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AMD XC3190-4PP175C

Part No.:
XC3190-4PP175C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
175-BPGA
Datasheet:
AetrixXC3190-4PP175C.pdf
Description:
FPGA, 320 CLBS, 5000 GATES
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:140

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Product details

Overview

XC3190-4PP175C from Xilinx is a high-performance, 6,000-gate Field Programmable Gate Array (FPGA) in the XC3100A family, featuring a 16 × 20 Configurable Logic Block (CLB) array, 144 user I/Os, and guaranteed 370 MHz flip-flop toggle rates. It implements synchronous digital logic using static CMOS configuration memory, supports TTL/CMOS input thresholds, and integrates on-chip crystal oscillator amplifier for clock generation - used in legacy telecom interface logic and industrial control subsystems.

For engineers reviewing the XC3190-4PP175C datasheet, pinout, applications, or equivalent options, key selection criteria include its 175-pin plastic PGA package, -4 speed grade (4.1 ns logic delay), commercial temperature range (0°C to 70°C), and bitstream compatibility with XC3000A/XC3000L families.

Technical Context

The XC3190-4PP175C implements a regular, extendable architecture comprising a perimeter of programmable Input/Output Blocks (IOBs), a core array of 320 Configurable Logic Blocks (CLBs), and hierarchical interconnect resources including general-purpose metal grids, direct CLB-to-CLB paths, and horizontal longlines. Each CLB contains dual 4-input LUTs, two edge-triggered D flip-flops, programmable clock polarity, and shared asynchronous reset (RD) and enable clock (EC).

Configuration is loaded via serial or parallel mode into distributed static memory cells; the device supports automatic power-up initialization using external PROMs (e.g., XC17XX series). IOBs provide registered/direct I/O paths, slew-rate controlled outputs, programmable pull-ups, and soft-start output activation to suppress ground bounce during initial power-up.

Key Specifications

Parameter Value and Actual Design Meaning
Logic Capacity 6,000 system gates (5,000–6,000 typical gate range)
CLB Array Size 16 × 20 = 320 CLBs; each CLB provides dual 4-LUTs + 2 FFs
Max User I/Os 144 bidirectional pins with TTL/CMOS threshold selection
Logic Delay 4.1 ns (for -4 speed grade); determines critical path timing budget
Flip-Flop Toggle Rate 370 MHz guaranteed; enables high-speed state machine operation
Supply Voltage 5.0 V ± 5%; not compatible with 3.3 V operation
Configuration Memory 64,160 bits of static CMOS memory; non-volatile only when paired with external PROM

Pinout & Package

XC3190-4PP175C uses a 175-pin plastic pin-grid array (PPGA) package with 144 user I/Os, 12 dedicated power/ground pins, and 19 configuration/control pins (including INIT, PROGRAM, CCLK, DIN, DONE, and global RESET). Pin numbering follows standard PPGA layout with corner reference markers.

Pin/Terminal Circuit Role Design Meaning
DIN Serial Configuration Data Input Accepts bitstream during master serial or slave serial configuration modes
CCLK Configuration Clock Input Drives internal shift register; frequency ≤ 25 MHz for reliable loading
DONE Configuration Completion Indicator Open-drain output pulled high externally; goes active-high when config ends
INIT Initialization Status Output Active-low open-drain signal indicating configuration error or reset condition
PROGRAM Configuration Reset Input Active-low signal that clears configuration memory and resets internal logic
GCK1/GCK2 Global Clock Inputs Dedicated low-skew clock nets driving all CLBs and IOBs on respective die edges

Key Features

Feature Design Value
Soft Startup Automatically limits output slew rate at power-up to prevent simultaneous switching noise and ground bounce
Bitstream Compatibility Fully compatible with XC3000A, XC3000L, and XC3100L bitstreams; enables design migration without re-synthesis
On-Chip Oscillator Amplifier Allows direct connection of external crystal (1–20 MHz) to generate system clock without external oscillator IC
Error-Checked Configuration Verifies stop-bit positions in bitstream during load; halts config and asserts INIT if error detected
High Fan-Out Clock Distribution Low-skew global clock nets (GCK1/GCK2) support >1000 flip-flop loads with <1 ns skew across die

Applications

Telecom Line Interface Logic Industrial PLC I/O Expansion

Use Scenario: Implementing HDLC framing, CRC calculation, and T1/E1 line timing recovery in legacy base station backplanes.

IC Role / Device Role / Timing Role: Standalone protocol engine replacing discrete PALs and counters; provides deterministic 1.544 MHz/2.048 MHz clock domain translation.

Use Value: Eliminates 12+ SSI/MSI chips per board; reduces BOM cost by ~35% while maintaining full field-upgradability via reconfiguration.

Use Scenario: Adding isolated digital I/O, PWM motor control, and analog sensor preprocessing to modular PLC chassis.

IC Role / Device Role / Timing Role: Reconfigurable logic fabric handling real-time I/O arbitration, watchdog supervision, and safety-critical status encoding.

Use Value: Enables single-hardware platform for 7+ I/O module variants; reduces inventory SKUs and qualification cycles by consolidating logic functions.

Medical Imaging Data Formatter Avionics Display Controller

Use Scenario: Formatting raw CCD sensor data streams (12-bit @ 25 MSPS) into packed LVDS frames for FPGA-to-ASIC handoff.

IC Role / Device Role / Timing Role: High-speed parallel-to-serial converter with embedded sync-word insertion and error flag injection.

Use Value: Meets 25 ns setup/hold timing on pixel clocks using direct CLB-to-IOB routing; avoids external FIFOs and reduces latency by 42 ns.

Use Scenario: Managing discrete annunciator panel signals, discrete switch debouncing, and MIL-STD-1553B bus arbitration in cockpit display units.

IC Role / Device Role / Timing Role: Deterministic real-time sequencer synchronizing LED drivers, relay controls, and bus transceivers under DO-254 Level A constraints.

Use Value: Provides traceable, synthesizable RTL verified against timing closure reports; satisfies avionics DO-254 tool qualification requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic implementation applications.

Alternative Part Technical Difference Application Difference Selection Advice
XC3190A-4PP175C Same gate count, CLB array, and pinout; differs only in marking - "A" suffix denotes XC3100A family branding per datasheet revision No functional difference; identical speed grade (-4), package (PP175), and temperature range (C) Select XC3190A-4PP175C if documentation or legacy BOM references the "A" suffix explicitly
XC3090A-4PP175C 5,000–6,000 gate range same, but smaller 16 × 20 CLB array reduced to 16 × 16 (256 CLBs); 128 user I/Os vs. 144 Limited I/O count and lower toggle rate (320 MHz max) restrict use in high-channel-count interfaces Choose only if design fits within 128 I/Os and requires lower gate density to reduce static power

Compared with XC3190-4PP175C, XC3190A-4PP175C offers identical functionality with no design changes needed, while XC3090A-4PP175C trades 16 I/Os and 50 MHz toggle margin for lower cost and power - suitable only when full XC3190 capacity is unused.

Availability

XC3190-4PP175C is available at Aetrix Electronics and suitable for legacy telecom infrastructure upgrades, industrial control retrofit programs, and medical equipment life-extension projects requiring stable component supply and long-term traceability.

Supply support for XC3190-4PP175C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. was a pioneering semiconductor company founded in 1984, specializing in programmable logic devices and later acquired by AMD in 2022. It developed the first commercial FPGA architecture and established industry standards for reconfigurable computing.

The XC3100A family - including XC3190-4PP175C - was designed for high-speed, high-density custom logic replacement in mission-critical systems where design iteration, NRE avoidance, and deterministic timing were essential.

FAQ

What is the maximum operating frequency of the XC3190-4PP175C?

The XC3190-4PP175C has a guaranteed flip-flop toggle rate of 370 MHz and supports system clock speeds over 85 MHz. Its -4 speed grade specifies a worst-case logic delay of 4.1 ns, enabling reliable operation in synchronous designs with clock periods ≥11.8 ns. Actual achievable frequency depends on routing congestion and logic depth per critical path, but timing analysis tools confirm this limit under worst-case voltage/temperature conditions.

Does the XC3190-4PP175C support in-system reprogramming?

Yes, the XC3190-4PP175C supports in-system reprogramming via its serial configuration interface (DIN/CCLK/DONE/INIT). Configuration can be reloaded dynamically without power cycling, allowing field updates of logic functionality. However, reconfiguration erases current state; retention requires external state storage or use of dual-configuration images with fallback logic - a capability not natively built into the XC3190-4PP175C itself.

Is the XC3190-4PP175C pin-compatible with XC3000-series devices?

Yes, the XC3190-4PP175C is 100% pin-out compatible with XC3000A, XC3000L, XC3100A, and XC3100L families in the same package variant (PP175). This includes identical pin functions for I/O, power, ground, configuration, and clock inputs. No PCB redesign is required when migrating from XC3090A-4PP175C or XC3064A-4PP175C to XC3190-4PP175C, provided the same speed grade and temperature grade are maintained.

What configuration memory technology does the XC3190-4PP175C use?

The XC3190-4PP175C uses internal static CMOS memory cells for configuration storage - not flash or antifuse. These cells retain their state only while powered; configuration must be reloaded at power-up from an external serial PROM (e.g., XC17S100) or microcontroller. The memory cell design includes dual inverters and a pass transistor, providing high noise immunity and zero observed soft errors under alpha radiation testing - critical for industrial and telecom environments.

Can the XC3190-4PP175C operate at 3.3 V?

No, the XC3190-4PP175C is a 5 V-only device requiring VCC = 5.0 V ± 5%. It is not compatible with 3.3 V operation. For 3.3 V applications, Xilinx offered the XC3190L-4PP175C (low-voltage variant), which shares the same logic capacity and pinout but uses different process and I/O threshold circuitry. Mixing XC3190-4PP175C with 3.3 V peripherals requires level-shifting buffers on all I/O lines.

XC3190-4PP175C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
XC3100
Package/Case:
175-BPGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
320
Number of Logic Elements/Cells:
-
Total RAM Bits:
64160
Number of I/O:
144
Number of Gates:
-
Voltage - Supply:
4.75V ~ 5.25V
Mounting Type:
Through Hole
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Supplier Device Package:
175-PGA (42.16x42.16)

XC3190-4PP175C FAQ

1.How can I place an order for XC3190-4PP175C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC3190-4PP175C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC3190-4PP175C reliable?

The price and inventory of XC3190-4PP175C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3190-4PP175C is usually 5 days.

3.What payment methods are accepted for XC3190-4PP175C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3190-4PP175C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC3190-4PP175C?

XC3190-4PP175C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC3190-4PP175C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC3190-4PP175C?

For technical support, including XC3190-4PP175C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3190-4PP175C requirements.

6.How does Aetrix verify that XC3190-4PP175C is sourced from the original manufacturer or authorized distributors?

All XC3190-4PP175C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3190-4PP175C meets industry standards.

7.What is the process for return or replacement of XC3190-4PP175C?

All XC3190-4PP175C units undergo pre-shipment inspection (PSI). If there is an issue with XC3190-4PP175C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC3190-4PP175C part is unused and in its original packaging.

Return procedure for XC3190-4PP175C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC3190-4PP175C Tags

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