AMD XC2VP7-7FFG672C

Overview

XC2VP7-7FFG672C from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor block, eight RocketIO multi-gigabit transceivers (MGTs), 11,088 logic cells, 44 18×18-bit multipliers, and 396 user I/Os in a 672-pin flip-chip fine-pitch BGA package. It delivers up to 400 MHz processor operation and 3.125 Gb/s per transceiver channel for telecom and networking system-on-chip designs.

For engineers reviewing the XC2VP7-7FFG672C datasheet, pinout, applications, or equivalent options, key selection criteria include embedded PowerPC core count, RocketIO transceiver quantity and speed grade (-7), I/O count in FF672 package, DCM clock management capability, and SelectRAM+ memory resources for real-time signal processing.

Technical Context

The XC2VP7-7FFG672C implements a hybrid architecture combining hard IP blocks - including a 32-bit PowerPC 405 core with 16 KB instruction and 16 KB data caches, MMU, and OCM interface - with programmable FPGA fabric based on 0.13 µm nine-layer copper process. Its eight RocketIO transceivers support full-duplex serial links at 3.125 Gb/s (speed grade -7) with 8B/10B encoding, channel bonding, and on-chip 50 Ω termination.

Digital Clock Manager (DCM) modules provide precise clock deskew, integer/fractional frequency synthesis, and ±180° phase shifting; CLBs contain dual 4-input LUTs with carry chains and distributed RAM; IOBs support LVDS, SSTL, HSTL, and PCI-X with Digitally Controlled Impedance (DCI) for single-ended standards.

Key Specifications

Pinout & Package

XC2VP7-7FFG672C uses the FF672 flip-chip fine-pitch BGA package (27 mm × 27 mm, 1.0 mm pitch), optimized for high I/O count and thermal performance. Pin definitions are documented across 302 pages in DS083 Module 4, covering dedicated configuration pins (CCLK, DONE, PROG_B), JTAG boundary-scan signals (TCK/TDI/TDO/TMS), PowerPC debug interfaces (JTAGPPC), RocketIO differential pairs (TXP/TXN, RXP/RXN), and configurable SelectIO-Ultra banks supporting LVDS, SSTL, and HSTL standards.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system-on-chip applications.

Compared with XC2VP7-6FFG672C, the XC2VP7-7FFG672C enables higher-bandwidth protocols (XAUI, 2G Fibre Channel) and faster software execution; versus XC2VP20-7FFG672C, it offers identical transceiver and processor capability at lower cost and power, making it optimal for mid-scale SoC integration where logic density is sufficient.

Availability

XC2VP7-7FFG672C is available at Aetrix Electronics and suitable for wireless infrastructure, storage networking, medical imaging, and industrial automation systems requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP7-7FFG672C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and IP-based platform solutions for high-performance digital systems.

The Virtex-II Pro family, including XC2VP7-7FFG672C, was designed to integrate processor cores and high-speed serial transceivers into a single programmable device for telecommunications, networking, and signal processing applications demanding both software flexibility and hardware acceleration.

FAQ

What is the maximum operating frequency of the PowerPC 405 core in XC2VP7-7FFG672C?

The PowerPC 405 core in XC2VP7-7FFG672C operates at up to 400 MHz under speed grade -7 conditions. This rating assumes proper thermal management, 1.5 V core voltage, and adherence to XAPP755 guidelines for dual-processor configurations. The actual achievable frequency depends on clock routing, local logic depth, and I/O timing closure - verified during implementation using Xilinx ISE tools. XC2VP7-7FFG672C's DCMs support precise phase alignment to sustain this clock rate across the die.

Does XC2VP7-7FFG672C support 64B/66B encoding for high-speed serial links?

No, XC2VP7-7FFG672C does not support 64B/66B encoding. It implements RocketIO transceivers (not RocketIO X), which only include 8B/10B encoding and decoding blocks. 64B/66B support is exclusive to Virtex-II Pro X devices such as XC2VPX20 and XC2VPX70. XC2VP7-7FFG672C remains compatible with Fibre Channel, Gigabit Ethernet, XAUI, and InfiniBand standards relying on 8B/10B, but cannot natively handle 10GbE WAN PHY or IEEE 802.3ae LAN PHY protocols requiring 64B/66B.

How many RocketIO transceivers are implemented in XC2VP7-7FFG672C, and what is their pinout configuration?

XC2VP7-7FFG672C integrates eight RocketIO transceivers, each occupying a dedicated differential pair (TXP/TXN and RXP/RXN) plus auxiliary pins (RXRECCLK, TXUSRCLK, etc.) as defined in DS083 Module 4 Pin Definitions. These are mapped to specific ball locations in the FF672 package - for example, MGT0 uses balls D13/D14 (TXP/TXN) and E13/E14 (RXP/RXN). All eight transceivers are bonded out in the FF672 package; no MGT pins are reserved or unused. XC2VP7-7FFG672C does not support RocketIO X variants.

Can XC2VP7-7FFG672C be configured via JTAG, and what boundary-scan capabilities does it support?

Yes, XC2VP7-7FFG672C supports IEEE 1149.1-compliant boundary-scan via dedicated TCK, TDI, TDO, and TMS pins. It implements EXTEST, INTEST, and HIGHZ test instructions, along with non-test instructions (SAMPLE, IDCODE, USERCODE). During system operation, boundary-scan can verify I/O pin states without halting the PowerPC or FPGA logic. Configuration via JTAG (IEEE 1532) is supported for programming and readback. XC2VP7-7FFG672C also enables ChipScope ILA integration for real-time debugging of both processor and fabric logic.

Is XC2VP7-7FFG672C recommended for new designs, and what is its current lifecycle status?

No, XC2VP7-7FFG672C is marked "Product Not Recommended For New Designs" per Xilinx DS083 v5.0 (June 2011). It has been superseded by Virtex-4, Virtex-5, and later families. However, Aetrix Electronics maintains active inventory and supply chain support for legacy deployments in aerospace, defense, and industrial systems where redesign is impractical. Lifecycle coordination includes obsolescence forecasting, last-time-buy planning, and cross-reference guidance to functionally aligned modern alternatives when migration is feasible.