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AMD XC3S1000-5FGG676C
- Part No.:
- XC3S1000-5FGG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC3S1000-5FGG676C.pdf
- Description:
- IC FPGA 391 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,251
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Product details
Overview
XC3S1000-5FGG676C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 1,000,000 system gates, 17,280 logic cells, and 1,872 Kbits of block RAM. It features 480 user I/Os in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package and operates at -5 speed grade (equivalent to 333 MHz system clock). It is used in industrial control logic, video interface bridging, and reconfigurable digital signal processing subsystems.
For engineers reviewing the XC3S1000-5FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, embedded RAM capacity, speed grade timing closure, and FBGA676 thermal-mechanical compatibility with existing PCB layouts.
Technical Context
The XC3S1000-5FGG676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It supports SelectIO standards including LVCMOS, LVTTL, SSTL, and HSTL across its 480 user I/O pins.
It includes eight Digital Clock Managers (DCMs) for phase alignment, frequency synthesis, and duty cycle correction - enabling precise clock domain management without external PLL components. Configuration is performed via Master Serial or JTAG mode using external PROM or processor-controlled interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 17,280 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| System Gates | 1,000,000 - industry-standard metric for relative logic density vs. ASIC equivalents |
| Block RAM | 1,872 Kbits - supports dual-port FIFOs, coefficient storage, or frame buffers up to 234 KB |
| User I/O Pins | 480 - enables high-pin-count parallel interfaces such as video data buses or memory controllers |
| Speed Grade | -5 - guarantees timing closure up to 333 MHz system clock in worst-case industrial conditions |
| Package | FGG676 - 27×27 mm fine-pitch BGA with 1.0 mm ball pitch, compatible with standard SMT reflow profiles |
Pinout & Package
XC3S1000-5FGG676C uses a 676-ball FCBGA (Fine-Pitch Ceramic Ball Grid Array) package with 480 user-configurable I/Os, 8 dedicated DCM clock inputs, and power/ground balls arranged in perimeter and array patterns for low-inductance supply delivery.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 output voltage supply - sets logic level for associated pins (e.g., 3.3V or 2.5V) |
| A2 | CLK0 | Dedicated global clock input to DCM0 - low-skew path for primary system clock |
| P14 | PROGRAM_B | Active-low configuration initiation - pulls device into slave serial mode on power-up |
| T15 | DONE | Open-drain status output - signals successful configuration completion to host controller |
| U18 | TCK | JTAG test clock - synchronizes boundary-scan and debug operations per IEEE 1149.1 |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Managers (DCMs) | 8 independent DCMs provide jitter-free clock multiplication, division, phase shifting, and duty cycle correction without external PLLs |
| SelectIO Technology | Supports 18 I/O standards including LVCMOS, LVTTL, SSTL-2/3, and HSTL - simplifies interface to DDR SDRAM, video DACs, and microcontrollers |
| Embedded Multipliers | 20 hardwired 18×18-bit signed multipliers - accelerate FIR filters, FFT engines, and motor control algorithms |
| Configuration Security | Bitstream encryption via AES-128 key stored in on-chip eFUSE - prevents reverse engineering of programmed logic |
Applications
| Industrial Motion Control | Video Interface Bridge |
|---|---|
Use Scenario: Real-time servo loop execution and encoder feedback processing in CNC machines and robotic arms. IC Role / Device Role / Timing Role: FPGA fabric implements PID controllers, PWM generators, and quadrature decoder logic with sub-microsecond latency. Use Value: 17,280 logic cells and 8 DCMs enable deterministic timing for synchronized axis control across multiple motors. | Use Scenario: Converting between HDMI source and LVDS display interface in medical imaging panels. IC Role / Device Role / Timing Role: Acts as protocol translator and pixel clock domain synchronizer between asynchronous video streams. Use Value: 480 I/Os support parallel 24-bit RGB + sync bus while DCMs align pixel clocks across source and sink domains. |
| Reconfigurable DSP Subsystem | Communications Baseband Processing |
Use Scenario: Adaptive filtering and spectral analysis in portable spectrum analyzers and RF test equipment. IC Role / Device Role / Timing Role: Hosts parameterized FIR and FFT cores that are dynamically loaded via partial reconfiguration. Use Value: 1,872 Kbits of block RAM stores filter coefficients and FFT twiddle tables; 20 embedded multipliers accelerate real-time computation. | Use Scenario: Channel coding/decoding and modulation mapping in point-to-point wireless backhaul units. IC Role / Device Role / Timing Role: Implements Viterbi decoders, CRC engines, and QAM mappers in hardware for deterministic throughput. Use Value: -5 speed grade ensures 333 MHz operation meets symbol rate timing budgets for 64-QAM at 40 Msps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1500-5FGG676C | Higher logic density (21,600 CLBs), same package and speed grade | Better suited for designs requiring additional pipeline stages or larger state machines | Select when XC3S1000-5FGG676C resource utilization exceeds 85% in synthesis reports |
| XC3S500E-4FGG320C | Lower density (11,264 CLBs), smaller 320-ball FBGA, -4 speed grade (280 MHz max) | Targeted at cost-sensitive, space-constrained designs with relaxed timing margins | Choose for legacy board redesigns where footprint reduction and BOM cost outweigh performance needs |
Compared with XC3S1000-5FGG676C, the XC3S1500-5FGG676C offers headroom for future feature expansion without layout change, while the XC3S500E-4FGG320C trades logic capacity and speed for lower unit cost and smaller PCB area - both require separate timing analysis and I/O constraint validation.
Availability
XC3S1000-5FGG676C is available at Aetrix Electronics and suitable for industrial motion control, video interface bridging, and reconfigurable DSP subsystems requiring stable component supply over extended production lifecycles.
Supply support for XC3S1000-5FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and edge applications.
The Spartan-3 family, including XC3S1000-5FGG676C, was designed for cost-sensitive, high-volume applications requiring programmable logic with integrated clock management and I/O flexibility - especially in industrial automation and video infrastructure.
FAQ
What is the maximum operating frequency supported by XC3S1000-5FGG676C?
The XC3S1000-5FGG676C is rated at speed grade -5, guaranteeing timing closure up to 333 MHz for internal logic paths under worst-case industrial temperature and voltage conditions. Actual achievable system clock frequency depends on design complexity, routing congestion, and I/O standard selection - verified through post-place-and-route static timing analysis in Xilinx ISE.
Does XC3S1000-5FGG676C support JTAG programming and debugging?
Yes, XC3S1000-5FGG676C fully supports IEEE 1149.1 JTAG boundary-scan for configuration, verification, and in-circuit debugging. Pins TCK, TMS, TDI, and TDO are dedicated to JTAG functionality and remain accessible even after configuration, enabling runtime visibility into I/O states and internal logic.
How much block RAM is available in XC3S1000-5FGG676C?
XC3S1000-5FGG676C contains 1,872 Kbits (234 KB) of total block RAM distributed across 32 RAMB16 blocks. Each block can be configured as 16K-bit single-port, 16K-bit true dual-port, or 8K-bit wide synchronous FIFO - supporting flexible memory architectures for buffering, lookup tables, or coefficient storage.
Can XC3S1000-5FGG676C be configured via SPI flash memory?
No, XC3S1000-5FGG676C does not support native SPI flash configuration. It requires Master Serial mode using XCFxx Platform Flash PROMs (e.g., XCF02S, XCF04S) or JTAG programming. External microcontrollers may emulate Master Serial mode via GPIO, but dedicated SPI interface is absent in the configuration controller.
What I/O standards are supported by XC3S1000-5FGG676C?
XC3S1000-5FGG676C supports 18 SelectIO standards including LVCMOS 3.3/2.5/1.8/1.5 V, LVTTL, PCI, SSTL2_I/II, SSTL3_I/II, HSTL_I/II, and GTL+. I/O banks are independently configurable, allowing mixed-voltage interfaces on a single device - critical for interfacing with DDR SDRAM, video DACs, and legacy microcontrollers.
XC3S1000-5FGG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1920
- Number of Logic Elements/Cells:
- 17280
- Total RAM Bits:
- 442368
- Number of I/O:
- 391
- Number of Gates:
- 1000000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC3S1000-5FGG676C FAQ
1.How can I place an order for XC3S1000-5FGG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1000-5FGG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1000-5FGG676C reliable?
The price and inventory of XC3S1000-5FGG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1000-5FGG676C is usually 5 days.
3.What payment methods are accepted for XC3S1000-5FGG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1000-5FGG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1000-5FGG676C?
XC3S1000-5FGG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1000-5FGG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1000-5FGG676C?
For technical support, including XC3S1000-5FGG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1000-5FGG676C requirements.
6.How does Aetrix verify that XC3S1000-5FGG676C is sourced from the original manufacturer or authorized distributors?
All XC3S1000-5FGG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1000-5FGG676C meets industry standards.
7.What is the process for return or replacement of XC3S1000-5FGG676C?
All XC3S1000-5FGG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1000-5FGG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1000-5FGG676C part is unused and in its original packaging.
Return procedure for XC3S1000-5FGG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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