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AMD XC3190-4PP175I

Part No.:
XC3190-4PP175I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
175-BPGA
Datasheet:
AetrixXC3190-4PP175I.pdf
Description:
FPGA, 320 CLBS, 5000 GATES
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:309

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Product details

Overview

XC3190-4PP175I from Xilinx is a high-density, high-speed Field Programmable Gate Array (FPGA) with 6,000 logic gates, 320 Configurable Logic Blocks (CLBs) in a 16 × 20 array, and 144 user I/Os. It supports system clock speeds over 85 MHz, features TTL/CMOS input thresholds, on-chip crystal oscillator amplifier, and internal 3-state bus capability - used in legacy telecom interface logic, industrial control subsystems, and reconfigurable digital signal path routing.

For engineers reviewing the XC3190-4PP175I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture compatibility, confirmed CLB count and I/O mapping, toggle rate specifications, Soft Startup behavior, and real-world FPGA replacement guidance for obsolescence mitigation.

Technical Context

The XC3190-4PP175I belongs to the XC3100A family - an architecture-identical, performance-optimized extension of the XC3000A series, fabricated on an advanced CMOS process. It delivers guaranteed flip-flop toggle rates up to 370 MHz and logic delays as low as 1.55 ns, with full bitstream and footprint compatibility across XC3000A/L and XC3100A/L families.

Its configuration memory uses static CMOS cells with dual-inverter latches and write-pass transistors, ensuring radiation-hardened stability and no soft errors under alpha exposure. The device implements Soft Startup - slew-rate limiting all outputs during initial power-up - and includes error-checking of configuration bitstreams via stop-bit validation.

Key Specifications

Parameter Value and Actual Design Meaning
Logic Capacity 6,000 gates (5,000–6,000 typical range), enabling medium-complexity digital subsystem integration in single-package form.
CLB Count & Array 320 CLBs arranged in 16 × 20 grid - defines maximum combinational/sequential logic density and routing resource scaling.
User I/O Pins 144 user-programmable I/Os with configurable TTL/CMOS thresholds, pull-up, slew rate, and 3-state control.
Toggle Rate Guaranteed 370 MHz flip-flop toggle rate - sets upper bound for synchronous state-machine clocking frequency.
Logic Delay 1.55 ns minimum propagation delay - determines critical path timing margin for high-speed combinatorial logic.
Configuration Bits 64,160 bits - defines external PROM size requirement (e.g., XC1764 or equivalent) for serial configuration.
Power Supply 5 V ±10% nominal - requires standard 5 V rail; quiescent current ≤5 mA in power-down mode.

Pinout & Package

XC3190-4PP175I is packaged in a 175-pin Plastic Pin Grid Array (PPGA), with 144 user I/Os distributed across four sides and dedicated power/ground pins per quadrant. The package supports standard socketed or soldered mounting in legacy high-reliability systems.

Pin/Terminal Circuit Role Design Meaning
VCC / GND Power supply and ground reference Dual-rail distribution across package corners ensures stable core and I/O voltage delivery; decoupling required per quadrant.
IO[0]–IO[143] Configurable bidirectional I/O Each supports registered/direct input, registered/direct output, 3-state control, programmable slew rate, and TTL/CMOS threshold selection.
CLK1 / CLK2 Global clock inputs Two edge-selectable clocks per die edge; polarity programmable per CLB/IOB - enables multi-domain clocking without external inversion.
INIT / PROGRAM / RESET Configuration and reset control INIT signals configuration completion status; PROGRAM initiates reload; active-Low RESET clears all flip-flops synchronously during config or runtime.
TDI / TDO / TCK / TMS JTAG boundary-scan interface IEEE 1149.1-compliant test access port - enables in-system verification, readback, and debug without dedicated programming hardware.

Key Features

Feature Design Value
Soft Startup Automatically limits output slew rate at power-up to prevent ground bounce - eliminates need for external sequencing or staggered enable circuits.
Bitstream Error Checking Validates stop bits in configuration data stream; halts load and pulls INIT Low on error - prevents partial or corrupted configuration.
Architecture Compatibility Fully upward-compatible with XC3000A/L bitstreams; same CLB structure, IOB layout, and interconnect routing - enables drop-in migration from smaller devices.
On-Chip Oscillator Amplifier Drives external crystal or ceramic resonator directly - reduces BOM count and board space vs. discrete oscillator + buffer solution.
Internal 3-State Bus Native support for tri-state-controlled data busing across CLBs and IOBs - avoids external bus transceivers in shared-memory or peripheral interface designs.

Applications

Telecom Line Interface Logic Industrial PLC I/O Expansion

Use Scenario: Implementing protocol-specific framing, CRC generation, and HDLC controller logic for E1/T1 line cards in legacy telecom switches.

IC Role / Device Role / Timing Role: Replaces multiple PLDs and gate arrays; provides deterministic timing for bit-synchronous data capture and parallel-to-serial conversion.

Use Value: Reduces component count by >70% vs. discrete logic; leverages 1.55 ns logic delay to meet 2.048 MHz frame sync timing budgets.

Use Scenario: Adding custom digital I/O conditioning, debounce, and safety interlock logic to modular PLC backplanes.

IC Role / Device Role / Timing Role: Acts as field-configurable glue logic between CPU bus and opto-isolated I/O modules; handles asynchronous input sampling and synchronized output update.

Use Value: Enables firmware-updatable logic behavior without hardware change; 144 I/Os support up to 64-channel expansion per module.

Reconfigurable Signal Routing Matrix Legacy Test Equipment Pattern Generator

Use Scenario: Dynamic routing of digital stimulus signals between DUT ports and measurement instruments in ATE systems.

IC Role / Device Role / Timing Role: Functions as a programmable crosspoint switch fabric with sub-ns routing latency and glitch-free switching.

Use Value: Achieves <10 ns path skew across 144 I/Os using low-skew clock nets and direct interconnect - meets IEEE 1149.4 boundary-scan timing requirements.

Use Scenario: Generating high-fidelity, multi-phase digital test vectors for ASIC validation in wafer sort and final test handlers.

IC Role / Device Role / Timing Role: Serves as vector sequencer and timing engine; synchronizes pattern memory address counters with programmable strobes.

Use Value: 370 MHz toggle rate supports 185 MHz pattern rate; CLB-based counters eliminate external timing chips and reduce jitter.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic integration applications.

Alternative Part Technical Difference Application Difference Selection Advice
XC3190A-4PQ208I Same 6,000-gate XC3100A architecture but in 208-pin PQFP package; 176 I/Os vs. 144; identical speed grade (-4) and temperature range (I). Requires PCB redesign due to larger footprint and different pinout; better I/O count suits higher-channel-count systems. Select when additional I/Os or surface-mount assembly is required; not pin-compatible with XC3190-4PP175I.
XC3090A-4PP175I Same 175-pin PPGA package and pinout; lower 5,000–6,000 gate capacity; identical -4 speed grade and industrial temp rating. Offers reduced logic density at same package size - suitable for cost-optimized or lower-complexity replacements where CLB count is not fully utilized. Valid drop-in replacement if design uses ≤280 CLBs; verified pin-to-pin and functionally compatible per Xilinx documentation.

Compared with XC3190-4PP175I, XC3190A-4PQ208I trades package compatibility for higher I/O count and surface-mount suitability, while XC3090A-4PP175I offers identical packaging and pinout with lower gate count - making it the only true drop-in alternative for logic-downsized legacy upgrades.

Availability

XC3190-4PP175I is available at Aetrix Electronics and suitable for telecom infrastructure spares, industrial control retrofit programs, and legacy test equipment repair requiring stable component supply across extended product lifecycles.

Supply support for XC3190-4PP175I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company founded in 1984, specializing in programmable logic devices and now part of AMD. It introduced the first commercial FPGA and defined industry standards for reconfigurable computing.

The XC3000 Series - including XC3190-4PP175I - was designed for high-reliability, medium-complexity digital logic replacement in telecom, industrial, and instrumentation systems where mask-programmed gate arrays posed NRE and schedule risk.

FAQ

What is the operating temperature range for XC3190-4PP175I?

The XC3190-4PP175I is rated for industrial temperature operation from –40°C to +85°C. This range is confirmed in the November 1998 XC3000 Series datasheet (Version 3.1), where the "I" suffix explicitly denotes industrial-grade qualification. All timing specifications, including the 370 MHz toggle rate and 1.55 ns logic delay, are guaranteed across this full range.

Is XC3190-4PP175I pin-compatible with other XC3100A devices?

Yes, XC3190-4PP175I shares identical pinout with all XC3100A devices in the 175-pin PPGA package, including XC3090A-4PP175I and XC3195A-4PP175I. Xilinx documentation confirms full footprint compatibility across the XC3000A/L and XC3100A/L families - enabling mechanical interchangeability where package constraints allow.

Does XC3190-4PP175I support JTAG boundary-scan testing?

Yes, XC3190-4PP175I implements IEEE 1149.1-compliant JTAG test access port (TAP) with TDI, TDO, TCK, and TMS pins. This allows in-system configuration, readback of configuration memory, and boundary-scan testing - verified in the Functional Description section of the XC3000 Series datasheet (pp. 7-10–7-12).

What configuration PROMs are compatible with XC3190-4PP175I?

The XC3190-4PP175I requires 64,160 configuration bits and is compatible with Xilinx XC1764 (64 Kbit serial PROM) and XC17128 (128 Kbit serial PROM). These PROMs support daisy-chain loading and are explicitly listed in Xilinx Application Note XAPP058 for XC3000-series configuration.

Can XC3190-4PP175I be reprogrammed in-system?

Yes, XC3190-4PP175I supports in-system reprogramming via its dedicated PROGRAM pin and serial configuration interface. Configuration data can be reloaded dynamically without power cycle, enabling field-upgradable logic behavior - a core feature emphasized in the "Unlimited reprogrammability" section of the XC3000 Series documentation.

XC3190-4PP175I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
XC3000
Package/Case:
175-BPGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
320
Number of Logic Elements/Cells:
320
Total RAM Bits:
64160
Number of I/O:
144
Number of Gates:
6000
Voltage - Supply:
4.5V ~ 5.5V
Mounting Type:
Through Hole
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
175-PGA (42.16x42.16)

XC3190-4PP175I FAQ

1.How can I place an order for XC3190-4PP175I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC3190-4PP175I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC3190-4PP175I reliable?

The price and inventory of XC3190-4PP175I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3190-4PP175I is usually 5 days.

3.What payment methods are accepted for XC3190-4PP175I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3190-4PP175I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC3190-4PP175I?

XC3190-4PP175I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC3190-4PP175I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC3190-4PP175I?

For technical support, including XC3190-4PP175I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3190-4PP175I requirements.

6.How does Aetrix verify that XC3190-4PP175I is sourced from the original manufacturer or authorized distributors?

All XC3190-4PP175I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3190-4PP175I meets industry standards.

7.What is the process for return or replacement of XC3190-4PP175I?

All XC3190-4PP175I units undergo pre-shipment inspection (PSI). If there is an issue with XC3190-4PP175I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC3190-4PP175I part is unused and in its original packaging.

Return procedure for XC3190-4PP175I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC3190-4PP175I Tags

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