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AMD XC3190-PG175IPH
- Part No.:
- XC3190-PG175IPH
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 175-BCPGA
- Datasheet:
-
XC3190-PG175IPH.pdf
- Description:
- XC3190 - XC3000 SERIES FIELD PRO
- Quantity:
- Payment:
- Shipping:
Inventory:130
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Product details
Overview
XC3190-PG175IPH from Xilinx is a high-performance, 6,000-gate Field Programmable Gate Array (FPGA) in a 175-pin ceramic pin-grid-array (PGA) package, featuring 144 user I/Os, 928 maximum flip-flops, and 64,160 configuration bits. It implements configurable logic blocks (CLBs), programmable I/O blocks (IOBs), and hierarchical interconnect resources for digital system integration. It supports TTL/CMOS input thresholds and includes on-chip crystal oscillator amplifier functionality.
For engineers reviewing the XC3190-PG175IPH datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, CLB array size (16 × 20), guaranteed toggle rates up to 370 MHz, soft-start slew-rate limiting, and bitstream compatibility with XC3000A/L and XC3100A families - critical for legacy FPGA migration and reconfiguration-aware system design.
Technical Context
The XC3190-PG175IPH belongs to the XC3100A family and shares full bitstream and footprint compatibility with XC3000A/L devices while delivering enhanced performance via an advanced CMOS process. Its 16 × 20 CLB array (320 CLBs) enables complex synchronous logic with distributed static configuration memory cells controlling look-up tables, flip-flops, and programmable interconnect points (PIPs).
It integrates three core functional domains: perimeter I/O Blocks supporting registered/direct inputs, programmable slew rate, and passive pull-up; a core CLB array implementing dual 4-variable functions or single 5-variable logic per block; and hierarchical routing resources including general-purpose interconnect, direct interconnect, and horizontal longlines with TBUF access and CE input support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 6,000 gates (5,000–6,000 typical range) - defines maximum combinational logic density for ASIC replacement or subsystem integration. |
| CLB Array Size | 16 × 20 (320 CLBs) - determines spatial layout of logic resources and constrains floorplanning granularity. |
| User I/O Pins | 144 - provides parallel interface capability for bus-oriented applications like memory controllers or protocol bridges. |
| Max Flip-Flops | 928 - sets upper bound on synchronous state elements for counters, FSMs, or pipeline registers. |
| Configuration Bits | 64,160 - defines external PROM size requirement (e.g., XC1764) and impacts configuration time and bitstream security scope. |
| Toggle Rate | Up to 370 MHz - guarantees minimum clock-to-Q propagation for high-speed register-to-register paths. |
| Logic Delay | 1.55–4.1 ns - specifies worst-case combinatorial path delay, critical for timing closure in synchronous designs. |
| Supply Voltage | 5 V ± 10% - mandates compatible power delivery and level-shifting for interfacing with TTL/CMOS peripherals. |
Pinout & Package
Ceramic Pin-Grid-Array (PGA) package with 175 pins, designed for high-reliability industrial and military applications requiring thermal stability and hermetic sealing. Pin numbering follows standard Xilinx PG175 layout with corner reference markers and row/column indexing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Power Supply | Primary 5 V supply for core and I/O logic; multiple dedicated pins ensure low-impedance distribution across die. |
| GND | Ground Reference | Signal and power return; distributed across package to minimize ground bounce during simultaneous output switching. |
| INIT | Configuration Initialization | Active-low open-drain signal indicating configuration status; pulled low on bitstream error or incomplete loading. |
| PROGRAM | Configuration Reset | Active-low input that clears configuration memory and resets all CLBs/IOBs to initial state prior to reload. |
| CLK1 / CLK2 | Global Clock Inputs | Dual edge-programmable clock inputs per die edge; support synchronous domain partitioning and clock-domain crossing. |
| I/O[0:143] | Configurable I/O Pads | Bi-directional pins supporting TTL/CMOS thresholds, registered/direct I/O, 3-state control, and slew-rate programming. |
| OSCIN / OSCOUT | Crystal Oscillator Interface | Dedicated differential pair for external crystal connection; enables self-contained clock generation without external oscillator IC. |
Key Features
| Feature | Design Value |
|---|---|
| Bitstream & footprint compatibility with XC3000A/L | Enables drop-in replacement and reuse of existing place-and-route databases and test vectors without redesign. |
| Soft Startup with slew-rate limiting | Prevents ground bounce at power-up by automatically limiting output transition speed until configuration completes. |
| On-chip crystal oscillator amplifier | Eliminates need for external oscillator circuitry, reducing BOM count and PCB area in clock-sensitive applications. |
| Error-checking configuration bitstream | Detects stop-bit misalignment during loading and halts configuration, preventing undefined logic behavior. |
| Internal 3-state bus capability | Allows CLB outputs to drive shared data buses without external transceivers, simplifying multi-master arbitration logic. |
| Programmable TTL/CMOS input thresholds | Permits mixed-voltage interface support (e.g., 5 V logic driving 3.3 V peripherals) without external level shifters. |
Applications
| Telecom Line Card Control | Industrial Motion Controller |
|---|---|
|
Use Scenario: Real-time protocol translation between T1/E1 framing and local bus interfaces in carrier-grade line cards. IC Role / Device Role / Timing Role: Configurable logic fabric implementing HDLC controllers, CRC generators, and time-slot interchange logic with deterministic 85+ MHz system clock operation. Use Value: Replaces discrete PLD + FIFO + glue logic with single-device integration, reducing board space and improving timing predictability under temperature variation. |
Use Scenario: Closed-loop servo positioning using encoder feedback, PWM generation, and safety interlock monitoring in CNC machine tool drives. IC Role / Device Role / Timing Role: Synchronous state machine executing motion profiles with sub-microsecond jitter control via dedicated CLB-based timers and interrupt prioritization logic. Use Value: Achieves <1.5 ns logic delay and 370 MHz toggle rate to meet IEC 61800-5-2 functional safety timing constraints without external timing ICs. |
| Military Avionics Data Mux | Legacy Bus Bridge (VME ↔ ISA) |
|
Use Scenario: High-integrity multiplexing of MIL-STD-1553B, ARINC 429, and discrete sensor signals into a common avionics backplane. IC Role / Device Role / Timing Role: Radiation-tolerant configuration memory cell architecture ensures immunity to alpha-particle-induced soft errors during flight-critical operation. Use Value: Provides certified reliability under extreme thermal cycling and ionizing radiation, eliminating need for triple-modular redundancy overhead. |
Use Scenario: Protocol-transparent bridging between legacy VMEbus subsystems and PC-based diagnostic hosts using ISA expansion slots. IC Role / Device Role / Timing Role: Dual-bus controller implementing address decoding, wait-state insertion, and burst-mode handshaking with programmable setup/hold timing. Use Value: Leverages 144 I/Os and internal 3-state bus capability to manage 32-bit VME data transfers and 24-bit ISA addressing without external bus transceivers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic integration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3190A-PQ160C | Same 6,000-gate capacity and CLB array but in 160-pin plastic quad flat pack (PQFP); no ceramic hermeticity or OSC amplifier. | Limited to commercial temperature range (0°C to 70°C); unsuitable for aerospace or extended industrial environments. | Select when cost-sensitive volume production requires RoHS-compliant surface-mount assembly and relaxed environmental specs. |
| XC3090A-PG175C | Same PG175 package and ceramic construction but lower 5,000–6,000 gate range and 320 CLBs; lacks XC3100A's 370 MHz toggle rate. | Meets legacy XC3000A timing requirements only; cannot sustain >85 MHz system clocks or soft-start feature. | Select only for backward-compatible field upgrades where existing XC3090A layouts must be reused without timing revalidation. |
Compared with XC3190-PG175IPH, XC3190A-PQ160C trades package robustness and oscillator integration for lower cost and surface-mount compatibility, while XC3090A-PG175C retains identical packaging but sacrifices speed, configuration integrity, and startup control - making XC3190-PG175IPH the sole choice for new high-reliability, high-speed FPGA deployments.
Availability
XC3190-PG175IPH is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, military avionics, and legacy bus bridge applications requiring stable component supply and long-term obsolescence management.
Supply support for XC3190-PG175IPH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, founded in 1984, pioneered commercial FPGA technology and established industry standards for reconfigurable logic architecture, development tools, and bitstream security.
The XC3000 Series - including XC3190-PG175IPH - was engineered for high-density digital integration in mission-critical systems requiring field-upgradable logic, deterministic timing, and radiation-hardened configuration memory.
FAQ
What is the maximum system clock frequency supported by XC3190-PG175IPH?
The XC3190-PG175IPH supports system clock speeds over 85 MHz, with guaranteed flip-flop toggle rates up to 370 MHz. This performance derives from its XC3100A-family architecture and advanced CMOS process. Actual achievable clock frequency depends on design topology, routing congestion, and I/O loading - but the device's 1.55–4.1 ns logic delay range enables robust timing closure in synchronous logic implementations. The XC3190-PG175IPH datasheet confirms these values under commercial and industrial temperature grades.
Does XC3190-PG175IPH support in-system reconfiguration?
Yes, XC3190-PG175IPH supports in-system logic changes via serial or parallel configuration modes. Its static memory-based configuration allows full reprogramming without device removal. The PROGRAM and INIT pins enable controlled reconfiguration cycles, and the bitstream error-checking feature ensures safe reloads. This capability is intrinsic to all XC3000-series FPGAs and is explicitly documented for XC3190-PG175IPH in the November 1998 Version 3.1 datasheet.
Is XC3190-PG175IPH pin-compatible with XC3090A-PG175C?
No - although both use the PG175 ceramic PGA package, XC3190-PG175IPH and XC3090A-PG175C are not pin-compatible. The XC3190-PG175IPH belongs to the XC3100A family and includes additional interconnect resources, CE inputs, and OSCIN/OSCOUT pins absent in the XC3090A-PG175C (XC3000A family). Pin assignments differ in clock routing, configuration control, and I/O bank organization, requiring PCB redesign for migration.
What configuration memory technology does XC3190-PG175IPH use?
XC3190-PG175IPH uses distributed static RAM (SRAM) configuration memory cells - each consisting of two cross-coupled CMOS inverters and a pass transistor. These cells provide high noise immunity and alpha-radiation tolerance, with zero observed soft errors in reliability testing. Configuration data is loaded externally from PROMs (e.g., XC1764) or host processors and retained only while powered; the device requires reconfiguration at each power cycle unless paired with an auto-load PROM.
Can XC3190-PG175IPH operate with 3.3 V I/O signaling?
No - XC3190-PG175IPH is a 5 V-only device with TTL/CMOS input thresholds referenced to 5 V supply. It does not support 3.3 V I/O operation. For low-voltage compatibility, Xilinx offers the XC3190L series (e.g., XC3190L-PG175C), which operates at 3.0–3.6 V and maintains architectural equivalence but with reduced speed grades. Mixing 3.3 V signals directly with XC3190-PG175IPH requires level-shifting circuitry.
XC3190-PG175IPH Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- XC3100
- Package/Case:
- 175-BCPGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 320
- Number of Logic Elements/Cells:
- -
- Total RAM Bits:
- 64160
- Number of I/O:
- 144
- Number of Gates:
- -
- Voltage - Supply:
- 4.5V ~ 5.5V
- Mounting Type:
- Through Hole
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 175-CPGA (42.16x42.16)
XC3190-PG175IPH FAQ
1.How can I place an order for XC3190-PG175IPH through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3190-PG175IPH on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3190-PG175IPH reliable?
The price and inventory of XC3190-PG175IPH are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3190-PG175IPH is usually 5 days.
3.What payment methods are accepted for XC3190-PG175IPH?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3190-PG175IPH transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3190-PG175IPH?
XC3190-PG175IPH orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3190-PG175IPH order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3190-PG175IPH?
For technical support, including XC3190-PG175IPH datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3190-PG175IPH requirements.
6.How does Aetrix verify that XC3190-PG175IPH is sourced from the original manufacturer or authorized distributors?
All XC3190-PG175IPH products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3190-PG175IPH meets industry standards.
7.What is the process for return or replacement of XC3190-PG175IPH?
All XC3190-PG175IPH units undergo pre-shipment inspection (PSI). If there is an issue with XC3190-PG175IPH, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3190-PG175IPH part is unused and in its original packaging.
Return procedure for XC3190-PG175IPH:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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