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AMD XC3190-5PP175C

Part No.:
XC3190-5PP175C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
175-BPGA
Datasheet:
AetrixXC3190-5PP175C.pdf
Description:
FPGA, 320 CLBS, 5000 GATES
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:404

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Product details

Overview

XC3190-5PP175C from Xilinx is a high-density Field Programmable Gate Array (FPGA) with 6,000 logic gates, 320 Configurable Logic Blocks (CLBs) in a 16 × 20 array, 144 user I/Os, and guaranteed 190 MHz flip-flop toggle rate. It implements custom digital logic using static memory-based configuration, supports TTL/CMOS input thresholds, and integrates subsystems into a single package for telecom interface logic and industrial control state machines.

For engineers reviewing the XC3190-5PP175C datasheet, pinout, applications, or equivalent options, key selection criteria include CLB count, I/O count, toggle rate, configuration memory size (64,160 bits), and compatibility with XC3000A/XC3100A bitstreams and pinouts.

Technical Context

The XC3190-5PP175C uses a distributed static memory configuration architecture with perimeter I/O Blocks (IOBs), a core array of CLBs, and programmable interconnect resources including horizontal longlines, general-purpose metal grids, and direct CLB-to-CLB routing paths. Each CLB contains dual flip-flops, five logic inputs (A–E), programmable clock inversion, and a 32×1 look-up table supporting two 4-variable functions or one 5-variable function.

IOBs provide registered/direct input paths, programmable 3-state output buffers with 8 mA sink/source drive, slew-rate control, soft startup at power-up, and configurable TTL/CMOS input thresholds. Configuration data is loaded serially or in byte-parallel mode, with error checking on stop-bit positions and automatic initialization from external PROMs like XC17XX series.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Gates6,000 max - defines total combinational logic capacity for system integration
Configurable Logic Blocks320 CLBs in 16 × 20 array - determines granularity and routing flexibility for logic partitioning
User I/O Pins144 - supports high-pin-count interfaces such as parallel buses or multi-channel peripherals
Flip-Flop Toggle Rate190 MHz - sets maximum synchronous register-to-register frequency for timing-critical paths
Logic Delay1.55 ns - specifies minimum propagation delay through combinatorial logic path
Configuration Bits64,160 bits - defines external PROM size requirement and bitstream storage footprint
Supply Voltage5 V ± 10% - requires standard TTL-compatible power rail; not 3.3 V compatible
Operating Temperature0 °C to +70 °C - commercial-grade thermal range suitable for non-extended-environment applications

Pinout & Package

XC3190-5PP175C is packaged in a 175-pin Plastic Pin Grid Array (PPGA) with 1.27 mm pitch, 27.94 mm × 27.94 mm body size, and 3.56 mm height. The package supports full I/O access on all four sides with dedicated power/ground pins distributed for noise reduction.

Pin/TerminalCircuit RoleDesign Meaning
VCCPower Supply5 V main supply for core and I/O circuitry; multiple pins required for current distribution
GNDGround ReferenceCommon return path for logic and I/O; distributed across package to minimize ground bounce
I/O[0]–I/O[143]Programmable Bidirectional InterfaceConfigurable as input, output, or 3-state; supports TTL/CMOS thresholds and slew-rate control
CLK1, CLK2Global Clock InputsDual edge-programmable clocks driving CLB and IOB registers; polarity selectable per die edge
INITConfiguration InitializationActive-low open-drain signal indicating configuration status; pulled low on bitstream error
PROGRAMConfiguration ResetActive-low input forcing device into configuration mode; resets internal logic and memory
RESETGlobal Asynchronous ResetActive-low chip-wide reset for all CLB and IOB registers; overrides clocked operation

Key Features

FeatureDesign Value
Bitstream CompatibilityFully compatible with XC3000A, XC3000L, XC3100A, and XC3100L families - enables reuse of existing design files and tool flows
Soft StartupAutomatically limits output slew rate during first activation after configuration - prevents simultaneous switching noise and ground bounce
Configuration Error CheckingVerifies stop-bit positions in bitstream during load - terminates configuration and asserts INIT if error detected
On-Chip Crystal Oscillator AmplifierIntegrated amplifier supports external crystal connection - eliminates need for discrete oscillator circuitry in clock generation
High Fan-Out Signal DistributionHorizontal longlines and low-skew clock nets support >100 fan-out without added buffers - reduces board-level routing complexity
Internal 3-State Bus CapabilityProgrammable 3-state control per IOB output - enables time-multiplexed bus sharing without external transceivers

Applications

Telecom Line InterfaceIndustrial PLC Logic Core

Use Scenario: Implementing HDLC framing, CRC calculation, and T1/E1 line timing in base station backhaul modules.

IC Role / Device Role / Timing Role: FPGA fabric executing protocol engines and state machines; provides deterministic timing via dedicated clock nets and registered I/O.

Use Value: Replaces multiple PLDs and gate arrays with single device, reducing BOM count and enabling field-upgradable protocol stacks.

Use Scenario: Real-time ladder logic execution and I/O scanning in modular programmable logic controllers.

IC Role / Device Role / Timing Role: Configurable logic block executing scan-cycle logic; IOBs handle isolated digital input conditioning and relay driver interfacing.

Use Value: Supports 144 discrete I/O points with programmable slew control and TTL/CMOS threshold selection, eliminating external level translators.

Medical Imaging Data PathTest Equipment Pattern Generator

Use Scenario: Pixel data aggregation, FIFO buffering, and parallel-to-serial conversion in ultrasound beamformer modules.

IC Role / Device Role / Timing Role: High-speed data path controller using CLB-based shift registers and longline-bused interconnect; synchronized to 85 MHz system clock.

Use Value: Achieves 190 MHz register-to-register toggle rate for pixel clock domain crossing, meeting real-time latency requirements.

Use Scenario: Generating multi-channel digital stimulus waveforms with precise skew control for ATE systems.

IC Role / Device Role / Timing Role: Programmable pattern generator using CLB LUTs and registered outputs; IOBs deliver synchronized waveforms with controlled slew rates.

Use Value: Enables sub-nanosecond inter-channel skew tuning via direct CLB-to-IOB routing and programmable output inversion.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic implementation applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC3190A-5PP175CSame gate count, CLB count, and pinout; identical speed grade (-5) and package; differs only in family suffix denoting XC3100A lineageNo functional difference; both support same development tools, bitstreams, and configuration methodsSelect XC3190A-5PP175C when sourcing from distributors listing XC3100A-family variants explicitly
XC3090A-5PP175CLower density: 5,000–6,000 gate range, 320 CLBs, but 120 I/Os vs. 144; same -5 speed grade and PP175 packageSuitable for designs requiring fewer I/Os or lower routing resource demand; reduced configuration bit count (46,064 vs. 64,160)Choose XC3090A-5PP175C for cost-sensitive applications where 24 fewer I/Os and smaller PROM footprint are acceptable

Compared with XC3190-5PP175C, XC3190A-5PP175C offers identical functionality and pinout, while XC3090A-5PP175C trades 24 I/Os and 18,096 configuration bits for lower unit cost and reduced board-level PROM size - both remain viable for legacy XC3000-series designs requiring 5 V operation and commercial temperature range.

Availability

XC3190-5PP175C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, medical imaging, and test equipment applications requiring stable component supply and long-term obsolescence management.

Supply support for XC3190-5PP175C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company founded in 1984, specializing in programmable logic devices and adaptive computing solutions.

The XC3000 Series - including XC3190-5PP175C - was designed for high-density, reprogrammable digital logic implementation in cost-sensitive, volume-production systems requiring 5 V TTL compatibility and field-upgradable functionality.

FAQ

What is the maximum operating frequency supported by XC3190-5PP175C?

The XC3190-5PP175C guarantees a 190 MHz flip-flop toggle rate and supports system clock speeds over 85 MHz. Its 1.55 ns logic delay and low-skew clock distribution enable reliable operation at these frequencies in properly constrained designs. Timing closure depends on placement, routing, and I/O loading - actual achievable frequency must be verified using Xilinx Foundation or M1 software timing analysis tools with the XC3190-5PP175C speed file.

Is XC3190-5PP175C compatible with modern Xilinx development tools?

XC3190-5PP175C is supported only by legacy Xilinx development tools, including Foundation Series 1.x and M1 software released prior to 2000. It is not supported by ISE, Vivado, or any post-2005 Xilinx toolchain. Users must retain original floppy disk or archived CD-ROM versions of Foundation F1.5 or M1.5 to synthesize, place-and-route, and generate bitstreams for XC3190-5PP175C.

Does XC3190-5PP175C support in-system programming?

XC3190-5PP175C supports in-system configuration via serial or parallel modes using external PROMs (e.g., XC17128), but does not support in-system reprogramming of its internal static configuration memory. Configuration is volatile - the device must reload its bitstream from external memory at each power-up. True in-system programmability (ISP) requires external JTAG or microcontroller-controlled PROM reload, not native device capability.

What is the configuration memory technology used in XC3190-5PP175C?

XC3190-5PP175C uses static CMOS memory cells for configuration storage - each cell consists of two cross-coupled inverters and a pass transistor. This design provides high noise immunity and radiation tolerance, with no observed soft errors under alpha particle exposure. Unlike SRAM-based FPGAs, these cells retain state indefinitely when powered but require external non-volatile storage (PROM/EEPROM) for persistent configuration.

Can XC3190-5PP175C operate at 3.3 V?

No, XC3190-5PP175C is a 5 V-only device specified for 4.5 V to 5.5 V operation. It belongs to the XC3100A family, which does not include low-voltage variants. For 3.3 V operation, designers must select XC3190L-series parts (e.g., XC3190L-5PQ208C), which are architecturally identical but rated for 3.0–3.6 V supply and exhibit reduced speed performance.

XC3190-5PP175C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
XC3100
Package/Case:
175-BPGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
320
Number of Logic Elements/Cells:
-
Total RAM Bits:
64160
Number of I/O:
144
Number of Gates:
-
Voltage - Supply:
4.75V ~ 5.25V
Mounting Type:
Through Hole
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Supplier Device Package:
175-PGA (42.16x42.16)

XC3190-5PP175C FAQ

1.How can I place an order for XC3190-5PP175C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC3190-5PP175C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC3190-5PP175C reliable?

The price and inventory of XC3190-5PP175C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3190-5PP175C is usually 5 days.

3.What payment methods are accepted for XC3190-5PP175C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3190-5PP175C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC3190-5PP175C?

XC3190-5PP175C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC3190-5PP175C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC3190-5PP175C?

For technical support, including XC3190-5PP175C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3190-5PP175C requirements.

6.How does Aetrix verify that XC3190-5PP175C is sourced from the original manufacturer or authorized distributors?

All XC3190-5PP175C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3190-5PP175C meets industry standards.

7.What is the process for return or replacement of XC3190-5PP175C?

All XC3190-5PP175C units undergo pre-shipment inspection (PSI). If there is an issue with XC3190-5PP175C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC3190-5PP175C part is unused and in its original packaging.

Return procedure for XC3190-5PP175C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC3190-5PP175C Tags

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