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AMD XC3S1000-5FGG320C

Part No.:
XC3S1000-5FGG320C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
320-BGA
Datasheet:
AetrixXC3S1000-5FGG320C.pdf
Description:
IC FPGA 221 I/O 320FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,755

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Product details

Overview

XC3S1000-5FGG320C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 1,000,000 system gates, 17,280 logic cells, and 432 I/O pins in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -5 speed grade (100 MHz system clock), supports SelectIO™ standards including LVCMOS, LVTTL, and SSTL, and targets high-volume embedded control and digital signal processing applications.

For engineers reviewing the XC3S1000-5FGG320C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, speed grade, package thermal profile, and compatibility with Xilinx ISE design tools and Spartan-3 configuration interfaces.

Technical Context

The XC3S1000-5FGG320C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, block RAM (48 × 18 Kbit), and dedicated multipliers (18 × 18). It uses SRAM-based configuration with external PROM or processor-controlled loading via JTAG or master serial mode.

It supports differential signaling (LVDS, RSDS) on selected I/O banks, includes Digital Clock Managers (DCMs) for clock synthesis and phase alignment, and features internal global clock networks with low skew for synchronous timing closure up to 100 MHz.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells17,280 - provides combinational and sequential logic capacity for medium-complexity digital systems
System Gates1,000,000 - industry-standard metric estimating equivalent gate count for ASIC comparison
I/O Pins432 - supports high interconnect density across multiple voltage domains and interface standards
Block RAM48 × 18 Kbit - enables on-chip data buffering, FIFOs, and small lookup tables without external memory
Speed Grade-5 - guarantees timing closure at 100 MHz system clock frequency under worst-case conditions
DCM Units4 - delivers clock doubling, duty cycle correction, and phase shifting for precise timing control
Configuration ModeMaster Serial, Slave Parallel, JTAG - allows flexible programming via PROM, microcontroller, or boundary-scan tool

Pinout & Package

XC3S1000-5FGG320C is housed in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package with 20 × 20 array, 1.0 mm ball pitch, and 12 × 12 mm body size. Thermal characteristics support industrial temperature operation (0°C to 85°C).

Pin/TerminalCircuit RoleDesign Meaning
G1VCCINT1.2 V core supply input for CLB and routing resources
P2VCCAUX2.5 V auxiliary supply for DCMs, configuration logic, and I/O banks
A1VCCO_03.3 V output supply for Bank 0 I/O drivers
T19GNDGround reference for power integrity and signal return path
R15PROGRAM_BActive-low asynchronous reset that clears configuration memory and initiates reload
M16DONEOpen-drain status output indicating successful configuration completion
J14TCKJTAG test clock input for boundary-scan and debug access

Key Features

FeatureDesign Value
SelectIO™ TechnologySupports 19 I/O standards including LVCMOS, LVTTL, SSTL-2/3, HSTL, and differential LVDS - enables direct interfacing with memory, processors, and peripherals
Digital Clock Manager (DCM)Four fully independent DCMs provide jitter reduction, frequency synthesis, and phase alignment - eliminates need for external clock ICs in many timing-critical designs
Embedded Multipliers18 × 18-bit two's complement multipliers - accelerates DSP functions such as FIR filtering and FFT computation without external math ICs
Configurable Logic Blocks (CLBs)Each CLB contains two slices with four LUTs and eight flip-flops - balances logic depth and register count for pipelined control and datapath implementation
Block RAM48 blocks of 18 Kbit dual-port RAM - supports simultaneous read/write operations for buffer management and state storage

Applications

Industrial Motion ControlVideo Interface Bridge

Use Scenario: Real-time servo loop execution and encoder feedback processing in CNC machines and robotic arms.

IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID controllers, PWM generators, and quadrature decoder logic with deterministic sub-microsecond latency.

Use Value: 17,280 logic cells and 4 DCMs enable synchronized multi-axis motion control without external timing ICs or microcontroller bottlenecks.

Use Scenario: Converting parallel RGB video signals to serialized LVDS or FPD-Link for LCD panel driving.

IC Role / Device Role / Timing Role: XC3S1000-5FGG320C acts as a protocol translator and timing adapter, managing pixel clock domain crossing and data serialization.

Use Value: 432 I/O pins and SelectIO™ support allow simultaneous handling of wide RGB buses and high-speed differential outputs with matched trace lengths.

Communications Baseband ProcessingTest Equipment Pattern Generation

Use Scenario: Implementing channel coding (Viterbi, Turbo), modulation mapping, and symbol timing recovery in wireless base stations.

IC Role / Device Role / Timing Role: Configurable logic executes real-time PHY-layer algorithms; block RAM stores convolutional trellis states and interleaver buffers.

Use Value: 48 × 18 Kbit block RAM and 18 × 18 multipliers accelerate forward-error-correction throughput while maintaining deterministic latency.

Use Scenario: Generating high-speed digital stimulus waveforms and capturing response data in ATE systems.

IC Role / Device Role / Timing Role: XC3S1000-5FGG320C serves as a programmable pattern generator with precise edge placement and variable-depth sequence memory.

Use Value: -5 speed grade ensures 100 MHz clocking stability for 200 Mbps vector rates; 432 I/O pins support parallel wide-bus test interfaces.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based digital logic implementation applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC3S1000-4FGG320CSlower -4 speed grade (85 MHz max system clock); identical logic density, I/O count, and packageSuitable for cost-sensitive designs where timing margin exceeds requirementsSelect when full -5 timing performance is unnecessary and BOM cost reduction is prioritized
XC3S1500-5FGG456CHigher-density variant: 1,500,000 gates, 21,600 logic cells, 456-pin FBGA packageRequired for designs needing >17K logic cells or additional block RAM/multiplier resourcesChoose when XC3S1000-5FGG320C resource utilization exceeds 90% in ISE synthesis reports

Compared with XC3S1000-4FGG320C, the XC3S1000-5FGG320C delivers guaranteed 100 MHz operation for tighter timing budgets; compared with XC3S1500-5FGG456C, it offers lower cost and smaller footprint where logic and I/O headroom are sufficient.

Availability

XC3S1000-5FGG320C is available at Aetrix Electronics and suitable for industrial motion control, video interface bridging, communications baseband processing, and automated test equipment requiring stable component supply and long-term lifecycle support.

Supply support for XC3S1000-5FGG320C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops and supports the legacy Spartan family as part of its adaptive computing portfolio.

The Spartan-3 family was designed for cost-sensitive, high-volume applications requiring predictable performance, low power, and broad I/O flexibility - especially in industrial automation and embedded vision.

FAQ

What is the maximum operating frequency supported by XC3S1000-5FGG320C?

The XC3S1000-5FGG320C is rated for a -5 speed grade, guaranteeing timing closure at 100 MHz system clock frequency under worst-case industrial temperature and voltage conditions. Actual achievable frequency depends on design topology, routing, and resource usage - verified through Xilinx ISE static timing analysis.

Does XC3S1000-5FGG320C support JTAG programming?

Yes, XC3S1000-5FGG320C supports IEEE 1149.1 JTAG boundary-scan programming and debugging via dedicated TCK, TMS, TDI, and TDO pins. Configuration can be performed in-circuit using Xilinx iMPACT or compatible tools without requiring external PROM.

What power supplies are required for XC3S1000-5FGG320C operation?

XC3S1000-5FGG320C requires three independent supplies: 1.2 V for core logic (VCCINT), 2.5 V for auxiliary circuits and DCMs (VCCAUX), and bank-specific 1.8–3.3 V for I/O (VCCO). Each supply must meet ripple, sequencing, and decoupling requirements specified in DS099.

How many Digital Clock Managers (DCMs) does XC3S1000-5FGG320C include?

XC3S1000-5FGG320C integrates four fully functional Digital Clock Managers (DCMs). Each DCM provides clock multiplication, division, phase shifting, and duty cycle correction - enabling precise clock domain management without external PLL ICs.

Is XC3S1000-5FGG320C compatible with Xilinx ISE Design Suite?

Yes, XC3S1000-5FGG320C is fully supported by Xilinx ISE 14.7 and earlier versions. Synthesis, place-and-route, bitstream generation, and timing analysis workflows are validated for this device in the ISE toolchain.

XC3S1000-5FGG320C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-3
Package/Case:
320-BGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
1920
Number of Logic Elements/Cells:
17280
Total RAM Bits:
442368
Number of I/O:
221
Number of Gates:
1000000
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
320-FBGA (19x19)

XC3S1000-5FGG320C FAQ

1.How can I place an order for XC3S1000-5FGG320C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC3S1000-5FGG320C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC3S1000-5FGG320C reliable?

The price and inventory of XC3S1000-5FGG320C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1000-5FGG320C is usually 5 days.

3.What payment methods are accepted for XC3S1000-5FGG320C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1000-5FGG320C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC3S1000-5FGG320C?

XC3S1000-5FGG320C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC3S1000-5FGG320C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC3S1000-5FGG320C?

For technical support, including XC3S1000-5FGG320C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1000-5FGG320C requirements.

6.How does Aetrix verify that XC3S1000-5FGG320C is sourced from the original manufacturer or authorized distributors?

All XC3S1000-5FGG320C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1000-5FGG320C meets industry standards.

7.What is the process for return or replacement of XC3S1000-5FGG320C?

All XC3S1000-5FGG320C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1000-5FGG320C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC3S1000-5FGG320C part is unused and in its original packaging.

Return procedure for XC3S1000-5FGG320C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC3S1000-5FGG320C Tags

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  • XC3S1000-5FGG320C Datasheet
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  • XC3S1000-5FGG320C Images
  • AMD
  • AMD XC3S1000-5FGG320C
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