AMD XC3S1000-4FG676I

Overview

XC3S1000-4FG676I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 1,000,000 system gates, 17,280 logic cells, and 1,728 Kbits of block RAM. It features 480 user I/O pins in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package and operates at -4 speed grade (t_PD = 4.5 ns). It is used in industrial control logic, video interface bridging, and reconfigurable digital signal processing.

For engineers reviewing the XC3S1000-4FG676I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, block RAM depth, speed grade timing closure, and compatibility with Xilinx ISE 14.7 design tools.

Technical Context

The XC3S1000-4FG676I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It supports SelectIO standards including LVCMOS, LVTTL, PCI, HSTL, and SSTL interfaces across its 480 user I/Os.

It includes eight Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty cycle correction, enabling precise timing control without external PLL components. Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external PROM or processor-controlled loading.

Key Specifications

Pinout & Package

XC3S1000-4FG676I is housed in a 676-ball Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch, 27 × 27 array, and thermal pad. Package dimensions are 27 mm × 27 mm × 1.8 mm (height).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC3S1000-4FG676I, the -5C variant trades industrial temperature tolerance for tighter timing, while the XC3S1500-4FG676I extends logic and memory capacity without altering pinout or thermal profile-enabling scalable design reuse.

Availability

XC3S1000-4FG676I is available at Aetrix Electronics and suitable for industrial motion control, video interface bridging, and reconfigurable DSP acceleration requiring stable component supply across extended temperature ranges.

Supply support for XC3S1000-4FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family. Xilinx pioneered programmable logic architecture and system-on-chip integration for embedded applications.

The Spartan-3 family, including XC3S1000-4FG676I, was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and low-power operation in industrial and communications equipment.

FAQ

What is the operating temperature range for XC3S1000-4FG676I?

The XC3S1000-4FG676I is rated for industrial temperature operation from –40°C to +100°C. This range applies to junction temperature under specified voltage and loading conditions. The 'I' suffix explicitly denotes industrial grade, distinguishing it from commercial ('C') or extended ('E') variants. Thermal derating guidelines are provided in Xilinx DS099.

Does XC3S1000-4FG676I support JTAG boundary-scan testing?

Yes, XC3S1000-4FG676I fully supports IEEE 1149.1 JTAG boundary-scan for board-level test and in-system programming. TDI, TDO, TMS, TCK, and TCK are dedicated pins (e.g., Y1, W1, V1, U1, T1). The JTAG chain can include multiple Xilinx devices and is compatible with Xilinx iMPACT and third-party boundary-scan tools.

What configuration memory options are compatible with XC3S1000-4FG676I?

XC3S1000-4FG676I supports serial configuration PROMs including XCF01S, XCF02S, and XCF04S (1–4 Mbit). It also accepts parallel PROMs like XCF08P and works with microprocessor-controlled configuration via Slave Parallel mode. Configuration bitstream size is approximately 2.1 Mbits for full utilization.

Can XC3S1000-4FG676I implement PCIe endpoint functionality?

No, XC3S1000-4FG676I does not include native PCI Express hard IP blocks or compliant transceivers. It lacks the required 2.5 Gbps serial I/O capability and PCIe protocol stack. For PCIe endpoints, Xilinx recommends Spartan-6 or later families. XC3S1000-4FG676I supports PCI bus (33 MHz, 32-bit) via SelectIO and soft-core implementations only.

Is there a migration path from XC3S1000-4FG676I to newer AMD/Xilinx families?

Yes-AMD provides migration guidance from Spartan-3 to Spartan-6 and Artix-7 families. While no direct pin-compatible upgrade exists, XC3S1000-4FG676I designs can be ported using Xilinx Vivado's legacy IP support and HDL source compatibility. Key considerations include updated I/O standards, clocking architecture changes, and revised configuration methods in newer families.