AMD XC3S1000-5FG320C
- Part No.:
- XC3S1000-5FG320C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 320-BGA
- Datasheet:
-
XC3S1000-5FG320C.pdf
- Description:
- IC FPGA 221 I/O 320FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,067
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Product details
Overview
XC3S1000-5FG320C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 1,000,000 system gates, 17,280 logic cells, and 128 I/O pins in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -5 speed grade (4 ns CLB delay), supports SelectIO™ standards up to 622 Mbps, and targets high-volume embedded control and interface bridging applications.
For engineers reviewing the XC3S1000-5FG320C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage flexibility (1.2 V to 3.3 V), distributed RAM capacity (720 Kbits), and support for DDR/DDR2 SDRAM interfaces in cost-sensitive industrial designs.
Technical Context
The XC3S1000-5FG320C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (18 Kbits × 40), and dedicated digital clock managers (DCMs) providing phase-matched clock synthesis and jitter reduction. It integrates 8 global clock networks and supports internal configuration via Master Serial or JTAG modes.
It features SelectIO™ technology enabling single-ended standards (LVTTL, LVCMOS) and differential standards (LVDS, RSDS) on the same bank, with programmable slew rate and drive strength per I/O. Configuration is performed through external PROM or processor-controlled slave parallel mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 17,280 - provides combinational and sequential logic density for medium-complexity control and protocol translation |
| System Gates | 1,000,000 - indicates overall logic capacity suitable for gate-count-constrained legacy designs |
| I/O Pins | 128 - supports multi-interface connectivity with bank-wise voltage isolation |
| Block RAM | 720 Kbits - enables local data buffering, FIFOs, and small lookup tables without external memory |
| DCM Units | 4 - delivers clock multiplication, division, phase shifting, and duty cycle correction for synchronous subsystems |
| Speed Grade | -5 - guarantees 4 ns CLB propagation delay, enabling 250 MHz system clock operation |
| Configuration Mode | Master Serial, Slave Parallel, JTAG - allows flexible programming during development and in-system reconfiguration |
Pinout & Package
XC3S1000-5FG320C is housed in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package with 20 × 20 array, 0.8 mm pitch, and 27 mm × 27 mm body size. Thermal pad is not present; package is RoHS-compliant and lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input - must be decoupled locally to maintain stable internal logic voltage |
| P2 | VCCAUX | 2.5 V auxiliary supply - powers configuration circuitry, DCMs, and I/O banks requiring higher voltage |
| A1 | PROGRAM_B | Active-low configuration reset - initiates reinitialization of FPGA logic and configuration memory |
| T19 | DONE | Open-drain status output - goes high when configuration completes successfully and device enters user mode |
| R18 | CCLK | Configuration clock input - controls serial bitstream loading timing in Master Serial mode |
| Y19 | INIT_B | Open-drain initialization status - asserted low during configuration, released upon completion |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO™ Technology | Supports mixed-voltage I/O banks (1.2 V to 3.3 V) with per-bank voltage setting and termination control |
| Digital Clock Manager (DCM) | Four independent DCMs provide jitter-reduced clock synthesis, frequency multiplication/division, and phase alignment |
| Embedded Block RAM | 40 × 18 Kbit dual-port RAM blocks enable simultaneous read/write for buffering and state storage |
| Configurable Logic Blocks (CLBs) | Each CLB contains two slices with four LUTs and eight flip-flops - optimized for pipelined arithmetic and control logic |
| Multi-Standard I/O | Single-ended (LVTTL/LVCMOS) and differential (LVDS/RSDS) signaling on shared pins without external components |
Applications
| Industrial Motion Control | Legacy Bus Interface Bridge |
|---|---|
Use Scenario: Real-time servo loop coordination across multiple axes using encoder feedback and PWM outputs. IC Role / Device Role / Timing Role: FPGA fabric implements custom motion profile generator and synchronized PWM timing engine with sub-microsecond jitter. Use Value: Enables deterministic response under 2 µs latency using DCM-synchronized clocks and distributed RAM-based trajectory buffers. | Use Scenario: Bridging ISA or PCI bus peripherals to modern microcontroller-based host systems in factory automation upgrades. IC Role / Device Role / Timing Role: Protocol translator mapping legacy address/data strobes to SPI or parallel GPIO with cycle-accurate timing. Use Value: Eliminates need for ASIC redesign by implementing glue logic and timing arbitration in reprogrammable fabric. |
| Video Signal Formatter | Test Equipment Pattern Generator |
Use Scenario: Converting RGB/YUV video streams between disparate formats (e.g., VGA to HDMI) with pixel-level timing control. IC Role / Device Role / Timing Role: Pixel clock domain crossing, line buffer management, and sync pulse generation using block RAM and DCM-aligned clocks. Use Value: Achieves frame-locked conversion with <1-line latency using 720 Kbits of on-chip RAM and phase-matched pixel clocks. | Use Scenario: Generating high-speed digital stimulus patterns (up to 200 MHz) for IC functional validation in ATE systems. IC Role / Device Role / Timing Role: High-speed pattern sequencer with deterministic timing control, jitter-free clocking, and deep pattern memory. Use Value: Delivers repeatable edge placement accuracy ±50 ps using -5 speed grade CLBs and DCM-derived clocks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FG320C | Slower -4 speed grade (5 ns CLB delay); lower maximum clock frequency (200 MHz vs. 250 MHz) | Suitable for less timing-critical control logic where power or cost optimization is prioritized | Select when design timing margin exceeds 1.25× requirement and thermal budget is constrained |
| XC3S1500-5FG320C | Higher density (21,600 logic cells, 1.5M gates); identical package and speed grade | Enables larger state machines or additional protocol stacks without PCB change | Choose when future scalability or added functionality (e.g., dual Ethernet MACs) is anticipated |
Compared with XC3S1000-5FG320C, the -4 variant trades timing performance for lower power and cost, while the -1500 variant retains pin compatibility and speed but adds logic capacity-making both viable for incremental design evolution rather than drop-in replacement.
Availability
XC3S1000-5FG320C is available at Aetrix Electronics and suitable for industrial motion control, legacy bus interface bridging, and video signal formatting requiring stable component supply and long-term manufacturing continuity.
Supply support for XC3S1000-5FG320C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.
The Spartan-3 family, including XC3S1000-5FG320C, was designed for cost-sensitive, high-volume applications requiring reconfigurable logic with predictable timing and low-power operation in industrial and embedded systems.
FAQ
What is the maximum operating frequency supported by XC3S1000-5FG320C?
The XC3S1000-5FG320C has a -5 speed grade specifying a 4 ns CLB propagation delay, enabling reliable operation at 250 MHz system clock frequency. Actual achievable frequency depends on design routing, resource utilization, and I/O timing constraints. The device includes four Digital Clock Managers (DCMs) that support frequency multiplication up to 320 MHz for internal logic domains.
Does XC3S1000-5FG320C support JTAG boundary-scan testing?
Yes, XC3S1000-5FG320C fully supports IEEE 1149.1 JTAG boundary-scan testing via dedicated TCK, TMS, TDI, and TDO pins. JTAG is used for device programming, debugging, and interconnect verification. The TDO pin is three-state controlled by TMS, and the JTAG chain can include multiple Xilinx devices sharing the same test access port.
Can XC3S1000-5FG320C be configured using an external microcontroller?
Yes, XC3S1000-5FG320C supports Slave Parallel configuration mode, allowing an external microcontroller to load the bitstream via its data bus and control signals (e.g., INIT_B, PROGRAM_B, DONE). This enables field updates and dynamic reconfiguration without requiring dedicated PROM or serial flash memory.
What I/O standards are supported by XC3S1000-5FG320C?
XC3S1000-5FG320C supports single-ended standards including LVTTL, LVCMOS (1.2 V to 3.3 V), and PCI, plus differential standards LVDS and RSDS. Each I/O bank is independently configurable for voltage level and standard. Termination resistors are not integrated; external termination is required for differential signaling.
Is XC3S1000-5FG320C still in active production?
XC3S1000-5FG320C is no longer in active production by AMD/Xilinx but remains available through authorized distributors and Aetrix Electronics' extended lifecycle program. Obsolescence mitigation includes verified second-source alternatives, long-term inventory holding, and engineering support for migration paths to Spartan-6 or Artix-7 families.
XC3S1000-5FG320C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 320-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1920
- Number of Logic Elements/Cells:
- 17280
- Total RAM Bits:
- 442368
- Number of I/O:
- 221
- Number of Gates:
- 1000000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 320-FBGA (19x19)
XC3S1000-5FG320C FAQ
1.How can I place an order for XC3S1000-5FG320C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1000-5FG320C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1000-5FG320C reliable?
The price and inventory of XC3S1000-5FG320C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1000-5FG320C is usually 5 days.
3.What payment methods are accepted for XC3S1000-5FG320C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1000-5FG320C transactions.
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4.How is shipping managed for XC3S1000-5FG320C?
XC3S1000-5FG320C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1000-5FG320C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1000-5FG320C?
For technical support, including XC3S1000-5FG320C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1000-5FG320C requirements.
6.How does Aetrix verify that XC3S1000-5FG320C is sourced from the original manufacturer or authorized distributors?
All XC3S1000-5FG320C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1000-5FG320C meets industry standards.
7.What is the process for return or replacement of XC3S1000-5FG320C?
All XC3S1000-5FG320C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1000-5FG320C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1000-5FG320C part is unused and in its original packaging.
Return procedure for XC3S1000-5FG320C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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