AMD XC2VP7-6FFG896C

Overview

XC2VP7-6FFG896C from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, eight RocketIO multi-gigabit transceivers (MGTs), 11,088 logic cells, 44 18×18-bit multipliers, and 396 user I/Os in an 896-pin flip-chip fine-pitch BGA package. It delivers up to 3.125 Gb/s per transceiver channel and supports 350 MHz PowerPC operation for embedded networking and telecom baseband processing.

For engineers reviewing the XC2VP7-6FFG896C datasheet, pinout, applications, or equivalent options, this device is evaluated for high-speed serial interconnect design, embedded soft-core integration, clock domain crossing with DCM-based phase alignment, and I/O interface synthesis across LVDS, SSTL, and HSTL standards.

Technical Context

The XC2VP7-6FFG896C implements a hybrid architecture combining programmable logic fabric with hard IP blocks: a single 350 MHz PowerPC 405 core with 16 KB instruction and 16 KB data caches, eight RocketIO transceivers supporting 600 Mb/s–3.125 Gb/s full-duplex SERDES, and twelve Digital Clock Manager (DCM) modules enabling precise deskew, multiplication, division, and ±180° phase shifting.

Its logic fabric includes 4,928 CLB slices, 44 Block SelectRAM+ modules (each 18 Kb), and distributed RAM resources totaling 1,378 Kb. I/O subsystem features SelectIO-Ultra with Digitally Controlled Impedance (DCI), on-chip differential termination for LVDS/ULVDS/LDT, and support for 22 single-ended and 10 differential standards including PCI-X 133 MHz and DDR memory interfaces.

Key Specifications

Pinout & Package

XC2VP7-6FFG896C uses the FF896 flip-chip fine-pitch BGA package (31 mm × 31 mm, 1.0 mm pitch), with 896 solder balls arranged in a 32×32 array excluding corner blanks. The package supports thermal dissipation via internal copper pillars and exposes all eight RocketIO transceiver banks, twelve DCM clock inputs/outputs, and 396 user-configurable I/Os across 16 I/O banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP7-6FFG896C, the -7 speed grade offers higher guaranteed clock rates but restricts industrial temperature use, while the XC2VP20-6FF896C retains pin compatibility and transceiver count but doubles logic resources and adds a second PowerPC core-enabling asymmetric multiprocessing without redesigning PCB interconnects.

Availability

XC2VP7-6FFG896C is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging systems, and defense signal processing requiring stable component supply across extended product lifecycles.

Supply support for XC2VP7-6FFG896C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family for high-performance system-on-chip applications requiring logic, memory, and processor integration.

The Virtex-II Pro product line was designed to unify programmable logic with embedded PowerPC processing and multi-gigabit serial I/O-targeting applications where ASIC-level performance meets FPGA-level flexibility in networking, aerospace, and instrumentation.

FAQ

What is the maximum guaranteed operating frequency of the PowerPC 405 core in XC2VP7-6FFG896C?

The XC2VP7-6FFG896C is rated for 350 MHz PowerPC 405 operation under commercial temperature conditions (0°C to 85°C). This speed grade (-6) is validated per DS083 v5.0 specifications and applies to both single- and dual-processor configurations within the XC2VP7 family. The XC2VP7-6FFG896C does not support 400 MHz operation-that requires the -7 speed grade variant.

Does XC2VP7-6FFG896C support partial reconfiguration?

Yes, XC2VP7-6FFG896C supports partial reconfiguration through its SRAM-based configuration architecture and IEEE 1532-compliant boundary-scan interface. Users can dynamically reload specific logic regions without resetting the entire device or interrupting PowerPC execution-enabling runtime adaptation in protocols like dynamic bandwidth allocation or multi-standard radio front-ends.

What I/O standards are supported by the SelectIO-Ultra blocks in XC2VP7-6FFG896C?

XC2VP7-6FFG896C supports 22 single-ended standards-including LVCMOS (1.5V/1.8V/2.5V/3.3V), LVTTL, PCI, PCI-X 133 MHz, SSTL-2 Class I/II, and HSTL Class I/II/III/IV-and 10 differential standards such as LVDS, BLVDS, ULVDS, LDT, and LVPECL. All single-ended I/Os benefit from Digitally Controlled Impedance (DCI) for automatic on-die termination calibration.

Is XC2VP7-6FFG896C compatible with Xilinx ISE 14.7 design tools?

No-XC2VP7-6FFG896C requires Xilinx ISE Design Suite versions 6.3 through 10.1, as documented in DS083 and the ISE release notes. ISE 14.7 dropped support for Virtex-II Pro devices; attempting synthesis or place-and-route with newer tools will fail. Legacy ISE 10.1 remains the final supported version and is available through AMD's archived software portal.

What is the purpose of the VRP and VRN pins on XC2VP7-6FFG896C?

The VRP and VRN pins on XC2VP7-6FFG896C provide reference voltage inputs for the Digitally Controlled Impedance (DCI) circuitry. When connected to VCCO or ground through precision resistors, they calibrate internal termination resistors to match transmission line impedance-enabling automatic 25–75 Ω matching for single-ended I/O standards without external components.