AMD XC2VP7-7FF672C

Overview

XC2VP7-7FF672C from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor block, eight RocketIO multi-gigabit transceivers (3.125 Gb/s), 11,088 logic cells, twelve Digital Clock Managers (DCMs), and 396 user I/Os in a 672-pin flip-chip fine-pitch BGA package. It targets high-speed serial interconnect, embedded processing, and reconfigurable telecom infrastructure.

For engineers reviewing the XC2VP7-7FF672C datasheet, pinout, applications, or equivalent options, key selection criteria include verified RocketIO transceiver performance at 3.125 Gb/s, PowerPC 405 clocking up to 400 MHz (–7 speed grade), DCM phase-shifting resolution of 1/256 clock period, and FF672 package I/O count of 396 with support for LVDS, SSTL, and HSTL standards.

Technical Context

The XC2VP7-7FF672C implements a hybrid architecture combining hard IP blocks-PowerPC 405 core and RocketIO SERDES-with programmable fabric based on 0.13 µm nine-layer copper process. Its RocketIO transceivers operate at 3.125 Gb/s full-duplex with monolithic CDR, 8B/10B encoding, and per-channel loopback modes.

The embedded PowerPC 405 block delivers 400 MHz operation (–7 grade), features 16 KB instruction and 16 KB data caches, MMU with 64-entry TLB, and OCM interface. Clock management uses twelve DCMs supporting precise de-skew, integer/fractional frequency synthesis, and coarse/fine phase shifting (90°/180°/270° + 1/256-step).

Key Specifications

Pinout & Package

XC2VP7-7FF672C is housed in a 672-ball flip-chip fine-pitch BGA (FF672) package with 1.0 mm pitch, optimized for thermal dissipation and signal integrity in high-speed serial applications. Pin definitions are documented across 302 pages in DS083 Module 4, covering dedicated configuration, JTAG, clock, PowerPC, RocketIO, and SelectIO-Ultra I/O banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing and high-speed serial interconnect applications.

Compared with XC2VP7-7FF672C, the XC2VP7-6FF672C trades 50 MHz PowerPC performance and tighter timing margins for lower power and cost, while the XC2VP20-7FF672C retains identical speed grade and package but doubles logic, multiplier, and transceiver resources-making it a direct scalability path without PCB redesign.

Availability

XC2VP7-7FF672C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial protocol gateways, medical imaging backplanes, and defense radar signal processors requiring stable component supply and long-term lifecycle support.

Supply support for XC2VP7-7FF672C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-defining FPGA architectures and tools for high-performance digital system design.

The Virtex-II Pro family, including XC2VP7-7FF672C, was engineered to integrate hard processor cores and multi-gigabit transceivers into high-density FPGAs-targeting applications demanding both embedded software execution and reconfigurable hardware acceleration in networking, aerospace, and instrumentation.

FAQ

What is the maximum operating frequency of the PowerPC 405 core in XC2VP7-7FF672C?

The PowerPC 405 core in XC2VP7-7FF672C operates at up to 400 MHz under commercial –7 speed grade conditions. This rating assumes proper decoupling, thermal management, and adherence to XAPP755 guidelines for dual-processor configurations. The XC2VP7-7FF672C datasheet specifies this limit in Table 4 of DS083 (v5.0), and actual sustained frequency depends on voltage stability and ambient temperature.

Does XC2VP7-7FF672C support 10 Gigabit Ethernet physical layer interfacing?

Yes, XC2VP7-7FF672C supports 10 Gigabit Ethernet via its eight RocketIO transceivers, each capable of 3.125 Gb/s full-duplex operation. When combined with Xilinx's Aurora or XAUI IP cores, the XC2VP7-7FF672C implements compliant 10GBASE-R or XAUI interfaces. The transceivers include 8B/10B encoding, CDR, and channel bonding-meeting IEEE 802.3ae requirements for serial data transport.

What package type and pin count does XC2VP7-7FF672C use?

XC2VP7-7FF672C uses the FF672 flip-chip fine-pitch BGA package with 672 balls and 1.0 mm pitch. This package provides 396 user I/Os, plus dedicated configuration, JTAG, clock, PowerPC, and RocketIO pins. The FF672 variant offers superior thermal performance and signal integrity over wire-bond alternatives, as confirmed in Table 3 of DS083 (v5.0).

Can XC2VP7-7FF672C perform partial reconfiguration in the field?

Yes, XC2VP7-7FF672C supports partial reconfiguration through its SRAM-based in-system configuration architecture. Using Xilinx ISE tools and appropriate HDL partitioning, users can dynamically reload specific logic regions without disrupting PowerPC operation or RocketIO links. This capability is documented in DS083 Module 1 under "SRAM-Based In-System Configuration" and enables adaptive functionality in deployed XC2VP7-7FF672C systems.

Is XC2VP7-7FF672C still recommended for new designs?

No, XC2VP7-7FF672C is marked "Product Not Recommended For New Designs" per DS083 (v5.0) cover page and Module 1. While fully functional and supported for existing programs, Xilinx recommends newer families (e.g., Kintex-7 or Versal ACAP) for new development due to improved power efficiency, higher transceiver speeds, and enhanced toolchain support. Aetrix Electronics maintains inventory for legacy program continuity.