AMD XC3090-100PQ160C
- Part No.:
- XC3090-100PQ160C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 160-BQFP
- Datasheet:
-
XC3090-100PQ160C.pdf
- Description:
- IC FPGA 138 I/O 160QFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,230
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Product details
Overview
XC3090-100PQ160C from Xilinx is a Field Programmable Gate Array (FPGA) with 320 configurable logic blocks (CLBs), 144 user-definable I/Os, and guaranteed 100 MHz maximum flip-flop toggle rate. It uses advanced CMOS static memory technology, supports TTL/CMOS input thresholds, and operates at 4.5–5.5 V in industrial temperature range (–40°C to +85°C). It is used in legacy logic replacement and subsystem integration applications.
For engineers reviewing the XC3090-100PQ160C datasheet, pinout, applications, or equivalent options, key selection considerations include CLB count (320), I/O count (144), speed grade (-100), PQFP-160 package compatibility, and bitstream compatibility with XC3100 family devices.
Technical Context
The XC3090-100PQ160C implements a static RAM-based FPGA architecture with configurable logic blocks arranged in a 16 × 20 array and 40 longlines for global signal routing. Its IOBs support both registered and direct input/output paths, with programmable slew-rate control and internal pull-up resistors on unused pads.
Timing is defined by speed grade -100: max CLB combinatorial delay is 7.0 ns, CLB clock-to-Q delay is 5.0 ns, and IOB pad-to-registered-in delay is 17 ns. All timing values are worst-case over industrial operating conditions and validated using MIL-M-38510/605–compliant test patterns.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Density | ~6,000 usable gates; practical implementation capacity for medium-complexity digital logic functions |
| Configurable Logic Blocks | 320 CLBs; each provides combinational logic and/or flip-flop functionality with five inputs and two outputs |
| User I/O Pins | 144 user-definable I/Os; supports mixed TTL/CMOS signaling with programmable thresholds |
| Max Toggle Rate | 100 MHz; guaranteed minimum clock frequency for reliable flip-flop operation under worst-case industrial conditions |
| Supply Voltage Range | 4.5–5.5 V; compatible with standard 5 V logic systems and tolerant of ±10% rail variation |
| Operating Temperature | –40°C to +85°C; qualified for industrial-grade embedded control and instrumentation environments |
| Power-Down Current | 250 µA at VCC = 5.5 V, TJ = +100°C; enables low-power standby in battery-sensitive legacy systems |
Pinout & Package
PQFP-160 (Plastic Quad Flat Pack, 160 pins, 28 × 28 mm body, 0.65 mm pitch). Pinout conforms to Xilinx XC3000 family standard layout with dedicated configuration, clock, global reset, and I/O bank assignments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, GND | Power supply and ground | Dual VCC/GND pairs per side ensure stable core voltage distribution across large die area |
| CLK1, CLK2 | Global clock inputs | Low-skew buffered inputs feeding all CLBs and IOBs; support synchronous design with single or dual clock domains |
| RESET | Global asynchronous reset | Active-low signal asserting reset across all flip-flops simultaneously; 21 ns propagation delay to registered outputs |
| INIT, PROGRAM | Configuration control | Control pins managing SRAM bitstream loading sequence; essential for in-system reconfiguration and power-on initialization |
| I/O[0]–I/O[143] | Configurable bidirectional I/O | Each supports input, output, or 3-state mode; programmable pull-up, slew rate, and TTL/CMOS threshold selection |
Key Features
| Feature | Design Value |
|---|---|
| Bitstream compatibility | Fully upward-compatible with XC3100 family; enables migration without redesigning configuration data |
| Ultra-low power-down mode | 250 µA ICCPD at max junction temperature; reduces standby power in always-on industrial controllers |
| Programmable I/O thresholds | Selectable TTL (2.0 V VIH) or CMOS (70% VCC VIH) input levels per bank; simplifies interface to mixed-voltage peripherals |
| Longline routing resources | 40 dedicated horizontal longlines; provide low-skew global signals for clocks, resets, and enables across full array |
| Industrial temperature qualification | Tested and guaranteed over –40°C to +85°C; suitable for factory automation and outdoor telemetry hardware |
Applications
| Industrial PLC I/O Expansion | Legacy Test Equipment Logic Replacement |
|---|---|
Use Scenario: Adding custom digital I/O and protocol translation logic to programmable logic controller backplanes. IC Role / Device Role / Timing Role: Configurable glue logic implementing parallel-to-serial conversion, watchdog timers, and safety interlock state machines. Use Value: 144 I/Os and 320 CLBs enable integration of 8–12 isolated digital channels with real-time response under 100 MHz clock domain. | Use Scenario: Replacing obsolete TTL/PLD-based control logic in automated test equipment mainframes. IC Role / Device Role / Timing Role: Drop-in logic replacement handling GPIB handshake, trigger synchronization, and channel multiplexing. Use Value: Guaranteed 7.0 ns CLB combinatorial delay and 5.0 ns clock-to-Q meet sub-10 ns timing budgets for legacy bus protocols. |
| Avionics Subsystem Emulation | Medical Imaging Signal Conditioning |
Use Scenario: Emulating discrete avionics interface modules (e.g., ARINC 429 transceivers) during ground-test verification. IC Role / Device Role / Timing Role: FPGA-based protocol engine generating and decoding differential serial data streams with precise timing alignment. Use Value: 100 MHz toggle rate and programmable slew control ensure compliant signal rise/fall times and jitter < 1 ns RMS. | Use Scenario: Real-time preprocessing of analog-to-digital converter outputs in portable ultrasound front-ends. IC Role / Device Role / Timing Role: Synchronous data buffering, windowing, and FIR filter coefficient selection using registered I/O and CLB resources. Use Value: 250 µA power-down current allows rapid sleep/wake cycling between imaging frames, extending battery life. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic replacement applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3090-100PQ160I | Identical silicon and pinout; rated for industrial temperature (–40°C to +100°C junction) vs. XC3090-100PQ160C's +85°C ambient limit | Required for designs operating above 85°C ambient or requiring extended junction temperature margin | Select when thermal environment exceeds commercial-grade limits but full MIL-spec is unnecessary |
| XC3090A-100PQ160C | Second-generation XC3000A family; same pinout and bitstream-compatible, but improved timing (–100 speed grade yields ~15% faster CLB delays) and lower ICCPD | Enables higher clock frequencies or reduced power in new designs; not recommended for field-replaceable units in existing systems | Prefer for new designs where timing margin or active power reduction is critical |
Compared with XC3090-100PQ160C, the XC3090-100PQ160I extends thermal operating range without changing PCB layout, while the XC3090A-100PQ160C improves performance and power efficiency but requires validation of timing closure in updated tool flows.
Availability
XC3090-100PQ160C is available at Aetrix Electronics and suitable for industrial control, legacy test equipment modernization, and avionics ground-support applications requiring stable component supply and long-term obsolescence management.
Supply support for XC3090-100PQ160C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. pioneered commercial FPGA technology and developed the XC3000 family as the industry's first widely adopted SRAM-based programmable logic platform.
The XC3000 Logic Cell Array family was designed for flexible digital logic implementation in cost-sensitive, medium-complexity applications where gate-count scalability and field reconfigurability were essential.
FAQ
Is XC3090-100PQ160C pin-compatible with other XC3000 devices in PQFP-160 package?
Yes, XC3090-100PQ160C shares identical PQFP-160 mechanical footprint and pin assignment with XC3064-100PQ160C and XC3042-100PQ160C. However, I/O count and CLB resources differ: XC3090-100PQ160C provides 144 I/Os and 320 CLBs, whereas XC3064-100PQ160C offers 120 I/Os and 224 CLBs. Board-level reuse is possible only if design fits within smaller device resource limits.
What is the maximum clock frequency supported by XC3090-100PQ160C in actual designs?
The XC3090-100PQ160C guarantees a 100 MHz flip-flop toggle rate under worst-case industrial conditions. Actual achievable system clock frequency depends on placement and routing; typical post-PAR results for well-optimized designs reach 80–95 MHz. Critical paths involving longline routing or multiple CLB stages may limit performance below the guaranteed toggle rate.
Does XC3090-100PQ160C support in-system programming?
XC3090-100PQ160C does not support true in-system programming (ISP) like flash-based FPGAs. Configuration is loaded via serial or parallel PROM at power-up using INIT and PROGRAM control signals. Reprogramming requires cycling power or asserting PROGRAM low, making dynamic reconfiguration impractical. The XC3090-100PQ160C relies on external configuration memory and lacks internal nonvolatile storage.
Can XC3090-100PQ160C operate at 3.3 V?
No, XC3090-100PQ160C requires a 4.5–5.5 V supply and is not rated for 3.3 V operation. Its I/O buffers, internal logic, and configuration memory are designed for 5 V CMOS/TTL compatibility. Attempting 3.3 V operation risks functional failure, timing violation, or damage due to insufficient noise margin and incorrect threshold referencing.
Is XC3090-100PQ160C still recommended for new designs?
No - Xilinx explicitly states "All new designs should use XC3000A." The XC3090-100PQ160C is maintained solely for legacy system support and repair. XC3000A variants offer improved timing, lower power, and enhanced tool support. For new projects, XC3090A-100PQ160C or later families (XC4000, Spartan) are appropriate alternatives.
XC3090-100PQ160C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- XC3000
- Package/Case:
- 160-BQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 320
- Number of Logic Elements/Cells:
- -
- Total RAM Bits:
- 64160
- Number of I/O:
- 138
- Number of Gates:
- 6000
- Voltage - Supply:
- 4.75V ~ 5.25V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 160-PQFP (28x28)
XC3090-100PQ160C FAQ
1.How can I place an order for XC3090-100PQ160C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3090-100PQ160C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3090-100PQ160C reliable?
The price and inventory of XC3090-100PQ160C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3090-100PQ160C is usually 5 days.
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Once your XC3090-100PQ160C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3090-100PQ160C?
For technical support, including XC3090-100PQ160C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3090-100PQ160C requirements.
6.How does Aetrix verify that XC3090-100PQ160C is sourced from the original manufacturer or authorized distributors?
All XC3090-100PQ160C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3090-100PQ160C meets industry standards.
7.What is the process for return or replacement of XC3090-100PQ160C?
All XC3090-100PQ160C units undergo pre-shipment inspection (PSI). If there is an issue with XC3090-100PQ160C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3090-100PQ160C part is unused and in its original packaging.
Return procedure for XC3090-100PQ160C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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