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AMD XC3S100E-4CPG132I
- Part No.:
- XC3S100E-4CPG132I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 132-TFBGA, CSPBGA
- Datasheet:
-
XC3S100E-4CPG132I.pdf
- Description:
- IC FPGA 83 I/O 132CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,354
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Product details
Overview
XC3S100E-4CPG132I from AMD (formerly Xilinx) is a Spartan-3E FPGA with 100,000 system gates, 1,728 logic cells, and 132-pin CSP BGA package. It operates at -4 speed grade (tPD = 4.6 ns), supports 3.3V I/O, and includes embedded block RAM (360 Kb), DLLs, and multipliers. It is used in industrial control logic and low-cost communication interface bridging.
For engineers reviewing the XC3S100E-4CPG132I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O voltage compatibility, DLL availability for clock deskew, embedded RAM size, and BGA thermal/mechanical constraints in space-constrained PCBs.
Technical Context
The XC3S100E-4CPG132I implements a configurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates twelve 18×18 multipliers and eight DLLs for internal clock management and I/O timing control.
Configuration is performed via Master Serial mode using external PROM or processor-controlled JTAG. It supports SelectIO standards including LVCMOS, LVTTL, PCI, and SSTL-2, with programmable drive strength and slew rate per bank.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,728 - defines maximum combinational/sequential logic capacity for custom digital functions |
| System Gates | 100,000 - industry-standard metric for relative logic density vs. ASIC equivalents |
| Block RAM | 360 Kb - supports FIFOs, buffers, and small lookup tables without external memory |
| Speed Grade | -4 - guarantees 4.6 ns maximum propagation delay for critical path timing closure |
| I/O Standards | LVCMOS/LVTTL/PCI/SSTL-2 - enables direct interfacing to common microcontrollers, memories, and buses |
| DLLs | 8 - provides clock deskew, phase shifting, and frequency synthesis within the device |
| Package | 132-pin CSP BGA (6×6 mm, 0.5 mm pitch) - compact footprint with thermal vias for industrial ambient operation |
Pinout & Package
XC3S100E-4CPG132I uses a 132-ball Chip-Scale Package Ball Grid Array (CSP BGA) with 6×6 mm body, 0.5 mm pitch, and thermal ball array (TBA) configuration. Package meets JEDEC MO-220 standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply - must be filtered and decoupled near package for stable logic operation |
| A1, A2, B1 | VCCAUX | 2.5 V auxiliary supply - powers configuration logic, DLLs, and I/O banks requiring higher voltage |
| C2, C3, D1, D2, E1, E2 | VCCO_0 | 3.3 V I/O bank supply - sets output voltage level and input threshold for Bank 0 pins |
| R1, R2, T1, T2, U1, U2 | VCCO_2 | 3.3 V I/O bank supply - independently configurable for mixed-voltage interface in Bank 2 |
| M1 | PROGRAM_B | Active-low configuration reset - initiates reconfiguration when pulled low after power-up |
| N1 | INIT_B | Open-drain status indicator - goes high-Z during configuration, low on error or completion |
| P1 | CCLK | Configuration clock input - drives serial bitstream loading in Master Serial mode |
| P2 | DIN | Serial configuration data input - accepts bitstream from PROM or processor |
Key Features
| Feature | Design Value |
|---|---|
| Embedded Multipliers | Twelve 18×18 signed/unsigned multipliers - enable real-time DSP operations like FIR filtering without external ICs |
| SelectIO Technology | Per-bank I/O voltage and standard selection - allows concurrent interfacing to 3.3 V peripherals and 2.5 V memory |
| Digital Clock Managers (DLLs) | Eight DLLs with phase shift and frequency synthesis - eliminate external clock buffers and reduce jitter in timing-critical paths |
| Configurable Logic Blocks (CLBs) | 1,728 CLBs each with two 4-LUTs + flip-flop - support high fan-in logic and registered outputs for pipeline stages |
| Block RAM | Twenty 18 Kb dual-port RAM blocks - permit simultaneous read/write access for buffering and data coalescing |
Applications
| Industrial PLC Logic | USB-to-Parallel Bridge |
|---|---|
Use Scenario: Replacing fixed-function ASICs in programmable logic controllers for I/O scanning and ladder logic execution. IC Role / Device Role / Timing Role: Configurable state machine and glue logic controller managing discrete sensor inputs and relay outputs. Use Value: Enables field-upgradable control algorithms and reduces BOM count by integrating timing, logic, and bus interface functions. | Use Scenario: Converting USB 2.0 host commands into parallel printer or display control signals in embedded peripherals. IC Role / Device Role / Timing Role: Protocol translator and timing adapter synchronizing asynchronous USB packets with synchronous parallel strobes. Use Value: Eliminates need for separate USB controller + parallel driver ICs, lowering cost and board area in white-goods HMI modules. |
| Low-Cost Video Timing Controller | Motor Drive Interface Logic |
Use Scenario: Generating VGA or SVGA sync signals and pixel clock alignment in entry-level digital signage displays. IC Role / Device Role / Timing Role: Pixel clock generator and horizontal/vertical blanking interval sequencer with programmable resolution support. Use Value: Provides flexible timing generation across multiple display formats using single hardware platform and firmware update. | Use Scenario: Managing PWM distribution, direction sequencing, and fault feedback for 3-phase BLDC motor drivers in HVAC blowers. IC Role / Device Role / Timing Role: Real-time commutation sequencer and safety monitor coordinating gate driver enable/disable and current sense sampling. Use Value: Supports dynamic torque adjustment and overcurrent shutdown response within <1 µs latency, improving motor reliability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S200E-4CPG132I | 200K system gates, 3,888 logic cells, same package and speed grade | Higher logic density supports larger state machines or additional peripheral interfaces | Select when XC3S100E-4CPG132I resource utilization exceeds 85% in synthesis reports |
| XC3S50E-4VQ100C | 50K system gates, 1,248 logic cells, 100-pin VQFP package, commercial temp range | Smaller footprint, no thermal balls, lower I/O count (66 vs. 92 user I/O) | Choose for cost-sensitive, non-industrial designs where board space and temperature margin allow QFP handling |
Compared with XC3S100E-4CPG132I, the XC3S200E-4CPG132I offers scalable logic headroom without layout change, while the XC3S50E-4VQ100C trades density and thermal performance for simplified assembly and lower unit cost in benign environments.
Availability
XC3S100E-4CPG132I is available at Aetrix Electronics and suitable for industrial control, embedded interface bridging, and video timing applications requiring stable component supply and long-term lifecycle support.
Supply support for XC3S100E-4CPG132I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family for cost-sensitive, high-volume embedded applications.
The Spartan-3E family was designed for mainstream logic replacement and interface consolidation in industrial, automotive, and consumer electronics where low power and small footprint are essential.
FAQ
What is the maximum operating junction temperature for XC3S100E-4CPG132I?
The XC3S100E-4CPG132I has an industrial temperature grade (–40°C to +100°C), with maximum junction temperature of +125°C under specified thermal conditions. Its CSP BGA package includes thermal balls to maintain safe junction temperatures in enclosed enclosures. Thermal design must account for 1.2 V core and 2.5 V auxiliary supply dissipation when XC3S100E-4CPG132I operates at full logic utilization.
Does XC3S100E-4CPG132I support JTAG boundary-scan testing?
Yes, XC3S100E-4CPG132I fully supports IEEE 1149.1 JTAG boundary-scan for PCB interconnect testing and in-system programming. The TDI, TDO, TMS, and TCK pins are dedicated and accessible in the 132-ball CSP BGA layout. JTAG mode does not require external configuration PROM and can be used for both debug and production programming of XC3S100E-4CPG132I.
Can XC3S100E-4CPG132I configure itself from SPI flash without a microcontroller?
Yes, XC3S100E-4CPG132I supports Master Serial configuration mode, allowing autonomous boot from standard SPI serial PROMs such as XCF01S or third-party compatible devices. The CCLK and DIN pins drive the configuration sequence upon power-up or PROGRAM_B assertion, enabling standalone startup without host processor intervention for XC3S100E-4CPG132I.
What I/O standards are supported on Bank 0 of XC3S100E-4CPG132I?
Bank 0 of XC3S100E-4CPG132I supports LVCMOS 3.3 V, LVTTL, PCI, and SSTL-2 I/O standards. Voltage is set by VCCO_0 (3.3 V), and drive strength/slew rate are configurable per pin. Input thresholds and output drive levels comply with respective JEDEC specifications when XC3S100E-4CPG132I is operated within recommended voltage and temperature ranges.
Is XC3S100E-4CPG132I RoHS compliant and lead-free?
Yes, XC3S100E-4CPG132I is RoHS-compliant and lead-free, meeting EU Directive 2011/65/EU and IPC/JEDEC J-STD-609A Class 3 marking requirements. The CSP BGA package uses matte tin finish on solder balls, and all die attach, mold compound, and substrate materials are halogen-free. Full compliance documentation is available for XC3S100E-4CPG132I through AMD's product change notifications.
XC3S100E-4CPG132I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 132-TFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 240
- Number of Logic Elements/Cells:
- 2160
- Total RAM Bits:
- 73728
- Number of I/O:
- 83
- Number of Gates:
- 100000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 132-CSPBGA (8x8)
XC3S100E-4CPG132I FAQ
1.How can I place an order for XC3S100E-4CPG132I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S100E-4CPG132I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S100E-4CPG132I reliable?
The price and inventory of XC3S100E-4CPG132I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S100E-4CPG132I is usually 5 days.
3.What payment methods are accepted for XC3S100E-4CPG132I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S100E-4CPG132I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S100E-4CPG132I?
XC3S100E-4CPG132I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S100E-4CPG132I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S100E-4CPG132I?
For technical support, including XC3S100E-4CPG132I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S100E-4CPG132I requirements.
6.How does Aetrix verify that XC3S100E-4CPG132I is sourced from the original manufacturer or authorized distributors?
All XC3S100E-4CPG132I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S100E-4CPG132I meets industry standards.
7.What is the process for return or replacement of XC3S100E-4CPG132I?
All XC3S100E-4CPG132I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S100E-4CPG132I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S100E-4CPG132I part is unused and in its original packaging.
Return procedure for XC3S100E-4CPG132I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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