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AMD XC3S1000-5FTG256C
- Part No.:
- XC3S1000-5FTG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S1000-5FTG256C.pdf
- Description:
- IC FPGA 173 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,182
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Product details
Overview
XC3S1000-5FTG256C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 1,000,000 system gates, 21,648 logic cells, and 173 I/O pins in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at 500 MHz system clock speed and supports LVCMOS, LVTTL, PCI, and SSTL I/O standards for embedded control and digital signal processing applications.
For engineers reviewing the XC3S1000-5FTG256C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O voltage compatibility, internal RAM capacity, and supported configuration modes (Master Serial, Slave Parallel, JTAG).
Technical Context
The XC3S1000-5FTG256C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, block RAM (472 kbits), and dedicated multipliers. It includes Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty cycle correction across up to four independent clock domains.
Configuration is performed via external PROM, serial mode using XCFxxPROMs, or parallel slave mode with microprocessor interface. The device supports IEEE 1149.1 JTAG boundary-scan testing and in-system programming through the JTAG port.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 21,648 - determines maximum combinational/sequential logic capacity for custom digital functions |
| System Gates | 1,000,000 - industry-standard metric for relative logic density vs. ASIC implementation |
| Block RAM | 472 kbits - enables on-chip data buffering, FIFOs, and small lookup tables without external memory |
| I/O Pins | 173 - supports high-pin-count interfaces including parallel buses and multi-standard I/O banks |
| DCMs | 4 - provide jitter-tolerant clock management for synchronous design timing closure |
| Max I/O Speed | 622 Mbps - enables high-speed serial links and DDR memory interfacing |
| Configuration Mode | Master Serial, Slave Parallel, JTAG - allows flexible boot methods and field updates |
Pinout & Package
XC3S1000-5FTG256C is housed in a 256-ball Fine-Pitch BGA (FTG) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and thermal pad for enhanced power dissipation. Pin assignment follows Xilinx Spartan-3 family standard layout with dedicated configuration, clock, JTAG, and I/O bank groups.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PROGRAM_B | Active-Low Configuration Initiate | Resets configuration logic and clears SRAM contents before new bitstream load |
| INIT_B | Configuration Status Output | Indicates successful CRC check or abort condition during configuration |
| DONE | Configuration Completion | Drives high when configuration is complete and device enters user mode |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | Enables IEEE 1149.1 test access, debug, and in-system programming |
| CLK0–CLK3 | Global Clock Inputs | Feed dedicated clock routing networks to minimize skew across CLB and RAM resources |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Multipliers | 40 × 40-bit hard multipliers accelerate DSP algorithms without consuming logic cells |
| SelectIO Technology | Per-bank I/O voltage support (1.2V–3.3V) enables mixed-voltage system interfacing |
| Digital Clock Manager (DCM) | Four DCMs provide precise clock phase alignment and frequency synthesis for timing-critical paths |
| Embedded Block RAM | 472 kbits of dual-port RAM supports simultaneous read/write operations for pipeline buffers |
| Configurable Logic Blocks | Each CLB contains two slices with four LUTs and eight flip-flops for efficient state machine implementation |
Applications
| Industrial Motion Control | Video Processing Engine |
|---|---|
Use Scenario: Real-time servo loop execution and encoder feedback decoding in CNC machines and robotic arms. IC Role / Device Role / Timing Role: FPGA fabric implements deterministic finite-state machines and PWM generators synchronized to 50–200 kHz control cycles. Use Value: 21,648 logic cells and 4 DCMs enable tight timing closure for sub-microsecond interrupt response and jitter-free pulse generation. | Use Scenario: HD video frame buffering, color space conversion, and edge detection in broadcast encoders. IC Role / Device Role / Timing Role: Configurable logic processes pixel streams while block RAM stores line buffers and coefficient tables. Use Value: 472 kbits of embedded RAM eliminates need for external SDRAM in compact video pipelines, reducing board area and latency. |
| Communications Baseband | Test & Measurement Instrumentation |
Use Scenario: Channel coding (Viterbi, Turbo), modulation mapping, and packet assembly in wireless base station subsystems. IC Role / Device Role / Timing Role: FPGA implements protocol-specific datapaths with pipelined arithmetic units and deep FIFOs. Use Value: 622 Mbps I/O speed supports direct connection to ADC/DAC interfaces and high-speed serial backplanes. | Use Scenario: High-precision waveform generation and real-time FFT analysis in digital oscilloscopes and spectrum analyzers. IC Role / Device Role / Timing Role: FPGA serves as reconfigurable signal processor with deterministic latency for trigger and acquisition logic. Use Value: SelectIO per-bank voltage support allows direct interfacing to 1.8V ADCs and 3.3V display controllers on same device. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based digital logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1500-5FG320C | Higher logic density (29,952 CLBs), 320-pin FBGA, 712 kbits block RAM | Better suited for larger datapaths and multi-channel systems requiring >1M gates | Select when XC3S1000-5FTG256C resource utilization exceeds 85% in critical designs |
| XC3S500E-4FG320C | Lower gate count (500K), smaller footprint (320-pin), enhanced I/O drive strength | Optimized for cost-sensitive industrial I/O consolidation with reduced logic needs | Choose for simpler control logic where XC3S1000-5FTG256C overdesign increases BOM cost |
Compared with XC3S1000-5FTG256C, XC3S1500-5FG320C offers higher scalability for complex signal processing, while XC3S500E-4FG320C reduces cost and power for fixed-function control-both require PCB redesign due to different package and pinout.
Availability
XC3S1000-5FTG256C is available at Aetrix Electronics and suitable for industrial motion control, video processing, communications baseband, and test & measurement instrumentation requiring stable component supply and long-term lifecycle support.
Supply support for XC3S1000-5FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-3 product family for legacy industrial and aerospace applications requiring proven reliability and long-lifecycle support.
The Spartan-3 family was designed for cost-optimized, high-volume embedded systems requiring moderate logic density, low-power operation, and multi-standard I/O flexibility.
FAQ
What is the operating temperature range for XC3S1000-5FTG256C?
The XC3S1000-5FTG256C is rated for commercial temperature operation from 0°C to +85°C ambient. This range applies to the C-grade version indicated by the final 'C' in the part number. Industrial-grade variants (I-grade) are not available for this specific FTG256 package configuration.
Does XC3S1000-5FTG256C support JTAG boundary-scan testing?
Yes, XC3S1000-5FTG256C fully supports IEEE 1149.1 JTAG boundary-scan testing. Its TCK, TMS, TDI, and TDO pins implement mandatory test access port functionality, enabling board-level interconnect verification and in-system programming without requiring external configuration PROMs.
What configuration methods are supported by XC3S1000-5FTG256C?
XC3S1000-5FTG256C supports Master Serial (via XCFxx PROM), Slave Parallel (with microprocessor bus interface), and JTAG modes. Configuration bitstream loading is initiated by PROGRAM_B, validated by INIT_B, and confirmed by DONE pin assertion.
How much embedded RAM does XC3S1000-5FTG256C provide?
XC3S1000-5FTG256C integrates 472 kbits of block RAM distributed across 20 RAM blocks. Each block is dual-port capable and supports synchronous read/write with programmable width-depth trade-offs, enabling efficient FIFOs, buffers, and lookup tables.
Is XC3S1000-5FTG256C pin-compatible with other Spartan-3 devices?
No, XC3S1000-5FTG256C is not pin-compatible with other Spartan-3 devices due to its unique 256-ball FTG package and specific I/O bank arrangement. Migration to XC3S1500-5FG320C or XC3S500E-4FG320C requires PCB redesign and signal reassignment.
XC3S1000-5FTG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1920
- Number of Logic Elements/Cells:
- 17280
- Total RAM Bits:
- 442368
- Number of I/O:
- 173
- Number of Gates:
- 1000000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S1000-5FTG256C FAQ
1.How can I place an order for XC3S1000-5FTG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1000-5FTG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1000-5FTG256C reliable?
The price and inventory of XC3S1000-5FTG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1000-5FTG256C is usually 5 days.
3.What payment methods are accepted for XC3S1000-5FTG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1000-5FTG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1000-5FTG256C?
XC3S1000-5FTG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1000-5FTG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1000-5FTG256C?
For technical support, including XC3S1000-5FTG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1000-5FTG256C requirements.
6.How does Aetrix verify that XC3S1000-5FTG256C is sourced from the original manufacturer or authorized distributors?
All XC3S1000-5FTG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1000-5FTG256C meets industry standards.
7.What is the process for return or replacement of XC3S1000-5FTG256C?
All XC3S1000-5FTG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1000-5FTG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1000-5FTG256C part is unused and in its original packaging.
Return procedure for XC3S1000-5FTG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC3S1000-5FTG256C Tags
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