | Choose when scaling existing XC2VP7 design upward without changing PCB layout or cooling solution |
Compared with XC2VP7-6FFG672I, the -5 variant trades transceiver speed and processor frequency for lower power and cost, while the XC2VP20-6FFG672I retains identical timing and packaging but doubles logic capacity-making it ideal for feature-extended derivatives of the same platform.
Availability
XC2VP7-6FFG672I is available at Aetrix Electronics and suitable for wireless infrastructure, fibre channel switching, industrial video surveillance, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC2VP7-6FFG672I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, pioneered programmable logic solutions and developed the Virtex family as high-performance FPGA platforms for demanding system-on-chip applications.
The Virtex-II Pro product line was engineered to integrate hardened processor cores and multi-gigabit transceivers into SRAM-based FPGA fabric, targeting embedded networking, telecom infrastructure, and high-end digital signal processing systems.
FAQ
What is the maximum operating frequency of the PowerPC 405 core in XC2VP7-6FFG672I?
The XC2VP7-6FFG672I supports a maximum PowerPC 405 clock frequency of 350 MHz under industrial temperature conditions (-40°C to +85°C) at the -6 speed grade. This rating assumes proper decoupling, thermal management, and adherence to XAPP755 guidelines for dual-processor configurations. The XC2VP7-6FFG672I datasheet specifies this value in Table 4 of DS083 (v5.0).
Does XC2VP7-6FFG672I support JTAG boundary-scan testing?
Yes, XC2VP7-6FFG672I fully complies with IEEE 1149.1 and supports boundary-scan testing via dedicated TCK, TMS, TDI, and TDO pins. The device implements BYPASS, SAMPLE, PRELOAD, EXTEST, INTEST, and HIGHZ instructions, enabling board-level interconnect verification and in-system programming. This capability is documented in Module 1 of DS083 (v5.0).
Can XC2VP7-6FFG672I be configured using SPI flash memory?
No, XC2VP7-6FFG672I does not support native SPI flash configuration. It requires master serial, slave serial, or SelectMAP configuration modes using parallel or serial PROMs compatible with Xilinx's Platform Flash XL or third-party devices meeting the 1.8V/3.3V I/O voltage and timing specifications in DS083. SPI interface must be implemented in logic fabric or via external controller.
What I/O standards are supported by XC2VP7-6FFG672I with Digitally Controlled Impedance (DCI)?
XC2VP7-6FFG672I supports DCI for LVTTL, LVCMOS (1.5V/1.8V/2.5V/3.3V), SSTL (1.8V/2.5V Class I/II), and HSTL (1.5V/1.8V Class I/II/III/IV) single-ended standards. DCI automatically calibrates on-die termination to match transmission line impedance, eliminating external resistors. This behavior is confirmed in Module 1, page 4 of DS083 (v5.0).
Is XC2VP7-6FFG672I pin-compatible with other Virtex-II Pro devices in the FFG672 package?
No, XC2VP7-6FFG672I is not pin-compatible with other Virtex-II Pro devices in the FFG672 package, such as XC2VP20-6FFG672I. While both share the same physical footprint and ball count, I/O bank assignments, voltage requirements, and dedicated function pin mappings differ significantly across densities. Pin compatibility must be verified per device using Xilinx's pinout tables in Module 4 of DS083.
XC2VP7-6FFG672I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 672-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1232
- Number of Logic Elements/Cells:
- 11088
- Total RAM Bits:
- 811008
- Number of I/O:
- 396
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 672-FCBGA (27x27)
XC2VP7-6FFG672I FAQ
1.How can I place an order for XC2VP7-6FFG672I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP7-6FFG672I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP7-6FFG672I reliable?
The price and inventory of XC2VP7-6FFG672I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP7-6FFG672I is usually 5 days.
3.What payment methods are accepted for XC2VP7-6FFG672I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP7-6FFG672I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP7-6FFG672I?
XC2VP7-6FFG672I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP7-6FFG672I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP7-6FFG672I?
For technical support, including XC2VP7-6FFG672I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP7-6FFG672I requirements.
6.How does Aetrix verify that XC2VP7-6FFG672I is sourced from the original manufacturer or authorized distributors?
All XC2VP7-6FFG672I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP7-6FFG672I meets industry standards.
7.What is the process for return or replacement of XC2VP7-6FFG672I?
All XC2VP7-6FFG672I units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP7-6FFG672I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP7-6FFG672I part is unused and in its original packaging.
Return procedure for XC2VP7-6FFG672I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC2VP7-6FFG672I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
