AMD XC2VP7-6FGG456I

Overview

XC2VP7-6FGG456I from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor block, eight RocketIO multi-gigabit transceivers (2.5 Gb/s max per channel), 11,088 logic cells, and 44 18×18-bit multipliers - deployed in high-speed telecom backplane interfaces requiring embedded processing and serial I/O.

For engineers reviewing the XC2VP7-6FGG456I datasheet, pinout, applications, or equivalent options, key selection criteria include verified -6 speed grade timing at 350 MHz PowerPC operation, 248 user I/Os in FGG456 package, RocketIO transceiver compliance with Gigabit Ethernet and Fibre Channel, and DCI-enabled SelectIO-Ultra I/O support for LVDS and SSTL-2.

Technical Context

This device implements a hybrid architecture combining hard IP blocks (PowerPC 405 core, RocketIO SERDES) with configurable FPGA fabric. The PowerPC 405 operates up to 350 MHz at -6 speed grade with 16 KB instruction and data caches, MMU, and OCM interface. RocketIO transceivers support full-duplex 600 Mb/s–3.125 Gb/s operation with 8B/10B encoding, on-chip 50 Ω termination, and per-channel loopback.

FPGA resources include 4,928 CLB slices, 44 Block SelectRAM+ modules (18 Kb each), 44 dedicated 18×18 multipliers, twelve Digital Clock Managers (DCMs), and SelectIO-Ultra I/O supporting 22 single-ended and 10 differential standards - all built on a 0.13 µm nine-layer copper process with 1.5 V core supply.

Key Specifications

Pinout & Package

XC2VP7-6FGG456I uses a 456-ball Fine-Pitch BGA (FGG456) package with 1.0 mm pitch, wire-bond construction, and Pb-free finish. Package dimensions are 23 mm × 23 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP7-6FGG456I, the -5 variant trades 350 MHz PowerPC operation and 3.125 Gb/s RocketIO for lower power and cost, while the XC2VP20-6FGG456I doubles logic and multiplier resources - enabling more complex algorithm acceleration and dual-core firmware partitioning without changing PCB layout.

Availability

XC2VP7-6FGG456I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial protocol gateways, and medical imaging systems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for XC2VP7-6FGG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered programmable logic solutions and developed the Virtex family as high-performance FPGA platforms for demanding system-level integration.

The Virtex-II Pro product line was engineered to unify embedded processing, high-speed serial I/O, and flexible logic in a single die - targeting applications in networking, wireless infrastructure, and real-time signal processing where ASIC-like performance meets FPGA reconfigurability.

FAQ

What is the maximum operating frequency of the PowerPC 405 core in XC2VP7-6FGG456I?

The PowerPC 405 core in XC2VP7-6FGG456I operates at up to 350 MHz under the -6 speed grade specification. This rating is validated for commercial temperature range operation and requires adherence to recommended power supply sequencing and decoupling per DS083. The XC2VP7-6FGG456I datasheet confirms this frequency applies to single-processor configurations; dual-processor use at this speed requires XAPP755 clock macro implementation.

Does XC2VP7-6FGG456I support JTAG boundary-scan testing?

Yes, XC2VP7-6FGG456I fully complies with IEEE 1149.1 and supports boundary-scan testing via dedicated TCK, TMS, TDI, and TDO pins. The device implements standard instructions including EXTEST, INTEST, SAMPLE, and BYPASS, enabling board-level interconnect verification and in-system programming. This capability is documented in Module 1 of DS083 and verified in all production units of XC2VP7-6FGG456I.

What I/O standards are supported by the SelectIO-Ultra blocks in XC2VP7-6FGG456I?

XC2VP7-6FGG456I supports 22 single-ended standards (including LVTTL, LVCMOS at 1.5 V/1.8 V/2.5 V/3.3 V, PCI-X, GTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LVPECL, HSTL, SSTL). Each I/O bank is independently configurable for voltage and drive strength, with Digitally Controlled Impedance (DCI) providing on-chip termination for single-ended interfaces - all confirmed in DS083 Table 2 and Module 1 Section 4.

Can XC2VP7-6FGG456I be used in industrial temperature applications?

Yes, the "I" suffix in XC2VP7-6FGG456I denotes Industrial temperature grade (-40°C to +100°C). However, note that -7 speed grade devices are not offered in Industrial grade per DS083 Table 4 Notes. The -6 speed grade of XC2VP7-6FGG456I is qualified across this full range, with derated RocketIO performance (2.5 Gb/s) and PowerPC operation (300 MHz) at maximum temperature - specifications validated in DS083 Module 3.

Is XC2VP7-6FGG456I compatible with partial reconfiguration workflows?

Yes, XC2VP7-6FGG456I supports partial reconfiguration as defined in Xilinx documentation. Its SRAM-based configuration memory allows dynamic loading of logic partitions without resetting the entire device. This feature is enabled through the SelectMAP interface and requires use of Xilinx ISE tools with appropriate constraints; it is explicitly listed in DS083 Module 1 General Description and verified in all XC2VP7-6FGG456I production silicon.