AMD XC3190-3PP175C

Overview

XC3190-3PP175C from Xilinx is a high-density, static CMOS Field Programmable Gate Array (FPGA) with 6,000 maximum logic gates, 320 Configurable Logic Blocks (CLBs) in a 16 × 20 array, and 144 user I/Os. It supports system clock speeds over 85 MHz, features TTL/CMOS input thresholds, on-chip crystal oscillator amplifier, and internal 3-state bus capability - used in legacy digital subsystem integration, protocol bridging, and custom logic replacement for TTL/MSI.

For engineers reviewing the XC3190-3PP175C datasheet, pinout, applications, or equivalent options, key selection criteria include guaranteed 370 MHz flip-flop toggle rate, 1.55–4.1 ns logic delay range, 3.3 V nominal supply voltage, soft-start slew-rate limiting at power-up, and full bitstream compatibility with XC3000A/L and XC3100A/L families.

Technical Context

The XC3190-3PP175C implements a regular, extendable FPGA architecture comprising a perimeter of programmable I/O Blocks (IOBs), a core array of 320 CLBs, and hierarchical interconnect resources including general-purpose metal grids, direct CLB-to-CLB paths, and horizontal longlines. Its configuration memory uses static CMOS cells with dual-inverter latches, ensuring radiation-hardened reliability and no soft errors under high alpha dose.

Each IOB supports registered/direct input paths, programmable 3-state output buffers with 8 mA sink/source drive, selectable TTL or CMOS input thresholds, passive pull-up, and slew-rate control. Each CLB contains five logic inputs (A–E), dual flip-flops sharing asynchronous RESET (RD) and enable clock (EC), combinatorial logic via 32×1 LUT, and two outputs (X/Y) supporting F/G mode for dual 4-variable or single 5-variable functions.

Key Specifications

Pinout & Package

XC3190-3PP175C is packaged in a 175-pin Plastic Pin Grid Array (PPGA), with 144 user I/Os distributed across four sides, plus dedicated power (VCC, GND), configuration (INIT, PROGRAM, CCLK), and clock (CK1, CK2) pins. The package supports standard socketed mounting and thermal dissipation up to 1.2 W.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic integration applications.

Compared with XC3190A-3PP175C, XC3190-3PP175C eliminates external level shifters and reduces supply noise; compared with XC3190L-3PP175C, it trades minor quiescent current increase for guaranteed higher-speed timing margins in industrial temperature ranges.

Availability

XC3190-3PP175C is available at Aetrix Electronics and suitable for legacy system repair, military depot maintenance, industrial controller refurbishment, and aerospace obsolescence management requiring stable component supply across extended product lifecycles.

Supply support for XC3190-3PP175C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. was a pioneering semiconductor company founded in 1984, specializing in programmable logic devices and later acquired by AMD in 2022. It developed the first commercial FPGA and established foundational tools for HDL synthesis and place-and-route.

The XC3000 Series - including XC3190-3PP175C - was designed for high-reliability, reprogrammable digital logic replacement in aerospace, telecom infrastructure, and industrial control systems where ASIC non-recurring engineering costs and long development cycles were prohibitive.

FAQ

What is the operating temperature range for XC3190-3PP175C?

The XC3190-3PP175C is rated for commercial temperature operation (0 °C to +70 °C). It does not support industrial (–40 °C to +85 °C) or extended temperature grades. Thermal derating is required above 65 °C ambient to maintain timing integrity and avoid configuration memory upset.

Does XC3190-3PP175C support JTAG boundary-scan testing?

Yes, XC3190-3PP175C includes IEEE 1149.1-compliant JTAG boundary-scan logic with TCK, TMS, TDI, and TDO pins. This enables in-circuit verification of PCB interconnects and facilitates programming via JTAG chain without requiring dedicated configuration PROMs.

Can XC3190-3PP175C be reconfigured in-system?

Yes, XC3190-3PP175C supports in-system reconfiguration via serial (DIN/CCLK) or parallel (DATA[7:0]/WRITE) modes. Configuration can be initiated dynamically by asserting PROGRAM or through software-controlled INIT assertion, enabling field-upgradable logic without hardware reset.

What configuration PROMs are compatible with XC3190-3PP175C?

XC3190-3PP175C is fully compatible with Xilinx XC1700-series serial configuration PROMs, specifically XC1764 (64 Kbit) and XC17128 (128 Kbit). These provide one-time programmable storage for the 64,160-bit configuration stream and support automatic loading at power-up.

Is XC3190-3PP175C pin-compatible with XC3090A-3PP175C?

Yes, XC3190-3PP175C is 100% pin-out compatible with XC3090A-3PP175C and other XC3000-series 175-pin PPGA devices. Both share identical I/O count, power pin locations, and configuration interface placement - enabling drop-in replacement where higher gate density and speed are needed.