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AMD XC2VP7-7FFG896C

Part No.:
XC2VP7-7FFG896C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
896-BBGA, FCBGA
Datasheet:
AetrixXC2VP7-7FFG896C.pdf
Description:
IC FPGA 396 I/O 896FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,894

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Product details

Overview

XC2VP7-7FFG896C from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, eight RocketIO multi-gigabit transceivers (3.125 Gb/s), 11,088 logic cells, four Digital Clock Managers (DCMs), and 396 user I/Os in an 896-pin flip-chip fine-pitch BGA package. It targets high-bandwidth embedded systems requiring on-chip processing, serial interconnect, and reconfigurable logic - such as telecom line cards and network packet processors.

For engineers reviewing the XC2VP7-7FFG896C datasheet, pinout, applications, or equivalent options, key selection considerations include its -7 speed grade (400 MHz PowerPC, 3.125 Gb/s transceivers), FF896 package thermal and routing constraints, dual-voltage I/O support (1.5V core / 2.5V VCCAUX / configurable VCCO), and compatibility with Xilinx ISE 14.7 toolchain for partial reconfiguration and ChipScope debugging.

Technical Context

The XC2VP7-7FFG896C implements a hybrid architecture combining hard IP (PowerPC 405 core with 16 KB instruction and 16 KB data cache, MMU, OCM interface) with programmable fabric (CLBs, Block SelectRAM+, 18×18 multipliers, DCMs). Its eight RocketIO transceivers operate at up to 3.125 Gb/s full-duplex with 8B/10B encoding, on-chip 50Ω/75Ω termination, and channel bonding support.

Routing uses Active Interconnect Technology with hierarchical segmented resources, including 16 global clock lines, 24 long lines per row/column, and predictable delay independent of fanout. Configuration is SRAM-based via Slave SelectMAP or JTAG (IEEE 1532), supporting triple-DES bitstream encryption and readback of flip-flops, distributed RAM, and block RAM contents.

Key Specifications

Parameter Value and Actual Design Meaning
Logic Cells 11,088 - defines maximum combinational + sequential logic capacity; ~4 LUTs + 1 FF per cell
PowerPC Core 1 × PPC405 @ 400 MHz (-7 grade) - provides embedded RISC execution with MMU, caches, and CoreConnect bus
RocketIO Transceivers 8 × 3.125 Gb/s full-duplex - supports Fibre Channel, Gigabit Ethernet, XAUI, InfiniBand with 8B/10B encoding
User I/O Pads 396 - supports 22 single-ended (LVCMOS, SSTL, HSTL) and 10 differential (LVDS, BLVDS, LVPECL) standards
Digital Clock Managers 4 × DCM - enables precise de-skew, frequency synthesis (integer/fractional), and phase shifting (1/256 period resolution)
Block RAM 44 × 18 Kb SelectRAM+ - configurable as dual-port RAM (e.g., 512×36) or cascaded for larger memory blocks
Multipliers 44 × 18×18-bit - optimized for DSP filtering, MAC operations, and independent use from Block RAM
Package FF896 - 31×31 mm flip-chip fine-pitch BGA, 1.0 mm pitch, Pb-free compatible, thermal performance suited for industrial ambient

Pinout & Package

XC2VP7-7FFG896C is housed in an 896-ball flip-chip fine-pitch BGA (FF896) package with 1.0 mm pitch, optimized for signal integrity and thermal dissipation in high-density PCB layouts. Pin definitions follow Xilinx DS083 Module 4, covering configuration (CCLK, DONE, M0–M2, PROG_B), JTAG (TCK/TDI/TDO/TMS), power (VCCINT=1.5V, VCCAUX=2.5V, VCCO per bank), I/O banks (396 user signals), and eight RocketIO transceiver pairs (TXP/TXN, RXP/RXN).

Pin/Terminal Circuit Role Design Meaning
CCLK Configuration Clock Input Drives internal configuration state machine; must be clean, monotonic, and stable before PROG_B release
DONE Configuration Status Output Open-drain signal indicating successful bitstream load; pulled high externally after configuration completion
M0–M2 Mode Selection Inputs Set configuration mode (e.g., Master SelectMAP, Slave Serial); sampled at PROG_B deassertion
TCK/TDI/TDO/TMS JTAG Boundary-Scan Interface Support IEEE 1149.1 test access; TDO is output-only, others bidirectional; requires 10 kΩ pull-up on TMS/TCK
VCCINT Core Power Supply 1.5V ±3% supply for FPGA fabric and PowerPC core; requires low-noise decoupling near package corners
VCCAUX Auxiliary Power Supply 2.5V ±3% supply for DCMs, SelectIO buffers, and configuration logic; separate from VCCO
VCCO_x I/O Bank Power Configurable per-bank voltage (1.5V/1.8V/2.5V/3.3V); sets output swing and input threshold for associated I/Os
TXP/TXN (per MGT) Differential Transmitter Output Current-mode LVDS outputs; 200–1600 mVpp swing programmable; require AC-coupling and 100Ω differential termination
RXP/RXN (per MGT) Differential Receiver Input Supports internal 50Ω termination; equalization programmable; lock-to-reference recovery eliminates external PLL

Key Features

Feature Design Value
Integrated PowerPC 405 Core Hardened RISC processor with 16 KB instruction + 16 KB data cache, MMU, and OCM interface - eliminates need for external CPU in control-plane designs
RocketIO Transceivers Eight 3.125 Gb/s SERDES with monolithic CDR, 8B/10B encode/decode, and channel bonding - enables backplane and chip-to-chip links without external PHYs
SelectIO-Ultra I/O 396 pins supporting LVDS, SSTL, HSTL, PCI-X, and digitally controlled impedance (DCI) - allows on-die termination matching trace impedance without external resistors
Digital Clock Manager (DCM) Four fully digital DCMs with sub-cycle phase shift (1/256 period), jitter reduction, and flexible multiplication/division - replaces external clock synthesizers in timing-critical subsystems
SRAM-Based Configuration Fast SelectMAP configuration, partial reconfiguration, and DES-encrypted bitstreams - supports field updates and secure IP deployment
Active Interconnect Routing Hierarchical segmented routing with fixed delay vs. fanout - ensures predictable timing closure for high-speed interfaces like DDR and RocketIO

Applications

Telecom Line Card Controller Network Packet Processor

Use Scenario: Line card in carrier-grade switch handling OC-48/STM-16 framing, SONET/SDH overhead processing, and traffic policing.

IC Role / Device Role / Timing Role: XC2VP7-7FFG896C serves as the central control and data-path accelerator, running real-time protocol stacks on PowerPC while offloading packet classification and header parsing to FPGA fabric.

Use Value: Eight RocketIO transceivers directly interface to multiple SFP modules at 2.488 Gb/s; DCMs synchronize 125 MHz system clock with 8KHz TDM timing; DCI eliminates 396 external termination resistors.

Use Scenario: Embedded packet inspection engine in enterprise firewall performing deep packet inspection, TLS decryption acceleration, and flow-based QoS enforcement.

IC Role / Device Role / Timing Role: XC2VP7-7FFG896C integrates control plane (PowerPC) and data plane (FPGA fabric) in one die, with RocketIO linking to front-panel 10GbE PHYs and Block RAM storing rule tables.

Use Value: 44 × 18×18 multipliers accelerate cryptographic hash and AES rounds; 44 × 18 Kb Block RAM provides 792 KB of on-chip rule storage; 396 I/Os route parallel DDR2 memory and PCIe x4 interface.

Medical Imaging Data Hub Industrial Video Encoder

Use Scenario: Central aggregation unit in MRI/PET scanner receiving raw sensor data streams from multiple ADC modules over high-speed serial links.

IC Role / Device Role / Timing Role: XC2VP7-7FFG896C acts as serializer/deserializer hub and real-time preprocessor, using RocketIO to ingest eight 2.5 Gb/s sensor streams and PowerPC to manage DICOM export and storage control.

Use Value: RocketIO's automatic lock-to-reference and receiver equalization compensate for PCB trace loss; 11,088 logic cells implement custom FIR filters and motion correction algorithms; 4 DCMs generate synchronized clocks for ADC sampling and display output.

Use Scenario: HD-SDI encoder board in broadcast equipment converting uncompressed 1080p60 video to SMPTE 292M serial format with embedded audio and metadata.

IC Role / Device Role / Timing Role: XC2VP7-7FFG896C performs pixel-rate video scaling, color space conversion, and HD-SDI serialization using dedicated logic and RocketIO transceivers as physical layer drivers.

Use Value: LVDS I/O supports 840 Mb/s pixel bus; RocketIO TXP/TXN pins drive HD-SDI compliant differential signals directly; SelectRAM+ stores frame buffers for line buffering and chroma subsampling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
XC2VP7-6FF896C Slower speed grade: PowerPC max 350 MHz, RocketIO max 2.5 Gb/s (wire-bond) or 3.125 Gb/s (flip-chip) Suitable for cost-sensitive industrial control where 400 MHz CPU or 3.125 Gb/s transceivers are not required Select when thermal budget or BOM cost constraints outweigh peak performance needs; same pinout and footprint
XC2VP20-7FF896C Higher density: 20,880 logic cells, 208 I/Os more, two PowerPC cores, eight RocketIO transceivers Required for multi-core control plane or higher-throughput data paths (e.g., 10Gbps line rate with full packet processing) Choose when XC2VP7-7FFG896C logic or memory resources are insufficient; shares FF896 package but requires updated PCB layout for additional I/Os

Compared with XC2VP7-7FFG896C, XC2VP7-6FF896C trades 12.5% CPU frequency and identical transceiver speed for lower power and cost, while XC2VP20-7FF896C doubles logic capacity and adds second PowerPC core at the expense of higher static power and design complexity - making XC2VP7-7FFG896C optimal for balanced embedded processing with moderate I/O and serial bandwidth.

Availability

XC2VP7-7FFG896C is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging systems, and industrial video equipment requiring stable component supply across extended product lifecycles.

Supply support for XC2VP7-7FFG896C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family as high-performance programmable logic platforms for demanding system-level applications.

The Virtex-II Pro family, including XC2VP7-7FFG896C, was designed to integrate hard processor cores and multi-gigabit transceivers into reconfigurable logic for embedded networking, telecommunications, and signal processing systems.

FAQ

What is the maximum operating frequency of the PowerPC 405 core in XC2VP7-7FFG896C?

The XC2VP7-7FFG896C PowerPC 405 core operates at up to 400 MHz under the -7 speed grade, as confirmed in DS083 Table 4. This rating assumes commercial temperature grade (0°C to 85°C) and proper decoupling of VCCINT and VCCAUX supplies. The core includes hardware multiply/divide, 16 KB instruction and 16 KB data caches, and MMU support - all functional at this frequency in the XC2VP7-7FFG896C device.

Does XC2VP7-7FFG896C support partial reconfiguration?

Yes, XC2VP7-7FFG896C supports partial reconfiguration through its SRAM-based configuration architecture and SelectMAP interface, as documented in DS083 Module 1. This capability allows dynamic swapping of logic modules without resetting the PowerPC core or disrupting active RocketIO links - critical for adaptive radio protocols and runtime-accelerated compute workloads in the XC2VP7-7FFG896C.

What I/O standards are supported by XC2VP7-7FFG896C?

XC2VP7-7FFG896C supports 22 single-ended standards (including LVCMOS 1.5V/1.8V/2.5V/3.3V, SSTL, HSTL, PCI-X) and 10 differential standards (LVDS, BLVDS, ULVDS, LVPECL, LDT) via its SelectIO-Ultra blocks. Each I/O bank is independently configurable for VCCO voltage and drive strength (2–24 mA), and Digitally Controlled Impedance (DCI) enables on-die series or parallel termination matching PCB trace impedance - all verified in DS083 Module 1.

Is XC2VP7-7FFG896C pin-compatible with other Virtex-II Pro devices in FF896 package?

No, XC2VP7-7FFG896C is not fully pin-compatible with other Virtex-II Pro devices in the FF896 package. While it shares the same 896-ball flip-chip footprint, I/O allocation, RocketIO pin assignments, and power/ground ball patterns differ across densities (e.g., XC2VP20-7FF896C has more I/Os and different bank configurations). Pin compatibility is only guaranteed within the same device variant and speed grade - confirmed in DS083 Table 3 and Module 4 pinout tables.

What configuration modes does XC2VP7-7FFG896C support?

XC2VP7-7FFG896C supports five configuration modes: Slave-Serial, Master-Serial, Slave SelectMAP, Master SelectMAP, and Boundary-Scan (IEEE 1532). Master SelectMAP is commonly used for fast parallel loading from flash memory, while JTAG is standard for programming and debugging. All modes are electrically and logically defined in DS083 Module 1, and the XC2VP7-7FFG896C implements triple-DES bitstream encryption for secure configuration in any mode.

XC2VP7-7FFG896C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-II Pro
Package/Case:
896-BBGA, FCBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
1232
Number of Logic Elements/Cells:
11088
Total RAM Bits:
811008
Number of I/O:
396
Number of Gates:
-
Voltage - Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
896-FCBGA (31x31)

XC2VP7-7FFG896C FAQ

1.How can I place an order for XC2VP7-7FFG896C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2VP7-7FFG896C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2VP7-7FFG896C reliable?

The price and inventory of XC2VP7-7FFG896C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP7-7FFG896C is usually 5 days.

3.What payment methods are accepted for XC2VP7-7FFG896C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP7-7FFG896C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC2VP7-7FFG896C?

XC2VP7-7FFG896C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2VP7-7FFG896C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2VP7-7FFG896C?

For technical support, including XC2VP7-7FFG896C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP7-7FFG896C requirements.

6.How does Aetrix verify that XC2VP7-7FFG896C is sourced from the original manufacturer or authorized distributors?

All XC2VP7-7FFG896C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP7-7FFG896C meets industry standards.

7.What is the process for return or replacement of XC2VP7-7FFG896C?

All XC2VP7-7FFG896C units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP7-7FFG896C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2VP7-7FFG896C part is unused and in its original packaging.

Return procedure for XC2VP7-7FFG896C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC2VP7-7FFG896C Tags

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