AMD XC3030-100PQ100C
- Part No.:
- XC3030-100PQ100C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 100-BQFP
- Datasheet:
-
XC3030-100PQ100C.pdf
- Description:
- IC FPGA 80 I/O 100QFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,664
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Product details
Overview
XC3030-100PQ100C from Xilinx is a Field Programmable Gate Array (FPGA) with 100 configurable logic blocks (CLBs), 10×10 array architecture, 80 maximum flip-flops, 360 longline data bits, and guaranteed 100 MHz toggle rate. It operates at 4.75–5.25 V (commercial grade), supports TTL/CMOS input thresholds, and targets logic replacement and subsystem integration in industrial control and communications hardware.
For engineers reviewing the XC3030-100PQ100C datasheet, pinout, applications, or equivalent options, key selection criteria include CLB count, I/O count (up to 144), power-down current (80 µA), IOB timing (e.g., TPID = 7.5 ns), and PQFP-100 package compatibility with legacy XC3000 designs.
Technical Context
The XC3030-100PQ100C implements a static CMOS-based FPGA architecture with programmable interconnect points (PIPs), configurable I/O blocks (IOBs), and logic cells organized in a 10×10 array. Each CLB contains combinational logic and flip-flop/latch capability, supporting both registered and direct I/O paths.
Timing is governed by speed grade -100: max flip-flop toggle rate = 100 MHz, CLB combinatorial delay = 7.0 ns, clock-to-Q (TCKO) = 5.0 ns, and IOB pad-to-direct-in (TPID) = 7.5 ns. Configuration occurs via serial bitstream loading; bitstreams are upward compatible with XC3000A devices.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Density | ~3,000–4,000 usable gates (practically achievable 1,000–6,000 gate range) |
| Configurable Logic Blocks (CLBs) | 100 CLBs in 10×10 array; each provides dual-output combinational + sequential logic |
| Max Flip-Flops | 80 synchronous storage elements for state machine or pipeline implementation |
| Guaranteed Toggle Rate | 100 MHz - defines maximum clock frequency for reliable register-to-register operation |
| I/O Count | Up to 144 user-definable I/Os; actual available pins depend on package and configuration |
| Power-Down Current | 80 µA @ VCC = 5.25 V, TJ = +85°C - enables low-power standby in battery-sensitive systems |
| Supply Voltage Range | 4.75–5.25 V (commercial temp range 0°C to +70°C) - requires tight regulation |
Pinout & Package
PQ100: Plastic Quad Flat Pack, 100-pin, 0.65 mm pitch, 20.0 × 20.0 mm body size, JEDEC MS-026AC compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Primary power supply | 5 V core and I/O supply; decoupling required per IOB cluster |
| GND | Ground reference | Multiple dedicated ground pins for noise reduction and signal integrity |
| CLK1 / CLK2 | Global clock inputs | Dedicated low-skew paths to all CLBs and IOBs; support single- or dual-clock domain designs |
| RESET | Global asynchronous reset | Active-low signal forcing all CLB flip-flops and IOB registers to known state (TMRW = 21.0 ns min pulse width) |
| DATAIN | Serial configuration data input | Loads configuration bitstream during power-up or reconfiguration; synchronous to CONFIG clock |
| PROGRAM | Configuration initialization | Active-low signal that clears internal configuration memory and resets startup sequence |
| I/O Pins (e.g., IO0–IO143) | Programmable bidirectional interface | Support TTL/CMOS thresholds, 4 mA drive strength, slew-rate control, and internal pull-ups |
Key Features
| Feature | Design Value |
|---|---|
| Bitstream compatibility | Fully upward-compatible with XC3000A family - same bitstream loads without modification |
| Low-power Power-Down mode | Reduces ICCPD to 80 µA (XC3030-100PQ100C); enables rapid wake-up without reconfiguration |
| Configurable I/O thresholds | Selectable TTL or CMOS input voltage levels (VIHT/VILT or VIHC/VILC) per bank |
| Programmable slew rate | Per-pin output edge rate control - reduces EMI and crosstalk in high-density routing |
| Internal pull-up resistors | Configurable per I/O pad (IRIN = 0.02–0.17 mA); eliminates need for external biasing components |
Applications
| Industrial PLC Logic Controller | Legacy Telecom Line Card |
|---|---|
Use Scenario: Replacing discrete TTL/PLD logic in programmable logic controllers for motor sequencing and sensor interfacing. IC Role / Device Role / Timing Role: Configurable logic fabric implementing state machines, counters, and glue logic with deterministic 7.5 ns input-to-logic delay (TPID). Use Value: Reduces board space and BOM count vs. multiple SSI/MSI ICs while maintaining real-time response under 100 MHz clock constraints. | Use Scenario: Implementing protocol adaptation and framing logic in T1/E1 line interface cards for telecom infrastructure. IC Role / Device Role / Timing Role: Synchronous datapath controller using registered I/O and CLB flip-flops with 5.0 ns clock-to-Q (TCKO) and 8 ns global reset propagation (TRRI). Use Value: Enables precise timing alignment of framing bits and channelized data streams without external timing compensation circuits. |
| Automotive Body Control Module | Medical Imaging Signal Preprocessor |
Use Scenario: Consolidating lighting control, window lift, and door lock logic in automotive body electronics modules. IC Role / Device Role / Timing Role: Mixed-signal interface hub managing GPIO, PWM generation, and fault detection with configurable I/O thresholds and internal pull-ups. Use Value: Eliminates external level shifters and pull resistors, reducing component count and improving reliability in temperature-cycled environments. | Use Scenario: Real-time pixel data conditioning and histogram calculation prior to ADC digitization in ultrasound front-ends. IC Role / Device Role / Timing Role: High-speed parallel datapath processor using CLB combinational logic (9.0 ns TILO worst-case) and pipelined registers. Use Value: Achieves sub-microsecond latency for analog signal preprocessing without custom ASIC development cycle or NRE cost. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic replacement applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3030-100PC84C | Same XC3030-100 core, but in 84-pin PLCC package; fewer I/Os (116 max vs. 144), no PQFP footprint | Suitable for space-constrained boards where thermal mass and lead count favor PLCC over PQFP | Select when existing PCB layout uses PLCC-84 socket or requires lower profile mounting |
| XC3042-100PQ100C | Higher-density variant: 144 CLBs, 96 FFs, 480 longline bits; identical PQ100 package and pinout | Enables larger logic functions without changing PCB - ideal for design scalability or future-proofing | Select when additional CLBs or I/Os are needed post-prototype; maintains mechanical and thermal compatibility |
Compared with XC3030-100PQ100C, XC3030-100PC84C trades I/O count and package thermal performance for through-hole assembly compatibility, while XC3042-100PQ100C delivers 44% more CLBs in the same footprint - enabling logic expansion without layout revision.
Availability
XC3030-100PQ100C is available at Aetrix Electronics and suitable for industrial control systems, legacy telecom equipment upgrades, and medical device re-engineering requiring stable component supply and long-term obsolescence management.
Supply support for XC3030-100PQ100C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, founded in 1984, pioneered commercial FPGA technology and established foundational architectures for reconfigurable logic design.
The XC3000 family - including XC3030-100PQ100C - was engineered for general-purpose logic replacement and subsystem integration in cost-sensitive, medium-complexity digital systems before the advent of SRAM-based FPGAs.
FAQ
What is the maximum operating junction temperature for XC3030-100PQ100C?
The XC3030-100PQ100C has a maximum junction temperature of +125°C for plastic packages. This rating applies under commercial temperature range operation (0°C to +70°C ambient). Thermal design must ensure junction temperature remains within this limit during sustained operation, especially when driving 4 mA loads across multiple I/Os. Derating curves apply above +85°C ambient.
Does XC3030-100PQ100C support in-system reconfiguration?
No, XC3030-100PQ100C does not support in-system reconfiguration. Configuration is performed once at power-up via serial bitstream loading through the DATAIN pin. Reconfiguration requires cycling PROGRAM and applying a new bitstream - it cannot be done dynamically during normal operation. The architecture lacks dedicated configuration ports or partial reconfiguration capability found in later FPGA families.
What are the valid input voltage thresholds for XC3030-100PQ100C in TTL mode?
In TTL configuration mode, XC3030-100PQ100C specifies VIHT ≥ 2.0 V (high-level input voltage) and VILT ≤ 0.8 V (low-level input voltage), referenced to GND. These thresholds are fixed per IOB bank and selected at configuration time. Input signals must meet these levels across the full commercial temperature range (0°C to +70°C) and supply voltage (4.75–5.25 V) to guarantee reliable sampling.
Is XC3030-100PQ100C pin-compatible with any XC3000A devices?
XC3030-100PQ100C is not pin-compatible with XC3000A devices. While bitstreams are upward compatible (XC3000 bitstreams load successfully into XC3000A), the XC3000A family uses different package footprints and pin assignments. For example, XC3030A-100PQ100C has distinct power/ground pin distribution and added configuration pins not present on the original XC3030-100PQ100C.
What is the minimum pulse width required for the RESET pin on XC3030-100PQ100C?
The minimum active-low RESET pulse width for XC3030-100PQ100C is 21.0 ns under -100 speed grade conditions (TMRW parameter). This ensures proper assertion of global reset across all CLBs and IOBs. Pulse width must be maintained across the full operating voltage and temperature range; shorter pulses may result in incomplete reset of internal registers or inconsistent configuration state.
XC3030-100PQ100C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- XC3000
- Package/Case:
- 100-BQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 100
- Number of Logic Elements/Cells:
- -
- Total RAM Bits:
- 22176
- Number of I/O:
- 80
- Number of Gates:
- 2000
- Voltage - Supply:
- 4.75V ~ 5.25V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 100-PQFP (20x14)
XC3030-100PQ100C FAQ
1.How can I place an order for XC3030-100PQ100C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3030-100PQ100C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3030-100PQ100C reliable?
The price and inventory of XC3030-100PQ100C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3030-100PQ100C is usually 5 days.
3.What payment methods are accepted for XC3030-100PQ100C?
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4.How is shipping managed for XC3030-100PQ100C?
XC3030-100PQ100C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3030-100PQ100C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3030-100PQ100C?
For technical support, including XC3030-100PQ100C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3030-100PQ100C requirements.
6.How does Aetrix verify that XC3030-100PQ100C is sourced from the original manufacturer or authorized distributors?
All XC3030-100PQ100C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3030-100PQ100C meets industry standards.
7.What is the process for return or replacement of XC3030-100PQ100C?
All XC3030-100PQ100C units undergo pre-shipment inspection (PSI). If there is an issue with XC3030-100PQ100C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3030-100PQ100C part is unused and in its original packaging.
Return procedure for XC3030-100PQ100C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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