AMD XC3S1000-4FG676C

Overview

XC3S1000-4FG676C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 1,000,000 system gates, 17,280 logic cells, and 676-pin Fine-Pitch Ball Grid Array (FBGA) packaging. It operates at -4 speed grade (5 ns CLB delay), supports 3.3 V/2.5 V I/O, and targets high-volume embedded control and interface bridging applications.

For engineers reviewing the XC3S1000-4FG676C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O voltage flexibility, distributed RAM capacity, global clock routing resources, and JTAG boundary-scan compliance for production testability.

Technical Context

The XC3S1000-4FG676C implements a hierarchical architecture with configurable logic blocks (CLBs), block RAM (1,728 kbits), and dedicated multipliers (12×12). It features eight global clock networks and supports SelectIO™ technology for single-ended and differential signaling including LVCMOS, LVTTL, and LVDS.

Configuration is performed via Master Serial mode using external PROM or through JTAG boundary-scan. The device includes Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty-cycle correction-each DCM supports input frequencies from 5 MHz to 200 MHz.

Key Specifications

Pinout & Package

Package: 676-ball Fine-Pitch BGA (FG676), 27 × 27 mm, 1.0 mm ball pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based digital logic implementation applications.

Compared with XC3S1000-4FG676C, the XC3S1000-4FG456C trades I/O count for compactness, while the XC3S1500-4FG676C retains pin compatibility but adds logic and memory headroom-both require no schematic or layout revision if staying within the FG676 footprint.

Availability

XC3S1000-4FG676C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging data aggregation, and automated test equipment requiring stable component supply and long-term obsolescence management.

Supply support for XC3S1000-4FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for data center, embedded, and edge applications.

The Spartan-3 family, including XC3S1000-4FG676C, was designed for cost-sensitive, high-volume applications requiring programmable logic with integrated clock management and flexible I/O.

FAQ

What is the maximum operating frequency supported by the XC3S1000-4FG676C?

The XC3S1000-4FG676C has a -4 speed grade specifying a 5 ns CLB propagation delay, enabling synchronous system clock operation up to 200 MHz under typical conditions. Actual achievable frequency depends on design complexity, routing, and temperature; DCM outputs can generate higher-frequency clocks internally, but system-level timing closure is validated at 200 MHz for logic paths.

Does the XC3S1000-4FG676C support JTAG boundary-scan testing?

Yes, the XC3S1000-4FG676C fully complies with IEEE 1149.1 and includes dedicated TCK, TMS, TDI, and TDO pins for boundary-scan testing and in-system programming. This capability is integral to the device's configuration architecture and is enabled by default upon power-up before configuration completes.

How much block RAM is available in the XC3S1000-4FG676C?

The XC3S1000-4FG676C contains 1,728 kbits of total block RAM, implemented as thirty-six 18-kbit RAM blocks. Each block supports true dual-port operation with independent read and write addresses, enabling efficient FIFOs, frame buffers, or look-up tables without external memory.

Can the XC3S1000-4FG676C operate with mixed I/O voltages?

Yes, the XC3S1000-4FG676C supports SelectIO™ technology with independently powered I/O banks. Each bank accepts VCCO from 1.2 V to 3.3 V, allowing simultaneous LVCMOS 3.3 V, LVTTL, and LVDS signaling on different pins-provided appropriate VCCO and VREF settings are applied per bank.

What configuration methods are supported by the XC3S1000-4FG676C?

The XC3S1000-4FG676C supports Master Serial (via external PROM), Slave Serial, SelectMAP, and JTAG modes. Master Serial is most common for production; JTAG is used for debugging and field updates. Configuration bitstreams are loaded into SRAM-based configuration memory and must be reloaded after power cycle.