AMD XC2VP7-6FGG456C

Overview

XC2VP7-6FGG456C from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, eight RocketIO multi-gigabit transceivers (2.5 Gb/s max per channel), 11,088 logic cells, 44 18×18-bit multipliers, and 396 user I/Os in a 456-pin fine-pitch wire-bond BGA package. It targets high-speed serial interconnect, embedded processing, and reconfigurable telecom/datacom line cards.

For engineers reviewing the XC2VP7-6FGG456C datasheet, pinout, applications, or equivalent options, key selection criteria include verified RocketIO transceiver performance at -6 speed grade, PowerPC 405 clocking constraints up to 350 MHz, DCI-enabled I/O termination compatibility with LVDS/HSTL/SSTL standards, and confirmed FG456/FGG456 package pin mapping for PCB layout.

Technical Context

This device implements a hybrid architecture combining hard IP blocks (PowerPC 405 CPU, RocketIO SERDES) with programmable fabric (CLBs, Block RAM, DCMs). The PowerPC 405 operates at up to 350 MHz in -6 speed grade with 16 KB instruction and data caches, MMU, and OCM interface. The eight RocketIO transceivers support full-duplex operation from 600 Mb/s to 2.5 Gb/s with 8B/10B encoding, on-chip 50Ω/75Ω termination, and channel bonding across 2–20 links.

Digital Clock Manager (DCM) modules provide phase-shifting, frequency synthesis, and deskew for internal clocks; twelve DCMs are available. SelectIO-Ultra I/Os support 22 single-ended and 10 differential standards, including LVDS at 840 Mb/s, with Digitally Controlled Impedance (DCI) for automatic on-die termination matching.

Key Specifications

Pinout & Package

XC2VP7-6FGG456C uses a 456-ball fine-pitch wire-bond BGA (FGG456) with 1.0 mm pitch, 23 mm × 23 mm body size, and Pb-free finish. Pin definitions follow Xilinx DS083 Module 4, with dedicated banks for VCCO, VCCAUX, configuration, JTAG, RocketIO differential pairs, and PowerPC bus signals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP7-6FGG456C, the -7 variant offers higher guaranteed clock frequencies but excludes Industrial temperature support, while the XC2VP4-6FGG456C reduces logic, transceivers, and I/O count-making it viable only when PowerPC integration and eight-channel serial I/O are not required.

Availability

XC2VP7-6FGG456C is available at Aetrix Electronics and suitable for wireless infrastructure, industrial protocol gateways, medical imaging subsystems, and telecom line card designs requiring stable component supply across extended product lifecycles.

Supply support for XC2VP7-6FGG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures with integrated hard IP and system-level design tools.

The Virtex-II Pro family was designed for high-performance embedded systems requiring tightly coupled processor+FPGA integration, targeting telecom, aerospace, and instrumentation applications where reconfigurable computing meets deterministic real-time processing.

FAQ

What is the maximum guaranteed operating frequency of the PowerPC 405 core in XC2VP7-6FGG456C?

The XC2VP7-6FGG456C PowerPC 405 core is guaranteed to operate at up to 350 MHz in Commercial grade (-6 speed grade), as specified in DS083 Table 4. This assumes proper decoupling, thermal management, and adherence to voltage tolerances (1.5 V ±3% VCCINT). Operation above this frequency requires validation per XAPP755 guidelines and is not production-warranted.

Does XC2VP7-6FGG456C support LVDS I/O at 840 Mb/s with on-chip termination?

Yes, XC2VP7-6FGG456C supports LVDS I/O at up to 840 Mb/s with on-chip differential termination, as documented in DS083 Module 1. The SelectIO-Ultra I/O banks provide current-mode LVDS drivers and programmable 100 Ω differential termination, eliminating external resistors and reducing board area and signal integrity risk.

How many RocketIO transceivers are implemented and operational in XC2VP7-6FGG456C?

XC2VP7-6FGG456C contains eight fully functional RocketIO multi-gigabit transceivers, each capable of full-duplex operation from 600 Mb/s to 2.5 Gb/s. These are confirmed in DS083 Table 1 and supported in the FGG456 package per Table 3, with all eight bonded out and electrically validated.

Is XC2VP7-6FGG456C pin-compatible with other Virtex-II Pro devices in the FGG456 package?

No, XC2VP7-6FGG456C is not pin-compatible with other Virtex-II Pro devices in the FGG456 package. While the physical ball grid is identical, I/O bank assignments, power pin distribution, and RocketIO pin locations differ across densities (e.g., XC2VP4 vs. XC2VP7). Board redesign is required when migrating between these devices.

What configuration modes does XC2VP7-6FGG456C support, and which are recommended for production use?

XC2VP7-6FGG456C supports Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 Boundary-Scan configuration modes. For production, Master SelectMAP is recommended for fast parallel loading from flash memory, while Slave Serial remains viable for low-pin-count interfaces. All modes require correct M0–M2 strap settings and compliant clocking per DS083 Module 1.