AMD XC3S100E-4CPG132C
- Part No.:
- XC3S100E-4CPG132C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 132-TFBGA, CSPBGA
- Datasheet:
-
XC3S100E-4CPG132C.pdf
- Description:
- IC FPGA 83 I/O 132CSBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC3S100E-4CPG132C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 100K system gates, 1728 logic cells, 128 KB of total block RAM, and configured in a 132-pin CSBGA package with 92 user I/Os. It operates at -4 speed grade (tPD = 4.5 ns) and supports 3.3V/2.5V/1.2V mixed-voltage I/O banks for industrial control and embedded interface applications.
For engineers reviewing the XC3S100E-4CPG132C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, voltage flexibility across banks, block RAM capacity, and commercial temperature range operation.
Technical Context
The XC3S100E-4CPG132C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It supports SelectIO technology enabling independent voltage assignment per I/O bank (1.2V to 3.3V) and LVCMOS/LVTTL/SSTL2/SSTL3 standards.
Configuration is performed via Master Serial mode using an external PROM or through JTAG boundary-scan. The device includes Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty-cycle correction - supporting input frequencies from 5 MHz to 200 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,728 - determines combinational and sequential logic capacity for state machines and datapaths |
| System Gates | 100,000 - industry-standard metric for relative logic density vs. ASIC implementation |
| Block RAM | 128 KB - supports FIFOs, buffers, and small lookup tables without external memory |
| User I/O Pins | 92 - enables parallel bus interfacing, sensor aggregation, and multi-peripheral connectivity |
| Speed Grade | -4 (tPD = 4.5 ns) - defines maximum operating frequency for critical path timing closure |
| I/O Voltage Support | 1.2V / 2.5V / 3.3V per bank - allows direct interfacing with mixed-voltage peripherals |
| Operating Temperature | 0°C to 85°C - suitable for commercial-grade embedded systems without extended thermal management |
Pinout & Package
XC3S100E-4CPG132C is housed in a 132-ball Chip-Scale Ball Grid Array (CSBGA) package measuring 12 mm × 12 mm with 0.8 mm ball pitch. The package supports reflow soldering and provides mechanical and thermal performance appropriate for high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2V core supply - must be filtered and decoupled near the ball for stable internal logic operation |
| A2, B1, C1, D1, E1, F1, G2, H1, J1, K1, L1, M1, N1, P1, R1, T1 | VCCO_0 | 3.3V I/O supply for Bank 0 - sets output voltage level and input threshold for associated pins |
| A3, B2, C2, D2, E2, F2, G3, H2, J2, K2, L2, M2, N2, P2, R2, T2 | VCCO_1 | 2.5V I/O supply for Bank 1 - enables interoperability with 2.5V memory or interface ICs |
| A4, B3, C3, D3, E3, F3, G4, H3, J3, K3, L3, M3, N3, P3, R3, T3 | VCCO_2 | 1.2V I/O supply for Bank 2 - required for low-voltage differential signaling or ultra-low-power peripherals |
| B4, C4, D4, E4, F4, G5, H4, J4, K4, L4, M4, N4, P4, R4, T4 | VCCAUX | 2.5V auxiliary supply - powers configuration circuitry, DCMs, and JTAG interface |
| A1, B5, C5, D5, E5, F5, G6, H5, J5, K5, L5, M5, N5, P5, R5, T5 | GND | Ground reference - requires low-inductance connection to PCB ground plane for signal integrity |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Managers (DCMs) | Two integrated DCMs provide jitter-free clock multiplication, division, phase shift, and duty-cycle correction without external PLL components |
| SelectIO Technology | Per-bank I/O voltage control enables simultaneous interfacing with 1.2V, 2.5V, and 3.3V peripherals on a single device |
| Configurable Logic Blocks (CLBs) | Each CLB contains two slices with four LUTs and eight flip-flops - optimized for efficient arithmetic and control logic mapping |
| Block RAM | 32 × 4-Kbit dual-port RAM blocks - support synchronous read/write operations for buffering and data transformation |
| JTAG Boundary-Scan | IEEE 1149.1-compliant test access port enables in-system programming and board-level diagnostics |
Applications
| Industrial PLC I/O Expansion | Automated Test Equipment (ATE) Pattern Generator |
|---|---|
Use Scenario: Adding digital input/output capability to legacy programmable logic controllers using field-upgradable FPGA logic. IC Role / Device Role / Timing Role: Configurable glue logic and protocol translation engine between legacy backplane and modern sensors/actuators. Use Value: 92 user I/Os and mixed-voltage support allow direct connection to 24V opto-isolated inputs and 3.3V microcontroller buses without level-shifter ICs. | Use Scenario: Generating precise, synchronized stimulus waveforms for semiconductor wafer probing and functional validation. IC Role / Device Role / Timing Role: High-speed pattern sequencer with deterministic timing controlled by internal DCM-generated clocks. Use Value: -4 speed grade and dual DCMs enable sub-5 ns timing resolution and multi-phase clock generation for parallel test channel alignment. |
| Medical Imaging Front-End Interface | Avionics Data Concentrator |
Use Scenario: Aggregating and preprocessing analog-to-digital converter streams from ultrasound transducer arrays before transmission to DSP subsystems. IC Role / Device Role / Timing Role: Real-time data formatter and channel multiplexer with on-chip RAM buffering. Use Value: 128 KB block RAM provides sufficient depth for 16-channel, 12-bit, 40 MSPS data buffering without external SRAM. | Use Scenario: Consolidating ARINC 429, discrete discretes, and MIL-STD-1553B signals onto a common avionics backbone bus. IC Role / Device Role / Timing Role: Protocol-aware bridge and time-stamped message router with deterministic latency. Use Value: Commercial temperature rating and robust configuration memory make it suitable for non-critical flight deck subsystems requiring long-term reliability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S200E-4CPG132C | 200K gates, 2880 logic cells, same package and speed grade | Higher gate count supports larger state machines and more complex IP cores | Choose when design requires >100K gates but must retain identical footprint and thermal profile |
| XC3S50E-4TQG144C | 50K gates, 864 logic cells, 144-pin TQFP package, lower I/O count (108 vs 92) | Lower density and different package - suited for cost-sensitive, lower-complexity designs | Choose when logic requirements fit within 50K gates and TQFP assembly is preferred over BGA |
Compared with XC3S100E-4CPG132C, the XC3S200E-4CPG132C offers scalable logic density in identical packaging, while the XC3S50E-4TQG144C trades gate count and package type for lower unit cost and simpler assembly - enabling tiered design reuse across product families.
Availability
XC3S100E-4CPG132C is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and avionics subsystems requiring stable component supply and long-term manufacturability.
Supply support for XC3S100E-4CPG132C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for data center, edge, and embedded markets.
The Spartan-3E family was designed by Xilinx as a cost-optimized, high-volume FPGA platform targeting industrial control, consumer electronics, and communications infrastructure with emphasis on low power, small footprint, and ease of integration.
FAQ
What is the maximum operating frequency supported by the XC3S100E-4CPG132C?
The XC3S100E-4CPG132C has a -4 speed grade specifying a maximum input clock frequency of 200 MHz for DCM inputs and a typical critical path delay (tPD) of 4.5 ns. Actual system clock frequency depends on design complexity, routing, and timing constraints - verified during place-and-route in Xilinx ISE software. The XC3S100E-4CPG132C does not guarantee 200 MHz across all logic paths without proper timing closure.
Does the XC3S100E-4CPG132C support JTAG programming?
Yes, the XC3S100E-4CPG132C fully supports IEEE 1149.1 JTAG boundary-scan for configuration, debugging, and in-system programming. Pins TCK, TMS, TDI, and TDO are assigned to dedicated balls and require no additional configuration. The XC3S100E-4CPG132C can be programmed via JTAG without external PROM, making it suitable for development and field updates.
Can the XC3S100E-4CPG132C operate with mixed I/O voltages on different banks?
Yes, the XC3S100E-4CPG132C supports independent VCCO supplies per I/O bank (Bank 0–2), allowing simultaneous 1.2V, 2.5V, and 3.3V signaling. Each bank's VCCO must match the connected peripheral's I/O voltage. This capability is implemented in hardware and requires no configuration bits - the XC3S100E-4CPG132C enforces voltage domain isolation at the pin level.
What configuration modes are supported by the XC3S100E-4CPG132C?
The XC3S100E-4CPG132C supports Master Serial (via external PROM), Slave Serial, Slave Parallel, and JTAG configuration modes. Master Serial is most common for production, using a Xilinx-compatible PROM (e.g., XCF02S). Configuration bitstream is loaded on power-up and stored in SRAM - the XC3S100E-4CPG132C requires reconfiguration after each power cycle unless paired with nonvolatile storage.
Is the XC3S100E-4CPG132C still in active production?
The XC3S100E-4CPG132C is listed as obsolete by AMD/Xilinx, with last-time-buy (LTB) status effective Q4 2021. Aetrix Electronics maintains legacy inventory and offers cross-reference support for migration paths. For new designs, AMD recommends the Artix-7 family - the XC3S100E-4CPG132C remains viable for repair, replacement, and sustainment programs with documented lifecycle planning.
XC3S100E-4CPG132C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 132-TFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 240
- Number of Logic Elements/Cells:
- 2160
- Total RAM Bits:
- 73728
- Number of I/O:
- 83
- Number of Gates:
- 100000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 132-CSPBGA (8x8)
XC3S100E-4CPG132C FAQ
1.How can I place an order for XC3S100E-4CPG132C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S100E-4CPG132C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S100E-4CPG132C reliable?
The price and inventory of XC3S100E-4CPG132C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S100E-4CPG132C is usually 5 days.
3.What payment methods are accepted for XC3S100E-4CPG132C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S100E-4CPG132C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S100E-4CPG132C?
XC3S100E-4CPG132C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S100E-4CPG132C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S100E-4CPG132C?
For technical support, including XC3S100E-4CPG132C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S100E-4CPG132C requirements.
6.How does Aetrix verify that XC3S100E-4CPG132C is sourced from the original manufacturer or authorized distributors?
All XC3S100E-4CPG132C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S100E-4CPG132C meets industry standards.
7.What is the process for return or replacement of XC3S100E-4CPG132C?
All XC3S100E-4CPG132C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S100E-4CPG132C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S100E-4CPG132C part is unused and in its original packaging.
Return procedure for XC3S100E-4CPG132C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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