AMD XC3S1000-4FT256C

Overview

XC3S1000-4FT256C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 1,000,000 system gates, 17,280 logic cells, and 128 I/O pins in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (tPD = 4.5 ns), supports SelectIO standards up to 333 Mbps, and targets high-volume embedded control and digital signal processing applications.

For engineers reviewing the XC3S1000-4FT256C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O voltage support (1.2 V, 2.5 V, 3.3 V), distributed RAM capacity (720 Kbits), and availability of dedicated multipliers (20 × 18-bit).

Technical Context

The XC3S1000-4FT256C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM, digital clock managers (DCMs), and SelectIO logic. It integrates eight DCMs for clock synthesis, phase shifting, and duty cycle correction, supporting input frequencies from 12 MHz to 240 MHz.

Its logic fabric includes 17,280 four-input LUTs with flip-flops, 720 Kbits of distributed and block RAM, and twenty 18 × 18 multipliers optimized for DSP functions. Configuration is performed via Master Serial or JTAG mode using external PROM or processor-controlled interface.

Key Specifications

Pinout & Package

XC3S1000-4FT256C uses a 256-pin Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch and 17 × 17 array configuration. Thermal pad is not present; package is RoHS-compliant and lead-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based digital logic implementation applications.

Compared with XC3S1000-4FT256C, XC3S1000-4FG320C expands I/O count and thermal headroom at the cost of board space, while XC3S1500-4FT256C increases logic density within the same footprint-both require functional validation but share configuration and toolchain compatibility.

Availability

XC3S1000-4FT256C is available at Aetrix Electronics and suitable for industrial motion control, video interface bridging, and automotive diagnostic gateway applications requiring stable component supply and long-term design-in support.

Supply support for XC3S1000-4FT256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan, Artix, and Virtex FPGA families originally designed for cost-sensitive, high-volume embedded systems.

The Spartan-3 family, including XC3S1000-4FT256C, was engineered for mainstream digital logic replacement and ASIC prototyping in industrial, automotive, and communications equipment where power efficiency and I/O flexibility are critical.

FAQ

What is the maximum operating frequency of the XC3S1000-4FT256C?

The XC3S1000-4FT256C has a -4 speed grade specifying a maximum guaranteed CLB clock frequency of 250 MHz under worst-case industrial temperature and voltage conditions. This value applies to synchronous logic paths routed through the FPGA fabric and verified using Xilinx ISE timing analysis tools.

Does the XC3S1000-4FT256C support JTAG configuration?

Yes, the XC3S1000-4FT256C supports IEEE 1149.1 JTAG boundary-scan and in-system programming via TCK, TMS, TDI, and TDO pins. JTAG mode enables device testing, debug access, and configuration bitstream loading without requiring external PROM or microcontroller intervention.

What voltage levels does the XC3S1000-4FT256C I/O bank support?

The XC3S1000-4FT256C supports multiple I/O standards per bank, including LVCMOS 1.2 V/1.5 V/1.8 V/2.5 V/3.3 V, LVTTL, PCI, HSTL-I/II, and SSTL-II. Each I/O bank is independently powered, allowing mixed-voltage operation across different interface sections of the same device.

How much block RAM is available in the XC3S1000-4FT256C?

The XC3S1000-4FT256C contains 576 Kbits of block RAM organized as thirty-six 18-kbit dual-port RAM blocks. These blocks support synchronous read/write, byte-write enable, and programmable parity generation-suitable for FIFOs, frame buffers, and coefficient storage in DSP applications.

Is the XC3S1000-4FT256C RoHS compliant?

Yes, the XC3S1000-4FT256C is RoHS compliant and lead-free, meeting Directive 2011/65/EU requirements. The 256-pin FT package uses matte tin finish on solder balls and conforms to JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) handling guidelines.