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AMD XC3S1000-5FG320C

Part No.:
XC3S1000-5FG320C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
320-BGA
Datasheet:
AetrixXC3S1000-5FG320C.pdf
Description:
IC FPGA 221 I/O 320FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,067

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Product details

Overview

XC3S1000-5FG320C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 1,000,000 system gates, 17,280 logic cells, and 128 I/O pins in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -5 speed grade (4 ns CLB delay), supports SelectIO™ standards up to 622 Mbps, and targets high-volume embedded control and interface bridging applications.

For engineers reviewing the XC3S1000-5FG320C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage flexibility (1.2 V to 3.3 V), distributed RAM capacity (720 Kbits), and support for DDR/DDR2 SDRAM interfaces in cost-sensitive industrial designs.

Technical Context

The XC3S1000-5FG320C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (18 Kbits × 40), and dedicated digital clock managers (DCMs) providing phase-matched clock synthesis and jitter reduction. It integrates 8 global clock networks and supports internal configuration via Master Serial or JTAG modes.

It features SelectIO™ technology enabling single-ended standards (LVTTL, LVCMOS) and differential standards (LVDS, RSDS) on the same bank, with programmable slew rate and drive strength per I/O. Configuration is performed through external PROM or processor-controlled slave parallel mode.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells17,280 - provides combinational and sequential logic density for medium-complexity control and protocol translation
System Gates1,000,000 - indicates overall logic capacity suitable for gate-count-constrained legacy designs
I/O Pins128 - supports multi-interface connectivity with bank-wise voltage isolation
Block RAM720 Kbits - enables local data buffering, FIFOs, and small lookup tables without external memory
DCM Units4 - delivers clock multiplication, division, phase shifting, and duty cycle correction for synchronous subsystems
Speed Grade-5 - guarantees 4 ns CLB propagation delay, enabling 250 MHz system clock operation
Configuration ModeMaster Serial, Slave Parallel, JTAG - allows flexible programming during development and in-system reconfiguration

Pinout & Package

XC3S1000-5FG320C is housed in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package with 20 × 20 array, 0.8 mm pitch, and 27 mm × 27 mm body size. Thermal pad is not present; package is RoHS-compliant and lead-free.

Pin/TerminalCircuit RoleDesign Meaning
G1VCCINT1.2 V core supply input - must be decoupled locally to maintain stable internal logic voltage
P2VCCAUX2.5 V auxiliary supply - powers configuration circuitry, DCMs, and I/O banks requiring higher voltage
A1PROGRAM_BActive-low configuration reset - initiates reinitialization of FPGA logic and configuration memory
T19DONEOpen-drain status output - goes high when configuration completes successfully and device enters user mode
R18CCLKConfiguration clock input - controls serial bitstream loading timing in Master Serial mode
Y19INIT_BOpen-drain initialization status - asserted low during configuration, released upon completion

Key Features

FeatureDesign Value
SelectIO™ TechnologySupports mixed-voltage I/O banks (1.2 V to 3.3 V) with per-bank voltage setting and termination control
Digital Clock Manager (DCM)Four independent DCMs provide jitter-reduced clock synthesis, frequency multiplication/division, and phase alignment
Embedded Block RAM40 × 18 Kbit dual-port RAM blocks enable simultaneous read/write for buffering and state storage
Configurable Logic Blocks (CLBs)Each CLB contains two slices with four LUTs and eight flip-flops - optimized for pipelined arithmetic and control logic
Multi-Standard I/OSingle-ended (LVTTL/LVCMOS) and differential (LVDS/RSDS) signaling on shared pins without external components

Applications

Industrial Motion ControlLegacy Bus Interface Bridge

Use Scenario: Real-time servo loop coordination across multiple axes using encoder feedback and PWM outputs.

IC Role / Device Role / Timing Role: FPGA fabric implements custom motion profile generator and synchronized PWM timing engine with sub-microsecond jitter.

Use Value: Enables deterministic response under 2 µs latency using DCM-synchronized clocks and distributed RAM-based trajectory buffers.

Use Scenario: Bridging ISA or PCI bus peripherals to modern microcontroller-based host systems in factory automation upgrades.

IC Role / Device Role / Timing Role: Protocol translator mapping legacy address/data strobes to SPI or parallel GPIO with cycle-accurate timing.

Use Value: Eliminates need for ASIC redesign by implementing glue logic and timing arbitration in reprogrammable fabric.

Video Signal FormatterTest Equipment Pattern Generator

Use Scenario: Converting RGB/YUV video streams between disparate formats (e.g., VGA to HDMI) with pixel-level timing control.

IC Role / Device Role / Timing Role: Pixel clock domain crossing, line buffer management, and sync pulse generation using block RAM and DCM-aligned clocks.

Use Value: Achieves frame-locked conversion with <1-line latency using 720 Kbits of on-chip RAM and phase-matched pixel clocks.

Use Scenario: Generating high-speed digital stimulus patterns (up to 200 MHz) for IC functional validation in ATE systems.

IC Role / Device Role / Timing Role: High-speed pattern sequencer with deterministic timing control, jitter-free clocking, and deep pattern memory.

Use Value: Delivers repeatable edge placement accuracy ±50 ps using -5 speed grade CLBs and DCM-derived clocks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and control applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC3S1000-4FG320CSlower -4 speed grade (5 ns CLB delay); lower maximum clock frequency (200 MHz vs. 250 MHz)Suitable for less timing-critical control logic where power or cost optimization is prioritizedSelect when design timing margin exceeds 1.25× requirement and thermal budget is constrained
XC3S1500-5FG320CHigher density (21,600 logic cells, 1.5M gates); identical package and speed gradeEnables larger state machines or additional protocol stacks without PCB changeChoose when future scalability or added functionality (e.g., dual Ethernet MACs) is anticipated

Compared with XC3S1000-5FG320C, the -4 variant trades timing performance for lower power and cost, while the -1500 variant retains pin compatibility and speed but adds logic capacity-making both viable for incremental design evolution rather than drop-in replacement.

Availability

XC3S1000-5FG320C is available at Aetrix Electronics and suitable for industrial motion control, legacy bus interface bridging, and video signal formatting requiring stable component supply and long-term manufacturing continuity.

Supply support for XC3S1000-5FG320C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.

The Spartan-3 family, including XC3S1000-5FG320C, was designed for cost-sensitive, high-volume applications requiring reconfigurable logic with predictable timing and low-power operation in industrial and embedded systems.

FAQ

What is the maximum operating frequency supported by XC3S1000-5FG320C?

The XC3S1000-5FG320C has a -5 speed grade specifying a 4 ns CLB propagation delay, enabling reliable operation at 250 MHz system clock frequency. Actual achievable frequency depends on design routing, resource utilization, and I/O timing constraints. The device includes four Digital Clock Managers (DCMs) that support frequency multiplication up to 320 MHz for internal logic domains.

Does XC3S1000-5FG320C support JTAG boundary-scan testing?

Yes, XC3S1000-5FG320C fully supports IEEE 1149.1 JTAG boundary-scan testing via dedicated TCK, TMS, TDI, and TDO pins. JTAG is used for device programming, debugging, and interconnect verification. The TDO pin is three-state controlled by TMS, and the JTAG chain can include multiple Xilinx devices sharing the same test access port.

Can XC3S1000-5FG320C be configured using an external microcontroller?

Yes, XC3S1000-5FG320C supports Slave Parallel configuration mode, allowing an external microcontroller to load the bitstream via its data bus and control signals (e.g., INIT_B, PROGRAM_B, DONE). This enables field updates and dynamic reconfiguration without requiring dedicated PROM or serial flash memory.

What I/O standards are supported by XC3S1000-5FG320C?

XC3S1000-5FG320C supports single-ended standards including LVTTL, LVCMOS (1.2 V to 3.3 V), and PCI, plus differential standards LVDS and RSDS. Each I/O bank is independently configurable for voltage level and standard. Termination resistors are not integrated; external termination is required for differential signaling.

Is XC3S1000-5FG320C still in active production?

XC3S1000-5FG320C is no longer in active production by AMD/Xilinx but remains available through authorized distributors and Aetrix Electronics' extended lifecycle program. Obsolescence mitigation includes verified second-source alternatives, long-term inventory holding, and engineering support for migration paths to Spartan-6 or Artix-7 families.

XC3S1000-5FG320C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-3
Package/Case:
320-BGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
1920
Number of Logic Elements/Cells:
17280
Total RAM Bits:
442368
Number of I/O:
221
Number of Gates:
1000000
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
320-FBGA (19x19)

XC3S1000-5FG320C FAQ

1.How can I place an order for XC3S1000-5FG320C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC3S1000-5FG320C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC3S1000-5FG320C reliable?

The price and inventory of XC3S1000-5FG320C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1000-5FG320C is usually 5 days.

3.What payment methods are accepted for XC3S1000-5FG320C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1000-5FG320C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC3S1000-5FG320C?

XC3S1000-5FG320C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC3S1000-5FG320C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC3S1000-5FG320C?

For technical support, including XC3S1000-5FG320C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1000-5FG320C requirements.

6.How does Aetrix verify that XC3S1000-5FG320C is sourced from the original manufacturer or authorized distributors?

All XC3S1000-5FG320C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1000-5FG320C meets industry standards.

7.What is the process for return or replacement of XC3S1000-5FG320C?

All XC3S1000-5FG320C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1000-5FG320C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC3S1000-5FG320C part is unused and in its original packaging.

Return procedure for XC3S1000-5FG320C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC3S1000-5FG320C Tags

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