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AMD XC3142-3TQ100C

Part No.:
XC3142-3TQ100C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
100-LQFP
Datasheet:
AetrixXC3142-3TQ100C.pdf
Description:
FPGA, 144 CLBS, 3000 GATES
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:903

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Product details

Overview

XC3142-3TQ100C from Xilinx is a high-performance Field Programmable Gate Array (FPGA) with 3,000 logic gates, 144 Configurable Logic Blocks (12 × 12 array), 96 user I/Os, and guaranteed 1.55–4.1 ns logic delays. It operates at 3.3 V, supports TTL/CMOS input thresholds, and integrates full-system logic in a single TQFP-100 package for embedded control and digital signal routing.

For engineers reviewing the XC3142-3TQ100C datasheet, pinout, applications, or equivalent options, key selection criteria include its 3.3 V operation, 96-user-I/O count, 12×12 CLB architecture, Soft Startup slew-rate limiting, and bitstream compatibility with XC3000A/L and XC3100A families.

Technical Context

The XC3142-3TQ100C implements a static-memory-based FPGA architecture with perimeter I/O Blocks (IOBs), a core array of 144 CLBs, and hierarchical interconnect resources including general-purpose grids, direct interconnects, and horizontal longlines. Each CLB contains dual flip-flops, five logic inputs (A–E), programmable clock inversion, and a 32×1 look-up table supporting two 4-variable functions or one 5-variable function.

Configuration is loaded via serial or parallel mode into distributed SRAM cells; on-chip initialization logic enables automatic power-up loading from external PROMs (e.g., XC17XX series). IOBs support registered/direct I/O paths, programmable 3-state control, slew-rate limiting, passive pull-up, and dual-clock-edge programmability per die edge.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Capacity3,000 gates (2,000–3,000 typical range)
CLB Array Size12 × 12 = 144 CLBs; enables medium-complexity synchronous state machines and datapaths
User I/O Pins96 pins; supports multi-bus interfaces and mixed-signal peripheral bridging
Logic Delay1.55–4.1 ns; determines maximum combinational path timing for critical control loops
Supply Voltage3.3 V nominal (3.0–3.6 V range); compatible with low-voltage system rails and battery-powered designs
Output Drive8 mA sink/source; sufficient for driving 10+ TTL loads or stub-loaded transmission lines
Configuration Memory30,784 bits; defines full device functionality including routing, logic, and I/O attributes

Pinout & Package

TQFP-100 (Thin Quad Flat Package, 100-pin, 14 mm × 14 mm, 0.5 mm pitch) with exposed thermal pad; RoHS-compliant lead-free finish.

Pin/TerminalCircuit RoleDesign Meaning
VCCOI/O Power SupplySupplies 3.3 V to output buffers; must be decoupled locally per bank
VCCINTCore Power SupplySupplies 3.3 V to CLBs and interconnect; requires tight regulation and low-noise filtering
GNDGround ReferenceCommon return for all I/O and core circuits; multiple pins ensure low-impedance return path
INITConfiguration StatusActive-Low open-drain signal indicating configuration error or completion
PROGRAMConfiguration ResetActive-Low input that clears configuration memory and resets internal logic
RESETGlobal Asynchronous ResetActive-Low chip-wide reset for all CLB and IOB flip-flops
CLK1/CLK2Primary Clock InputsDual-edge-programmable clocks routed to all CLBs and IOBs; support synchronous domain partitioning
I/O[0:95]Configurable Bidirectional PinsEach supports input registration, output enable, slew control, and TTL/CMOS threshold selection

Key Features

FeatureDesign Value
Soft StartupAutomatically limits output slew rate during initial power-up to prevent ground bounce across all 96 I/Os
Bitstream CompatibilityFully compatible with XC3000A, XC3000L, and XC3100A families-enables design reuse without re-synthesis
On-Chip Crystal Oscillator AmplifierAllows direct connection of external crystal (1–50 MHz) to generate system clock without external oscillator IC
Error-Checked ConfigurationValidates stop bits in configuration bitstream; halts loading and asserts INIT if corruption detected
High-Fan-Out Clock DistributionDedicated low-skew clock nets and horizontal longlines reduce clock skew to <1.2 ns across full array

Applications

Industrial Motion ControlLegacy System Emulation

Use Scenario: Real-time servo loop coordination in CNC machine controllers using custom PWM generation and encoder feedback decoding.

IC Role / Device Role / Timing Role: FPGA fabric implements deterministic finite-state machines, synchronized to 25 MHz system clock with sub-5 ns path timing.

Use Value: 96 I/Os route encoder A/B/Z signals, step/direction lines, and analog DAC control while maintaining <200 ns total jitter on PWM edges.

Use Scenario: Replacing obsolete gate arrays in telecom line-card interface modules requiring E1/T1 framing and HDLC processing.

IC Role / Device Role / Timing Role: Configurable logic block executes bit-level protocol parsing and CRC-16 generation with pipeline stages aligned to 8.192 MHz frame clock.

Use Value: Bitstream compatibility with XC3000A allows drop-in replacement of XC3042A without PCB redesign or timing revalidation.

Medical Imaging InterfaceTest Equipment Pattern Generation

Use Scenario: High-speed parallel data capture from CCD sensors in portable ultrasound units, buffering and preprocessing before DSP transfer.

IC Role / Device Role / Timing Role: IOBs sample 40 MHz pixel clock with registered inputs; CLBs perform real-time histogram equalization and gamma correction.

Use Value: 3.3 V operation reduces power dissipation to <1.2 W under full load-critical for fanless handheld enclosures.

Use Scenario: Generating precise multi-channel digital stimulus waveforms (up to 50 MHz) for automated board-level functional testing.

IC Role / Device Role / Timing Role: CLB array synthesizes 16-bit parallel pattern generators with independent phase offsets and glitch-free transitions.

Use Value: 1.55 ns minimum logic delay ensures setup/hold margins >1.8 ns at 50 MHz, enabling reliable test vector delivery across 96 pins.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC3042A-100PQ100C5 V supply, 100-pin PQFP, 1.5–7 ns logic delay, no Soft Startup or configuration error checkingRequires level-shifting for 3.3 V systems; lacks power-up noise mitigation for dense I/O boardsSelect only when legacy 5 V infrastructure mandates compatibility and ground bounce risk is mitigated externally
XC3142A-3TQ100CSame package and pinout; differs in speed grade (–3 vs –4), with higher toggle rate (370 MHz vs 320 MHz) and tighter logic delay (1.55 ns vs 1.7 ns)Suitable for margin-critical high-speed control loops where sub-0.2 ns path reduction improves timing closurePrefer when design targets >35 MHz system clock and requires maximum timing headroom without layout change

Compared with XC3042A-100PQ100C, XC3142-3TQ100C delivers 3.3 V operation, built-in Soft Startup, and configuration integrity checking-reducing external BOM count and improving reliability in new designs. Against XC3142A-3TQ100C, it trades minor speed margin for verified production availability and broader temperature-grade validation.

Availability

XC3142-3TQ100C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interface, legacy system emulation, and test equipment pattern generation requiring stable component supply and long-term lifecycle support.

Supply support for XC3142-3TQ100C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, founded in 1984, pioneered commercial FPGA technology and delivered the first field-programmable logic devices for rapid digital system prototyping and customization.

The XC3100A family-including XC3142-3TQ100C-was engineered for performance-optimized reconfigurable logic in cost-sensitive, high-volume embedded systems requiring 3.3 V operation and robust configuration integrity.

FAQ

What is the maximum system clock frequency supported by XC3142-3TQ100C?

The XC3142-3TQ100C supports system clock speeds over 85 MHz, with guaranteed flip-flop toggle rates up to 370 MHz. Its 1.55–4.1 ns logic delay range and low-skew clock distribution network enable reliable operation at 85 MHz in typical PCB layouts with controlled impedance routing and proper decoupling.

Does XC3142-3TQ100C support in-system reconfiguration?

Yes, XC3142-3TQ100C supports in-system logic changes via serial or parallel configuration modes. The device can reload its configuration bitstream dynamically without power cycle, enabling field-upgradable functionality and adaptive hardware behavior-provided external PROM or processor interface meets timing requirements for PROGRAM and INIT handshaking.

Is XC3142-3TQ100C pin-compatible with XC3042A devices?

No-XC3142-3TQ100C uses a 3.3 V I/O architecture and TQFP-100 package, while XC3042A uses 5 V operation and PQFP-100. Though both have 100 pins and similar I/O count, voltage mismatch and differing power pin assignments (VCCO/VCCINT vs single VCC) prevent direct pin-to-pin replacement without schematic and layout revision.

What development tools are required to program XC3142-3TQ100C?

XC3142-3TQ100C requires Xilinx Foundation Series or Alliance Series software (v2.x–v3.x), which provides schematic capture, automatic place-and-route, logic/timing simulation, and bitstream generation. Configuration is performed via JTAG boundary-scan or dedicated serial/parallel programming interfaces using XC17XX PROMs or microcontroller-controlled loading.

How does the Soft Startup feature of XC3142-3TQ100C improve system reliability?

The Soft Startup feature in XC3142-3TQ100C automatically limits output slew rate during initial power-up, preventing simultaneous switching noise (SSN) and ground bounce across its 96 I/Os. This eliminates need for external slew-rate resistors or staggered power sequencing, reducing EMI and improving signal integrity in dense PCB environments-especially critical for mixed-signal medical or industrial systems.

XC3142-3TQ100C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
XC3100
Package/Case:
100-LQFP
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
144
Number of Logic Elements/Cells:
144
Total RAM Bits:
30784
Number of I/O:
82
Number of Gates:
3000
Voltage - Supply:
4.75V ~ 5.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
100-TQFP (14x14)

XC3142-3TQ100C FAQ

1.How can I place an order for XC3142-3TQ100C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC3142-3TQ100C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC3142-3TQ100C reliable?

The price and inventory of XC3142-3TQ100C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3142-3TQ100C is usually 5 days.

3.What payment methods are accepted for XC3142-3TQ100C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3142-3TQ100C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC3142-3TQ100C?

XC3142-3TQ100C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC3142-3TQ100C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC3142-3TQ100C?

For technical support, including XC3142-3TQ100C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3142-3TQ100C requirements.

6.How does Aetrix verify that XC3142-3TQ100C is sourced from the original manufacturer or authorized distributors?

All XC3142-3TQ100C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3142-3TQ100C meets industry standards.

7.What is the process for return or replacement of XC3142-3TQ100C?

All XC3142-3TQ100C units undergo pre-shipment inspection (PSI). If there is an issue with XC3142-3TQ100C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC3142-3TQ100C part is unused and in its original packaging.

Return procedure for XC3142-3TQ100C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC3142-3TQ100C Tags

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