AMD XC3S1000-4FGG676C

Overview

XC3S1000-4FGG676C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 1,000,000 system gates, 17,280 logic cells, and 512 KB of total block RAM. It features a 4-speed grade (-4), operates at 1.2 V core voltage, and uses a 676-pin Fine-Pitch Ball Grid Array (FBGA) package. It is deployed in industrial control logic, video interface bridging, and legacy protocol adaptation.

For engineers reviewing the XC3S1000-4FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (489 user I/Os), differential signaling support (LVDS, LVPECL), clock management (four DCMs), and configuration interface options (JTAG, Master Serial, Slave SelectMAP).

Technical Context

The XC3S1000-4FGG676C implements a fully reconfigurable logic fabric based on SRAM-based Look-Up Tables (LUTs) and flip-flops, with dedicated carry chains for arithmetic. It integrates four Digital Clock Managers (DCMs) supporting phase shifting, frequency synthesis, and duty cycle correction across multiple clock domains.

I/O banks are organized into eight groups, each configurable for LVCMOS, LVTTL, PCI, HSTL, SSTL, LVDS, or LVPECL standards. Configuration occurs via external PROM, JTAG boundary scan, or microprocessor-controlled SelectMAP interface, with bitstream encryption optional via external cipher module.

Key Specifications

Pinout & Package

Package: 676-ball Fine-Pitch BGA (FGG), 27 × 27 mm, 1.0 mm ball pitch, RoHS-compliant, thermal pad exposed on underside.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC3S1500-4FGG676C and XC3S500E-4FGG320C, the XC3S1000-4FGG676C offers balanced logic capacity, I/O count, and clock management for mid-tier reconfigurable systems-avoiding overdesign while retaining upgrade headroom.

Availability

XC3S1000-4FGG676C is available at Aetrix Electronics and suitable for industrial motion control, video interface bridging, and legacy bus emulation requiring stable component supply and long-term obsolescence mitigation.

Supply support for XC3S1000-4FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan family as part of its adaptive computing portfolio.

The Spartan-3 FPGA product line was designed for cost-sensitive, high-volume applications requiring reconfigurable logic with integrated clock management and multi-standard I/O-targeting industrial, automotive, and communications infrastructure.

FAQ

What is the configuration method supported by XC3S1000-4FGG676C?

The XC3S1000-4FGG676C supports three primary configuration modes: Master Serial (using external SPI PROM), Slave SelectMAP (controlled by external microprocessor), and JTAG boundary scan. Each mode allows different levels of flexibility and security, with JTAG enabling in-system programming and debugging during development and field service.

Does XC3S1000-4FGG676C support differential I/O standards?

Yes, XC3S1000-4FGG676C supports LVDS and LVPECL signaling across compatible I/O banks. These standards require proper termination and voltage referencing per bank, and are validated for data rates up to 622 Mbps. Differential pairs must be assigned to adjacent pins within the same bank as defined in the device's pinout documentation.

What is the purpose of the DONE pin on XC3S1000-4FGG676C?

On the XC3S1000-4FGG676C, the DONE pin is an open-drain output that goes high (pulled up externally) upon successful configuration and completion of startup sequence. It signals system readiness and can drive reset release logic or status indicators. A low or floating DONE pin indicates incomplete or failed configuration.

Can XC3S1000-4FGG676C operate with multiple I/O voltage standards simultaneously?

Yes, XC3S1000-4FGG676C supports simultaneous multi-voltage I/O operation: each of its eight I/O banks can be independently set to VCCO voltages from 1.2 V to 3.3 V, enabling concurrent LVCMOS25, LVTTL, SSTL2, and HSTL interfaces on a single device without level shifters.

Is XC3S1000-4FGG676C still in active production?

No-XC3S1000-4FGG676C is discontinued by AMD/Xilinx but remains available through authorized distributors and Aetrix Electronics' extended lifecycle program. Aetrix maintains traceable inventory and offers obsolescence mitigation services including cross-reference guidance and migration path support for new designs.