AMD XC3164A-3TQ144C

Overview

XC3164A-3TQ144C from AMD is a Field-Programmable Gate Array (FPGA) with 64 configurable logic blocks (CLBs), 144-pin TQFP package, -3 speed grade, and 5V CMOS I/O compatibility. It implements synchronous digital logic in prototyping and low-volume production systems for industrial control and communications interface bridging.

For engineers reviewing the XC3164A-3TQ144C datasheet, pinout, applications, or equivalent options, key selection factors include CLB count, I/O voltage tolerance, speed grade timing, TQFP thermal profile, and legacy 5V system integration capability.

Technical Context

This FPGA uses SRAM-based configuration memory, supports JTAG boundary-scan testing per IEEE 1149.1, and requires external PROM or microcontroller for configuration loading at power-up. Its architecture includes dedicated carry logic for arithmetic chains and distributed RAM per CLB.

The device features programmable I/Os with configurable slew rate and pull-up resistors, and supports mixed-voltage operation only within 5V-tolerant I/O banks - no 3.3V core or I/O support is implemented.

Key Specifications

Pinout & Package

TQFP-144 package with 0.5 mm lead pitch, exposed pad not present, JEDEC MO-153 compliant. Thermal resistance θ_JA = 45°C/W.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic replacement applications.

Compared with XCR3128XL-10VQ100C and XC4005E-3PQ160C, the XC3164A-3TQ144C uniquely balances moderate logic density, 5V system compatibility, and JTAG-configurable SRAM fabric - making it optimal for cost-sensitive, legacy-interface FPGA upgrades without full redesign.

Availability

XC3164A-3TQ144C is available at Aetrix Electronics and suitable for industrial control, legacy bus interfacing, and communications protocol conversion requiring stable component supply and long-term obsolescence management.

Supply support for XC3164A-3TQ144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD (Advanced Micro Devices) is a U.S.-based semiconductor company specializing in high-performance computing, graphics, and adaptive SoC solutions.

The XC3000/XC3100 series was AMD's first-generation commercial FPGA family targeting cost-effective, 5V-compatible logic replacement in industrial and communications equipment during the early 1990s.

FAQ

What is the configuration method supported by XC3164A-3TQ144C?

The XC3164A-3TQ144C supports Master Serial configuration via JTAG boundary-scan port or parallel mode using an external PROM. It does not support slave-serial or microprocessor-initiated configuration. Configuration data is loaded into volatile SRAM on power-up, requiring persistent external storage for repeated operation. The XC3164A-3TQ144C must be reconfigured each time power is cycled unless paired with a dedicated configuration PROM.

Does XC3164A-3TQ144C support 3.3V I/O operation?

No, the XC3164A-3TQ144C is strictly 5V-tolerant and designed for 5V CMOS/TTL system interfaces. Its I/O structure lacks internal level-shifting circuitry, and applying 3.3V signals directly to its pins may cause unreliable operation or damage if driven above absolute maximum ratings. The XC3164A-3TQ144C requires external level translators when interfacing with 3.3V devices.

What is the maximum operating frequency of XC3164A-3TQ144C?

The XC3164A-3TQ144C has a -3 speed grade specifying a maximum internal CLB path delay of 12 ns, corresponding to a theoretical maximum clock frequency of 83 MHz under worst-case commercial temperature and voltage conditions. Actual system-level timing depends on routing congestion, I/O setup/hold times, and external load capacitance - verified through place-and-route tools like Xilinx Foundation or third-party FPGA design suites compatible with XC3000 architecture.

Is XC3164A-3TQ144C pin-compatible with other XC31xx devices?

The XC3164A-3TQ144C shares the TQFP-144 package footprint with XC3136A-3TQ144C and XC3190A-3TQ144C, but pin functions differ across models due to varying CLB counts and I/O bank allocations. No official pin-to-pin compatibility is documented. Interchangeability requires full schematic and layout review - the XC3164A-3TQ144C cannot be substituted without verifying signal mapping and timing constraints.

What thermal considerations apply to XC3164A-3TQ144C in continuous operation?

The XC3164A-3TQ144C has a junction-to-ambient thermal resistance (θ_JA) of 45°C/W in standard FR-4 PCB mounting. At full static current draw (~120 mA), self-heating exceeds 5°C above ambient - adequate for commercial environments with airflow. For sustained operation above 60°C ambient, derating or heatsinking is recommended. The XC3164A-3TQ144C does not include thermal shutdown circuitry and relies on external thermal management.