My Inquiry
My Account
AMD XC2VP7-6FG456I
- Part No.:
- XC2VP7-6FG456I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 456-BBGA
- Datasheet:
-
XC2VP7-6FG456I.pdf
- Description:
- IC FPGA 248 I/O 456FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,936
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC2VP7-6FG456I from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, eight RocketIO multi-gigabit transceivers (2.5 Gb/s max per channel), 11,088 logic cells, and 396 user I/Os in a 456-pin fine-pitch wire-bond BGA package. It delivers embedded processing, high-speed serial interconnect, and programmable logic for telecom backplane interfaces, wireless baseband processing, and industrial protocol gateways.
For engineers reviewing the XC2VP7-6FG456I datasheet, pinout, applications, or equivalent options, this device supports 3.3V/2.5V/1.8V/1.5V SelectIO-Ultra I/O standards, on-chip digitally controlled impedance (DCI), dual-port Block SelectRAM+ memory, and DCM-based clock management - critical for deterministic timing in SERDES-linked systems.
Technical Context
The XC2VP7-6FG456I implements a hard PowerPC 405 core operating up to 350 MHz (–6 speed grade), with 16 KB instruction and 16 KB data caches, MMU, and CoreConnect bus interface. Its eight RocketIO transceivers support full-duplex operation at 600 Mb/s to 2.5 Gb/s with 8B/10B encoding, channel bonding, and programmable pre-emphasis.
Logic fabric comprises Configurable Logic Blocks (CLBs) with dual 4-input LUTs per slice, distributed RAM, 18×18-bit multipliers, and Active Interconnect routing. Clocking uses up to twelve Digital Clock Managers (DCMs) for deskew, multiplication, division, and ±180° phase shifting - all synchronized to 1.5V VCCINT and 2.5V VCCAUX supplies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 11,088 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| PowerPC 405 Core | 1 × embedded 32-bit RISC processor @ 350 MHz - enables real-time control, boot code execution, and soft-core co-processing |
| RocketIO Transceivers | 8 × multi-gigabit SERDES @ 2.5 Gb/s max - supports XAUI, Fibre Channel, and Gigabit Ethernet physical layer interfacing |
| User I/O Pads | 396 - provides flexible board-level connectivity with LVDS, SSTL, HSTL, PCI-X, and DCI-terminated single-ended standards |
| Block SelectRAM+ | 44 × 18-Kb dual-port RAM blocks - delivers 792 Kb embedded memory for FIFOs, buffers, and lookup tables without external SRAM |
| Digital Clock Managers | 4 × DCM modules - enable jitter-tolerant clock synthesis, phase alignment across domains, and dynamic frequency scaling |
| Package | FG456 - 23×23 mm fine-pitch wire-bond BGA with 1.0 mm pitch, industrial temperature range (–40°C to +100°C) |
Pinout & Package
XC2VP7-6FG456I uses the FG456 wire-bond fine-pitch BGA package: 456 balls, 23 mm × 23 mm body, 1.0 mm pitch, industrial temperature grade (I). Pin definitions follow Xilinx DS083 Module 4 - pinout tables specify ball assignments for configuration (M0/M1/M2, CCLK, DONE), JTAG (TCK/TDI/TDO/TMS), PowerPC debug (TRST_B, DBGRQ, DBGACK), RocketIO differential pairs (RXN/RXP, TXN/TXP), and user-selectable I/O banks with independent VCCO and VREF.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration clock input | Drives internal configuration state machine during master/slave serial or SelectMAP loading |
| DONE | Configuration status output | Open-drain signal indicating successful bitstream load and initialization completion |
| M0/M1/M2 | Mode select inputs | Set configuration mode (slave-serial, master-serial, slave SelectMAP, etc.) at power-up |
| TCK/TDI/TDO/TMS | JTAG boundary-scan interface | Enable IEEE 1149.1-compliant testing, programming, and debug access to internal logic and I/O |
| RXP0/RXN0 | RocketIO receiver differential pair | Accepts AC-coupled serial data at up to 2.5 Gb/s; supports automatic lock-to-reference and equalization |
| TXP0/TXN0 | RocketIO transmitter differential pair | Drives AC-coupled serial output with programmable swing (400–1200 mVpp) and pre-emphasis (0–500%) |
| VCCINT | Core supply | 1.5V ±3% supply powering CLBs, DCMs, and PowerPC core; requires low-noise regulation |
| VCCAUX | Auxiliary supply | 2.5V ±3% supply for configuration logic, DCMs, RocketIO analog circuitry, and JTAG TAP controller |
Key Features
| Feature | Design Value |
|---|---|
| Embedded PowerPC 405 | Hard processor core with 16 KB instruction cache, 16 KB data cache, MMU, and CoreConnect interface - eliminates need for external microcontroller in system-on-chip designs |
| RocketIO Transceivers | Eight 2.5 Gb/s SERDES channels with 8B/10B encoding, channel bonding, and elastic buffers - enables deterministic latency for multi-lane protocols like XAUI |
| SelectIO-Ultra I/O | Support for 22 single-ended (LVCMOS, SSTL, HSTL, PCI-X) and 10 differential (LVDS, BLVDS, LVPECL) standards - simplifies interface to memory, PHYs, and legacy buses |
| Digitally Controlled Impedance (DCI) | On-die termination for single-ended I/O standards using internal 40–60 Ω resistors - removes external termination components and improves signal integrity |
| Block SelectRAM+ Memory | 44 × 18-Kb true dual-port RAM blocks configurable as 16K×1 to 512×36 - supports simultaneous read/write operations for video frame buffers or packet buffering |
| Digital Clock Manager (DCM) | Four fully digital DCMs providing zero-delay buffer, frequency synthesis (×2 to ×32), and ±180° phase shift in 1/256-cycle steps - ensures precise clock domain crossing in high-speed designs |
Applications
| Telecom Backplane Interface | Wireless Baseband Processing |
|---|---|
Use Scenario: Aggregating multiple 1.25 Gb/s SONET/SDH streams into a 10 Gb/s XAUI interface for line-card switching. IC Role / Device Role / Timing Role: XC2VP7-6FG456I acts as protocol mapper and serializer/deserializer hub, synchronizing clocks across four RocketIO lanes using DCM-based deskew. Use Value: Eliminates discrete PHYs and clock cleaners; reduces board area by 40% versus ASIC + FPGA solutions while supporting field-upgradable firmware. |
Use Scenario: Real-time FFT and channel estimation in LTE femtocell baseband units with adaptive modulation. IC Role / Device Role / Timing Role: XC2VP7-6FG456I executes DSP kernels in programmable logic while the PowerPC 405 manages RRC layer, MAC scheduling, and PCIe host interface. Use Value: Achieves 200+ million MAC operations/sec with <5 µs interrupt latency - meets 3GPP subframe timing constraints without external DSP. |
| Industrial Protocol Gateway | Medical Imaging Data Acquisition |
Use Scenario: Bridging EtherCAT motion control network to Modbus TCP over Gigabit Ethernet in PLC backplanes. IC Role / Device Role / Timing Role: XC2VP7-6FG456I implements dual Ethernet MACs (via RocketIO + soft IP), real-time EtherCAT slave stack, and deterministic DMA engine. Use Value: Guarantees <1 µs jitter on EtherCAT sync pulses via DCM phase alignment and hardware timestamping - certified for IEC 61784-2 compliance. |
Use Scenario: Capturing 12-bit, 100 MSPS ultrasound ADC data and performing beamforming before PCIe transfer to host PC. IC Role / Device Role / Timing Role: XC2VP7-6FG456I serves as high-throughput acquisition engine with DDR2 memory controller, FIR filter pipeline, and PCIe endpoint logic. Use Value: Processes 1.2 GB/s raw sensor data using distributed RAM and 18×18 multipliers - enables real-time B-mode rendering at 60 fps with no frame drops. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based embedded processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP7-7FG456C | Same logic resources and transceiver count, but –7 speed grade (400 MHz PowerPC, 2.5 Gb/s RocketIO) and commercial temperature range (0°C to +85°C) | Targeted at cost-sensitive telecom equipment where industrial temp rating is unnecessary | Select when higher processor clock speed is required and ambient operating conditions remain within commercial limits |
| XC2VP4-6FG456I | Fewer resources: 6,768 logic cells, 4 RocketIO transceivers, 248 user I/Os, no PowerPC core | Suitable for simpler bridging or I/O expansion tasks without embedded processing | Choose when design scale fits lower density and PowerPC functionality is not needed - reduces BOM cost by ~35% |
Compared with XC2VP7-6FG456I, the XC2VP7-7FG456C offers higher clock performance in commercial environments but lacks industrial reliability; the XC2VP4-6FG456I trades processor integration and transceiver count for lower cost and power - making it viable only when application complexity falls below mid-range thresholds.
Availability
XC2VP7-6FG456I is available at Aetrix Electronics and suitable for telecom infrastructure, wireless base station development, and industrial automation requiring stable component supply across extended product lifecycles.
Supply support for XC2VP7-6FG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, pioneered FPGA architecture with SRAM-based reconfigurable logic, embedded processors, and high-speed transceivers - enabling customizable silicon for aerospace, communications, and industrial markets.
The Virtex-II Pro family, including XC2VP7-6FG456I, was engineered for system-level integration of processing, serial I/O, and programmable logic - targeting applications demanding both real-time control and multi-gigabit data movement in a single device.
FAQ
What is the maximum operating frequency of the PowerPC 405 core in XC2VP7-6FG456I?
The XC2VP7-6FG456I PowerPC 405 core operates at up to 350 MHz under industrial temperature conditions (–40°C to +100°C) and –6 speed grade. This frequency is validated per DS083 Table 4 and assumes proper decoupling, thermal management, and VCCINT/VCCAUX regulation. The XC2VP7-6FG456I does not support the 400 MHz mode available in –7-grade commercial variants.
Does XC2VP7-6FG456I support 8B/10B encoding in its RocketIO transceivers?
Yes, XC2VP7-6FG456I RocketIO transceivers include integrated 8B/10B encoder/decoder blocks per channel, as confirmed in DS083 Module 2. This enables native compliance with Gigabit Ethernet, Fibre Channel, and XAUI protocols without external encoding logic. The XC2VP7-6FG456I does not support 64B/66B encoding - that feature is exclusive to Virtex-II Pro X devices like XC2VPX20.
What I/O standards are supported by XC2VP7-6FG456I with on-chip termination?
XC2VP7-6FG456I supports Digitally Controlled Impedance (DCI) for single-ended standards including LVCMOS (1.5V/1.8V/2.5V/3.3V), SSTL (1.8V/2.5V), and HSTL (1.5V/1.8V), providing programmable 40–60 Ω on-die termination. Differential standards like LVDS and BLVDS use dedicated on-chip 100 Ω differential termination - all documented in DS083 Module 1 Section "SelectIO-Ultra Technology".
Can XC2VP7-6FG456I be configured via JTAG after power-up?
Yes, XC2VP7-6FG456I supports IEEE 1149.1 JTAG boundary-scan configuration in addition to serial and SelectMAP modes. The TCK/TDI/TDO/TMS pins allow full bitstream loading, readback, and debug access without requiring external configuration PROMs - verified in DS083 Module 1 "Configuration" and Module 4 pin definitions.
Is XC2VP7-6FG456I pin-compatible with other Virtex-II Pro devices in the FG456 package?
No, XC2VP7-6FG456I is not pin-compatible with other Virtex-II Pro devices in the FG456 package. While all share the same 456-ball footprint, I/O bank assignments, voltage requirements, and RocketIO pinouts differ between XC2VP2, XC2VP4, and XC2VP7 - as shown in DS083 Table 3 and Module 4 pinout tables. PCB layout must be specific to XC2VP7-6FG456I.
XC2VP7-6FG456I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 456-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1232
- Number of Logic Elements/Cells:
- 11088
- Total RAM Bits:
- 811008
- Number of I/O:
- 248
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 456-FBGA (23x23)
XC2VP7-6FG456I FAQ
1.How can I place an order for XC2VP7-6FG456I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP7-6FG456I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP7-6FG456I reliable?
The price and inventory of XC2VP7-6FG456I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP7-6FG456I is usually 5 days.
3.What payment methods are accepted for XC2VP7-6FG456I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP7-6FG456I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP7-6FG456I?
XC2VP7-6FG456I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP7-6FG456I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP7-6FG456I?
For technical support, including XC2VP7-6FG456I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP7-6FG456I requirements.
6.How does Aetrix verify that XC2VP7-6FG456I is sourced from the original manufacturer or authorized distributors?
All XC2VP7-6FG456I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP7-6FG456I meets industry standards.
7.What is the process for return or replacement of XC2VP7-6FG456I?
All XC2VP7-6FG456I units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP7-6FG456I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP7-6FG456I part is unused and in its original packaging.
Return procedure for XC2VP7-6FG456I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC2VP7-6FG456I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
