AMD XC3S1000-4FG320I
- Part No.:
- XC3S1000-4FG320I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 320-BGA
- Datasheet:
-
XC3S1000-4FG320I.pdf
- Description:
- IC FPGA 221 I/O 320FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:7,772
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Product details
Overview
XC3S1000-4FG320I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 1,000,000 system gates, 17,280 logic cells, and 512 kB of total block RAM. It features a 320-pin Fine-Pitch Ball Grid Array (FBGA) package, -4 speed grade, and industrial temperature range (–40°C to +100°C). It is used in high-volume embedded control and digital signal processing applications requiring reconfigurable logic.
For engineers reviewing the XC3S1000-4FG320I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count (224 user I/Os), distributed RAM capacity, DLL-based clock management, and industrial-grade thermal performance.
Technical Context
The XC3S1000-4FG320I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated multipliers, and eight Digital Clock Managers (DCMs) supporting phase shifting, frequency synthesis, and duty cycle correction. It supports SelectIO standards including LVCMOS, LVTTL, HSTL, and SSTL.
Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external PROM or processor-controlled interfaces. The device uses 1.2 V core voltage and 3.3 V or 2.5 V I/O voltage options, with internal VCCINT regulation and dedicated configuration pins (e.g., INIT_B, PROGRAM_B, DONE).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 17,280 - provides combinational and sequential logic resources for medium-complexity digital designs |
| System Gates | 1,000,000 - indicates overall logic capacity compatible with ASIC-style gate-count estimation |
| User I/O Pins | 224 - supports high peripheral connectivity in industrial interface and protocol bridging applications |
| Block RAM | 512 kB - enables on-chip data buffering, FIFO implementation, and small lookup table storage |
| DCMs | 8 - delivers jitter-tolerant clock synthesis, phase alignment, and input clock multiplication/division |
| Speed Grade | -4 - guarantees timing closure at maximum operating frequencies up to 280 MHz for critical paths |
| Operating Temp | –40°C to +100°C - qualified for extended industrial environments without derating |
Pinout & Package
XC3S1000-4FG320I is housed in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package with 22 mm × 22 mm body size, 1.0 mm ball pitch, and standard JEDEC MO-230 footprint. Pin functions are defined per Xilinx DS099 v2.5 and include dedicated configuration, clock, I/O, and power/ground terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PROGRAM_B | Active-Low Configuration Initiate | Resets configuration logic and clears SRAM contents before loading new bitstream |
| INIT_B | Active-Low Configuration Status | Indicates device readiness to accept configuration data or signals CRC error during load |
| DONE | Configuration Completion | Open-drain output that goes high when configuration completes successfully |
| CLK0–CLK3 | Dedicated Global Clock Inputs | Low-skew routing to all DCMs and CLBs; supports single-ended or differential signaling |
| VCCINT | Core Power Supply | 1.2 V supply for internal logic; requires low-noise, high-current regulation |
| VCCO_0–VCCO_7 | I/O Bank Power Supplies | Independent 3.3 V or 2.5 V supplies per I/O bank enabling mixed-voltage interface support |
Key Features
| Feature | Design Value |
|---|---|
| Eight Digital Clock Managers (DCMs) | Enables precise clock domain crossing, dynamic phase adjustment, and jitter reduction without external PLL ICs |
| 224 User-Programmable I/Os | Supports concurrent interfacing to multiple protocols (e.g., SPI, parallel bus, UART) with bank-wise voltage flexibility |
| 512 kB Block RAM | Eliminates need for external SRAM in moderate-depth buffer or state-machine storage applications |
| Industrial Temperature Range | Validated operation across –40°C to +100°C ambient, suitable for uncooled control cabinets and motor drive enclosures |
| SelectIO Technology | Allows pin-level assignment of I/O standards including LVCMOS25, LVCMOS33, SSTL2_I, and HSTL_I |
Applications
| Motor Control System | Industrial PLC Module |
|---|---|
Use Scenario: Real-time PWM generation, encoder feedback decoding, and safety interlock logic in servo drives. IC Role / Device Role / Timing Role: Reconfigurable logic fabric executing deterministic control loops with sub-microsecond latency. Use Value: Enables field-upgradable motion profiles and integrated diagnostics without hardware redesign. | Use Scenario: High-density I/O conditioning, protocol translation (Modbus RTU ↔ EtherCAT), and cyclic redundancy checking in programmable logic controllers. IC Role / Device Role / Timing Role: Programmable glue logic and protocol engine handling time-critical I/O scanning and fieldbus packet assembly. Use Value: Reduces BOM count by consolidating discrete logic, level shifters, and interface ICs into one device. |
| Video Interface Bridge | Test Equipment Pattern Generator |
Use Scenario: Converting between parallel RGB video and serialized LVDS streams in medical imaging displays. IC Role / Device Role / Timing Role: Synchronization and format conversion engine with pixel-clock domain crossing and FIFO buffering. Use Value: Supports variable-resolution display interfaces while maintaining frame integrity and minimal skew. | Use Scenario: Generating high-speed digital stimulus waveforms (up to 200 MHz) for semiconductor ATE systems. IC Role / Device Role / Timing Role: Deterministic pattern sequencer with precise edge placement controlled by internal DCMs. Use Value: Achieves <±150 ps timing accuracy without external delay generators or clock synthesizers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-5FG320C | Faster -5 speed grade; commercial temperature range (0°C to +70°C); identical logic resources and pinout | Suitable only for controlled-environment applications such as lab equipment or office-based instrumentation | Select when higher clock frequencies are required and thermal conditions are stable |
| XC3S1500-4FG320I | Higher density (1.5M gates, 21,600 logic cells); same package, speed grade, and temperature rating | Used where additional logic or memory is needed for expanded protocol stacks or larger state machines | Choose when future scalability or increased design margin is required without PCB change |
Compared with XC3S1000-4FG320I, the XC3S1000-5FG320C offers improved timing margin but lacks industrial temperature qualification, while the XC3S1500-4FG320I provides headroom for logic growth within identical mechanical and thermal constraints.
Availability
XC3S1000-4FG320I is available at Aetrix Electronics and suitable for motor control systems, industrial PLC modules, and test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XC3S1000-4FG320I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan, Artix, Kintex, and Virtex FPGA families.
The Spartan-3 family, including XC3S1000-4FG320I, was designed for cost-sensitive, high-volume embedded applications requiring balanced logic density, I/O flexibility, and industrial reliability.
FAQ
What is the core voltage requirement for XC3S1000-4FG320I?
The XC3S1000-4FG320I requires a regulated 1.2 V ±3% supply on VCCINT pins. This core voltage powers the internal logic fabric and DCMs. Deviation beyond tolerance risks timing violations or configuration failure. Decoupling capacitors must be placed per Xilinx UG331 guidelines to suppress switching noise.
Does XC3S1000-4FG320I support JTAG boundary-scan testing?
Yes, XC3S1000-4FG320I fully supports IEEE 1149.1 JTAG boundary-scan through dedicated TDI, TDO, TMS, and TCK pins. The device implements TAP controller and instruction register compliant with Xilinx configuration and debug protocols. JTAG is used for programming, debugging, and interconnect testing in assembled PCBs.
How many Digital Clock Managers (DCMs) does XC3S1000-4FG320I contain?
XC3S1000-4FG320I contains eight independent Digital Clock Managers (DCMs). Each DCM supports input clock multiplication, division, phase shifting, and duty cycle correction. These are essential for synchronizing multiple clock domains and meeting setup/hold timing in complex digital systems using XC3S1000-4FG320I.
Can XC3S1000-4FG320I be configured via a microcontroller?
Yes, XC3S1000-4FG320I supports Slave Serial configuration mode, allowing a microcontroller to stream the configuration bitstream via DIN and CCLK pins. The microcontroller must assert PROGRAM_B, monitor INIT_B and DONE, and meet timing requirements specified in DS099. This method enables field updates and dynamic reconfiguration.
What is the maximum number of user I/Os supported by XC3S1000-4FG320I?
XC3S1000-4FG320I supports 224 user-programmable I/Os across its 320-ball FBGA package. These are distributed across eight I/O banks, each configurable for different voltage standards. Unused I/Os can be left unconnected or tied to appropriate voltage levels per Xilinx DCI guidelines.
XC3S1000-4FG320I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 320-BGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1920
- Number of Logic Elements/Cells:
- 17280
- Total RAM Bits:
- 442368
- Number of I/O:
- 221
- Number of Gates:
- 1000000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 320-FBGA (19x19)
XC3S1000-4FG320I FAQ
1.How can I place an order for XC3S1000-4FG320I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1000-4FG320I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1000-4FG320I reliable?
The price and inventory of XC3S1000-4FG320I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1000-4FG320I is usually 5 days.
3.What payment methods are accepted for XC3S1000-4FG320I?
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XC3S1000-4FG320I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1000-4FG320I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1000-4FG320I?
For technical support, including XC3S1000-4FG320I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1000-4FG320I requirements.
6.How does Aetrix verify that XC3S1000-4FG320I is sourced from the original manufacturer or authorized distributors?
All XC3S1000-4FG320I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1000-4FG320I meets industry standards.
7.What is the process for return or replacement of XC3S1000-4FG320I?
All XC3S1000-4FG320I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1000-4FG320I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1000-4FG320I part is unused and in its original packaging.
Return procedure for XC3S1000-4FG320I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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