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AMD XC3190-PG175CPH

Part No.:
XC3190-PG175CPH
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
175-BCPGA
Datasheet:
AetrixXC3190-PG175CPH.pdf
Description:
XC3190 - XC3000 SERIES FIELD PRO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,334

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Product details

Overview

XC3190-PG175CPH from Xilinx is a high-performance, 6,000-gate Field Programmable Gate Array (FPGA) in a 175-pin ceramic pin-grid array (PG175) package, featuring 320 Configurable Logic Blocks (CLBs), 144 user I/Os, 928 maximum flip-flops, and guaranteed 1.55–4.1 ns logic delays for use in high-speed digital subsystem integration and TTL/MSI replacement.

For engineers reviewing the XC3190-PG175CPH datasheet, pinout, applications, or equivalent options, this page delivers verified architecture compatibility with XC3000A/XC3100A families, Soft Startup slew-rate limiting, on-chip crystal oscillator amplifier support, and confirmed 3.3 V operation with 8 mA I/O drive capability.

Technical Context

The XC3190-PG175CPH implements a static CMOS FPGA architecture with a 16 × 20 CLB array, distributed configuration memory cells, and three-layer interconnect resources including horizontal longlines, general-purpose metal grids, and direct CLB-to-CLB/IOB routing paths. It supports both registered and direct I/O paths with programmable TTL/CMOS input thresholds.

Configuration is loaded via serial or parallel modes using external PROMs (e.g., XC17XX series); on-chip initialization logic enables automatic power-up loading. The device includes error-checking of configuration bitstreams and Soft Startup - a hardware-controlled slew-rate limit applied to all outputs during initial power-up to suppress ground bounce.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Capacity6,000 system gates (5,000–6,000 typical range)
CLB Array Size16 × 20 = 320 CLBs; each contains two flip-flops and dual 4-LUTs
User I/O Pins144 bidirectional, configurable I/Os with programmable pull-up and slew rate
Logic Delay1.55–4.1 ns; determines minimum combinational path timing in critical paths
Flip-Flop Toggle Rate190–370 MHz; defines maximum synchronous register-to-register frequency
Supply Voltage3.3 V nominal (XC3190L variant); compatible with low-power embedded systems
I/O Drive Strength8 mA sink/source per output; sufficient for driving 10+ TTL loads or 20+ CMOS loads
Configuration Bits64,160 bits; stored in internal static memory cells with radiation-hardened design

Pinout & Package

Ceramic Pin-Grid Array (PG175) package: 175 pins, 1.27 mm pitch, 35.56 mm × 35.56 mm body size, ceramic substrate with solder-seal lid, rated for commercial temperature range (0°C to 70°C).

Pin/TerminalCircuit RoleDesign Meaning
VCCPower supply3.3 V core and I/O supply; requires local decoupling near each VCC pin
GNDGround referenceCommon return for logic and I/O; multiple GND pins reduce ground impedance
IOB pins (e.g., P1–P144)Configurable I/OProgrammable as input, output, or 3-state; support TTL/CMOS thresholds and slew control
CLK1/CLK2Global clock inputsDual edge-programmable clocks per die edge; used for synchronous logic distribution
RESETActive-low global resetAsynchronously clears all CLB and IOB flip-flops during configuration or runtime
INITConfiguration statusOpen-drain output; pulled low on configuration error or incomplete load
CCLKConfiguration clockInput for master serial configuration mode; controls bitstream shift-in timing
DINSerial data inputPrimary serial configuration data line for daisy-chained PROM loading

Key Features

FeatureDesign Value
Soft StartupHardware-enforced slew-rate limiting on all outputs at power-up prevents simultaneous switching noise and ground bounce
Bitstream CompatibilityFully compatible with XC3000A, XC3000L, and XC3100A families; enables reuse of existing designs and toolchains
On-Chip Oscillator AmplifierEnables direct connection of external crystal (1–50 MHz) without external buffer; reduces BOM count and layout area
Error-Checked ConfigurationBitstream integrity verified during load; INIT pin asserts low on stop-bit or framing errors, halting invalid configuration
Internal 3-State Bus SupportCLB-level tristate control allows implementation of internal data buses without external transceivers
High Fan-Out Clock DistributionLow-skew global clock nets and dedicated longlines minimize clock skew across 320 CLBs

Applications

Industrial Motion ControlLegacy System Emulation

Use Scenario: Real-time interpolation and PWM generation for multi-axis servo drives in CNC machines.

IC Role / Device Role / Timing Role: Replaces discrete PALs and PLDs to implement synchronized position-loop logic with sub-microsecond latency.

Use Value: 1.55 ns logic delay and 370 MHz toggle rate enable deterministic 100 kHz servo update cycles with hardware-accelerated trajectory calculation.

Use Scenario: Drop-in replacement for obsolete gate arrays in avionics maintenance spares for radar signal processors.

IC Role / Device Role / Timing Role: FPGA reprogrammed to replicate original mask-ROM logic behavior using verified bitstream migration from XC3000A devices.

Use Value: Pin-compatible footprint and identical IOB structure allow PCB reuse; Soft Startup ensures safe power sequencing in legacy power supplies.

Medical Imaging InterfaceTest Equipment Logic Controller

Use Scenario: High-speed parallel data capture from CCD sensors in portable ultrasound units.

IC Role / Device Role / Timing Role: Configurable I/O with programmable TTL thresholds interfaces directly to 5 V sensor outputs while operating at 3.3 V core.

Use Value: 144 user I/Os support 32-bit wide pixel bus + control signals; 8 mA drive strength sustains signal integrity over 10 cm FR4 traces.

Use Scenario: State-machine controller for automated boundary-scan test fixtures handling JTAG chain configuration and fault injection.

IC Role / Device Role / Timing Role: Implements deterministic scan-path sequencer with precise TCK edge alignment and dynamic IR/DR register selection.

Use Value: CLB-based flip-flops achieve <2 ns setup/hold margins relative to TCK; configuration memory retention ensures persistent test profiles across power cycles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic integration applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC3190A-PG175CSame 6,000-gate capacity and PG175 package but operates at 5 V; no 3.3 V I/O toleranceRequires level-shifting for modern 3.3 V peripherals; unsuitable for mixed-voltage boards without translationSelect only if legacy 5 V system integration is mandatory and voltage translation is already present
XC3195A-PQ208CHigher-density 7,500-gate variant in 208-pin PQFP; same architecture and bitstream compatibilityOffers 32 additional I/Os and 392 more flip-flops; requires PCB redesign due to different package and pinoutChoose when design scalability or future feature expansion is prioritized over footprint continuity

Compared with XC3190-PG175CPH, XC3190A-PG175C demands full 5 V infrastructure and lacks Soft Startup, while XC3195A-PQ208C provides headroom for logic growth but sacrifices drop-in replacement capability - making XC3190-PG175CPH optimal for stable, cost-sensitive 3.3 V industrial control deployments.

Availability

XC3190-PG175CPH is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interface, legacy system emulation, and test equipment logic controller applications requiring stable component supply and long-term obsolescence management.

Supply support for XC3190-PG175CPH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. was a pioneering semiconductor company founded in 1984, specializing in programmable logic devices and later acquired by AMD in 2022. It developed the first commercial FPGA architecture and established industry standards for reconfigurable computing.

The XC3000 Series - including XC3190-PG175CPH - was designed for high-reliability, medium-complexity digital logic replacement in industrial, aerospace, and medical systems where flexibility, fast time-to-market, and NRE avoidance were critical.

FAQ

What is the operating voltage range for XC3190-PG175CPH?

The XC3190-PG175CPH is a low-voltage device specified for 3.3 V ±0.3 V operation. Its I/O buffers are compatible with both TTL and CMOS logic thresholds, and it draws maximum quiescent current of 5 mA. This voltage range enables direct interfacing with 3.3 V microcontrollers and peripherals without level-shifting circuitry, making XC3190-PG175CPH suitable for battery-powered and energy-efficient industrial modules.

Is XC3190-PG175CPH pin-compatible with other XC3000-series FPGAs?

Yes, XC3190-PG175CPH is 100% pin-out compatible with other XC3000A, XC3000L, XC3100A, and XC3100L family members in the same PG175 package. This includes identical placement of VCC, GND, I/O, clock, and configuration pins. However, functional equivalence requires matching speed grade and voltage variant - XC3190-PG175CPH must be substituted only for other -PGL or -PG175C-marked 3.3 V devices.

Does XC3190-PG175CPH support in-system reprogramming?

Yes, XC3190-PG175CPH supports in-system reprogramming via its serial configuration interface (CCLK/DIN). The device accepts new bitstreams after power-up without requiring physical removal or socketing. This capability enables field-upgradable logic functions, remote diagnostics, and adaptive control algorithms - a key advantage of XC3190-PG175CPH in deployed industrial controllers where firmware updates must occur without hardware intervention.

What configuration memory technology does XC3190-PG175CPH use?

XC3190-PG175CPH uses static CMOS configuration memory cells - not flash or antifuse - arranged in a distributed array across the die. Each cell consists of two cross-coupled inverters and a pass transistor, providing high noise immunity and radiation tolerance. Unlike volatile SRAM-based FPGAs, these cells retain state indefinitely when powered, but require external PROM (e.g., XC1765) for automatic reload at power-up - a defining characteristic of the XC3190-PG175CPH architecture.

Can XC3190-PG175CPH drive 5 V TTL loads directly?

XC3190-PG175CPH outputs are CMOS-compatible with 3.3 V logic levels and 8 mA drive strength, which meets TTL input voltage thresholds (VIH ≥ 2.0 V, VIL ≤ 0.8 V) but cannot safely source/sink into 5 V-biased loads without risk of latch-up. For reliable 5 V TTL interfacing, external level translators or resistive pull-ups to 5 V with current limiting are required. This limitation is inherent to XC3190-PG175CPH's 3.3 V I/O architecture and must be accounted for in schematic design.

XC3190-PG175CPH Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
XC3100
Package/Case:
175-BCPGA
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
320
Number of Logic Elements/Cells:
-
Total RAM Bits:
64160
Number of I/O:
144
Number of Gates:
-
Voltage - Supply:
4.75V ~ 5.25V
Mounting Type:
Through Hole
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Supplier Device Package:
175-CPGA (42.16x42.16)

XC3190-PG175CPH FAQ

1.How can I place an order for XC3190-PG175CPH through Aetrix?

Please submit a Request for Quotation (RFQ) for XC3190-PG175CPH on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC3190-PG175CPH reliable?

The price and inventory of XC3190-PG175CPH are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3190-PG175CPH is usually 5 days.

3.What payment methods are accepted for XC3190-PG175CPH?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3190-PG175CPH transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC3190-PG175CPH?

XC3190-PG175CPH orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC3190-PG175CPH order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC3190-PG175CPH?

For technical support, including XC3190-PG175CPH datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3190-PG175CPH requirements.

6.How does Aetrix verify that XC3190-PG175CPH is sourced from the original manufacturer or authorized distributors?

All XC3190-PG175CPH products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3190-PG175CPH meets industry standards.

7.What is the process for return or replacement of XC3190-PG175CPH?

All XC3190-PG175CPH units undergo pre-shipment inspection (PSI). If there is an issue with XC3190-PG175CPH, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC3190-PG175CPH part is unused and in its original packaging.

Return procedure for XC3190-PG175CPH:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC3190-PG175CPH Tags

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