AMD XC3S1000-5FG456C

Overview

XC3S1000-5FG456C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 1,000,000 system gates, 21,952 logic cells, and 173 I/O pins in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -5 speed grade (100 MHz system clock), supports SelectIO™ standards up to 622 Mbps, and targets high-volume embedded control and interface bridging applications.

For engineers reviewing the XC3S1000-5FG456C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O voltage flexibility (1.2 V to 3.3 V), distributed RAM capacity (737,280 bits), and support for DDR memory interfaces in cost-sensitive industrial systems.

Technical Context

The XC3S1000-5FG456C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAMs, and dedicated digital clock managers (DCMs). Each CLB contains four 3-input LUTs and eight flip-flops, enabling efficient implementation of synchronous logic and state machines.

It integrates twelve 18-kbit block RAMs (total 216 kbits), four DCMs for clock synthesis and phase alignment, and supports LVCMOS, LVTTL, PCI, HSTL, and SSTL I/O standards with programmable drive strength and slew rate control.

Key Specifications

Pinout & Package

XC3S1000-5FG456C is housed in a 456-ball fine-pitch BGA (FBGA) package with 29 × 29 mm body size, 1.0 mm ball pitch, and thermal pad. Pin assignment follows Xilinx Spartan-3 FG456 footprint standard.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and control applications.

Compared with XC3S1000-5FG456C, the XC3S1500-5FG456C offers headroom for future feature expansion without board changes, while the XC3S700A-4FG456C reduces unit cost and dynamic power at the expense of maximum operating frequency and logic capacity.

Availability

XC3S1000-5FG456C is available at Aetrix Electronics and suitable for industrial automation, test equipment, and communications infrastructure requiring stable component supply across extended product lifecycles.

Supply support for XC3S1000-5FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan family as part of its adaptive computing portfolio.

The Spartan-3 series was designed for high-volume, cost-sensitive applications demanding predictable performance, low power, and broad I/O flexibility in industrial and embedded systems.

FAQ

What is the maximum operating frequency supported by XC3S1000-5FG456C?

The XC3S1000-5FG456C is rated for a -5 speed grade, guaranteeing 100 MHz system clock operation under worst-case voltage and temperature conditions. Internal paths-such as CLB-to-CLB or register-to-register-can achieve higher frequencies depending on routing and resource usage, but timing closure must be verified per design using Xilinx ISE tools.

Does XC3S1000-5FG456C support configuration via JTAG?

Yes, XC3S1000-5FG456C supports IEEE 1149.1 JTAG boundary-scan for programming, debugging, and verification. It uses the TCK, TMS, TDI, and TDO pins for serial configuration and also enables partial reconfiguration and debug probe insertion during active operation.

Can XC3S1000-5FG456C interface directly with DDR SDRAM?

Yes, XC3S1000-5FG456C supports DDR SDRAM interfaces through its SelectIO™ I/O banks configured for SSTL_2 or SSTL_18 standards. The device provides source-synchronous timing control via DCM outputs and supports read/write leveling using user-defined logic, though external PHY is required for full JEDEC compliance.

What configuration memory options are compatible with XC3S1000-5FG456C?

XC3S1000-5FG456C supports master serial (via on-chip oscillator), slave serial, and JTAG configuration modes. Compatible external memory includes Xilinx Platform Flash PROMs (e.g., XCF02S, XCF04S) and third-party SPI flash devices programmed with bitstream files generated by Xilinx ISE.

Is XC3S1000-5FG456C RoHS compliant?

Yes, XC3S1000-5FG456C is RoHS compliant and lead-free, meeting EU Directive 2011/65/EU requirements. The FBGA package uses matte tin finish on solder balls, and the device is marked with the RoHS symbol and date code per Xilinx documentation.