AMD XC3S1000-4FGG676I

Overview

XC3S1000-4FGG676I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 1,000,000 system gates, 17,280 logic cells, and 576 Kbits of block RAM. It features a 676-pin Fine-Pitch Ball Grid Array (FBGA) package, operates at -4 speed grade (t_PD = 4.5 ns), and supports 3.3V/2.5V I/O with SelectIO technology. It is used in industrial control logic and reconfigurable digital signal processing subsystems.

For engineers reviewing the XC3S1000-4FGG676I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O voltage flexibility, embedded RAM capacity, and timing performance for synchronous state-machine implementation.

Technical Context

The XC3S1000-4FGG676I implements a fully static, SRAM-based configurable logic architecture with dedicated carry chains and distributed RAM. It integrates twelve 18×18 multipliers and supports DDR SDRAM interfaces up to 333 Mbps.

Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan. The device includes Digital Clock Managers (DCMs) providing phase-matched clock synthesis, duty-cycle correction, and frequency multiplication/division with ±100 ppm stability.

Key Specifications

Pinout & Package

XC3S1000-4FGG676I is housed in a 27×27 mm, 676-ball Fine-Pitch BGA (FGG) package with 1.0 mm ball pitch and standard 0.8 mm solder ball diameter. Thermal pad is absent; thermal dissipation relies on PCB copper area and airflow.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC3S1000-4FGG676I, the XC3S1500-4FGG676C offers headroom for design growth while retaining pin compatibility, whereas the XC3S700A-4FGG484I trades density and I/O count for reduced footprint and cost - both require evaluation of thermal and timing margins in final layout.

Availability

XC3S1000-4FGG676I is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interface, and avionics data concentrator applications requiring stable component supply and long-term lifecycle support.

Supply support for XC3S1000-4FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for heterogeneous compute acceleration.

The Spartan-3 family, including XC3S1000-4FGG676I, was designed for cost-sensitive, high-volume applications requiring reconfigurable logic with integrated memory and I/O flexibility - especially in industrial automation and communications infrastructure.

FAQ

What is the operating temperature range for XC3S1000-4FGG676I?

The XC3S1000-4FGG676I is rated for industrial temperature operation from –40°C to +100°C. This range is validated per Xilinx DS099 specification and applies to the full functional performance envelope, including all I/O standards and internal clocking resources. The 'I' suffix explicitly denotes industrial grade, distinguishing it from commercial-grade variants like XC3S1000-4FGG676C.

Does XC3S1000-4FGG676I support JTAG boundary-scan testing?

Yes, XC3S1000-4FGG676I fully supports IEEE 1149.1 JTAG boundary-scan testing. Pins TCK, TMS, TDI, TDO, and TRST are dedicated for this function and operate at 3.3 V. The device implements a 4-bit instruction register and supports EXTEST, SAMPLE/PRELOAD, BYPASS, and IDCODE instructions as defined in the Xilinx Configuration User Guide (UG332).

How many Digital Clock Managers (DCMs) does XC3S1000-4FGG676I include?

XC3S1000-4FGG676I includes four Digital Clock Managers (DCMs). Each DCM provides independent clock synthesis, phase shifting, duty-cycle correction, and frequency multiplication/division. These are essential for synchronizing multiple clock domains in applications such as DDR memory interfaces and video pixel clock generation.

Can XC3S1000-4FGG676I be configured via Master Serial mode?

Yes, XC3S1000-4FGG676I supports Master Serial configuration using an external PROM. In this mode, the FPGA drives CCLK and reads configuration data serially from the PROM via DIN. The process is initiated by pulling PROGRAM_B low and releasing it, after which DONE goes high upon successful loading of the bitstream.

What I/O standards are supported by XC3S1000-4FGG676I?

XC3S1000-4FGG676I supports LVCMOS, LVTTL, PCI, SSTL, HSTL, and differential standards including LVDS and RSDS - all implemented per I/O bank. Each bank can be independently set to 2.5 V or 3.3 V V_CCO, enabling mixed-voltage interface design without level shifters.