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AMD XC3S100E-4TQ144C
- Part No.:
- XC3S100E-4TQ144C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 144-LQFP
- Datasheet:
-
XC3S100E-4TQ144C.pdf
- Description:
- IC FPGA 108 I/O 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,183
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Product details
Overview
XC3S100E-4TQ144C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 100K system gates, 1728 logic cells, 24 I/O banks, and 1.2 Mb of total block RAM. It operates at -4 speed grade (1.14 ns CLB delay), uses 1.2 V core voltage, and is packaged in a 144-pin TQFP with 108 user I/Os. It targets low-cost industrial control and embedded interface bridging.
For engineers reviewing the XC3S100E-4TQ144C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, block RAM depth, speed grade timing closure, and TQFP thermal profile for convection-cooled PCBs.
Technical Context
The XC3S100E-4TQ144C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It supports SelectIO standards including LVCMOS, LVTTL, PCI, and SSTL-2, with programmable drive strength and slew rate per bank.
Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan. The device includes Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty-cycle correction across up to eight independent clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1728 - defines maximum combinational/sequential logic capacity for RTL implementation |
| System Gates | 100,000 - indicates relative logic density versus ASIC gate count benchmarks |
| Block RAM | 288 kbits (24 × 12 kb blocks) - supports FIFOs, dual-port buffers, and local data storage without external memory |
| I/O Pins | 108 user-configurable - enables parallel bus interfacing, sensor aggregation, or multi-peripheral connectivity |
| Speed Grade | -4 (1.14 ns CLB propagation) - guarantees timing closure for 85 MHz system clocks in typical conditions |
| Core Voltage | 1.2 V ±3% - requires tight-regulation DC-DC supply; impacts dynamic power and thermal dissipation |
Pinout & Package
XC3S100E-4TQ144C is housed in a 144-pin Thin Quad Flat Package (TQFP) with 20×20 mm body, 0.5 mm pitch, and exposed thermal pad (non-electrical). Package meets JEDEC MS-026 standard and supports reflow soldering per IPC/JEDEC J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1–P4, R1–R4 | CONFIG_IO / INIT_B | Active-low configuration initialization signal; pulled high during startup to enable configuration sequence |
| T2, U2 | CCLK | Configuration clock input; drives internal shift registers during Master Serial PROM loading |
| V2, W2 | DIN / PROGRAM_B | Serial configuration data input; PROGRAM_B resets configuration logic when asserted low |
| A14–D14, A1–D1 | IO_LxxN/IO_LxxP | Differential I/O pairs supporting LVDS, RSDS, or TMDS signaling with internal termination |
| E1–E14, F1–F14 | VCCO_0–VCCO_3 | Bank-specific I/O supply rails; each set independently configurable for 1.2–3.3 V logic standards |
| J1–J14, K1–K14 | VCCINT | 1.2 V core power rail; must be decoupled with ≥10 µF ceramic + 100 nF MLCC per power plane |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Manager (DCM) | Two DCMs per device provide jitter-reduced clock synthesis, 90° phase shift, and 2x/4x frequency multiplication for synchronous peripheral interfaces |
| SelectIO Technology | Per-bank voltage selection (1.2–3.3 V) and programmable drive/slew enables direct connection to mixed-voltage peripherals without level shifters |
| Embedded Multipliers | Four 18×18-bit signed multipliers support real-time filtering, motor control algorithms, and digital signal preprocessing |
| Boundary-Scan Support | IEEE 1149.1-compliant JTAG TAP enables in-system programming, debug visibility, and production test access without additional probes |
Applications
| Industrial PLC I/O Expansion | Legacy Bus Interface Bridge |
|---|---|
Use Scenario: Adding isolated analog/digital I/O modules to DIN-rail mounted PLCs with space-constrained enclosures. IC Role / Device Role / Timing Role: FPGA fabric implements custom protocol translation (Modbus RTU ↔ SPI), GPIO expansion, and watchdog-controlled reset sequencing. Use Value: 108 I/Os and 24 I/O banks allow simultaneous connection to multiple sensor types and fieldbus transceivers without glue logic. | Use Scenario: Bridging ISA or CompactPCI parallel buses to modern microcontroller-based control units in test equipment upgrades. IC Role / Device Role / Timing Role: Acts as synchronous bus arbiter and address decoder, managing burst transfers between legacy peripherals and ARM Cortex-M4 hosts. Use Value: -4 speed grade ensures sub-10 ns setup/hold timing margins for 33 MHz PCI-like cycles, eliminating external latch synchronization. |
| Video Signal Formatter | Configurable Sensor Hub |
Use Scenario: Converting raw CMOS image sensor output (10-bit parallel, 25 MHz pixel clock) into MIPI CSI-2 packets for embedded vision SoCs. IC Role / Device Role / Timing Role: Implements pixel clock domain crossing, line buffering using block RAM, and packet framing logic with CRC generation. Use Value: 288 kbits of block RAM provides sufficient depth for two-line full-width buffering at VGA resolution, enabling zero-drop frame capture. | Use Scenario: Aggregating data from 12+ heterogeneous sensors (I²C, SPI, UART) in environmental monitoring nodes with battery-powered operation. IC Role / Device Role / Timing Role: Serves as time-synchronized data concentrator with wake-on-event logic, low-power state retention, and hardware-accelerated checksum offload. Use Value: Dual DCMs generate precise 32.768 kHz RTC clock and 1 MHz sensor sampling clock simultaneously, reducing external oscillator count by one. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic integration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Xilinx XC3S200E-4TQ144C | 200K gates, 2868 logic cells, 360 kbits block RAM - higher density but same package and pinout | Supports larger state machines and deeper pipeline stages; suitable when XC3S100E-4TQ144C resource utilization exceeds 90% | Select if design requires >1728 logic cells or >288 kbits RAM while retaining identical PCB layout and thermal profile |
| Lattice LCMXO2-2000HC-4TG144C | MachXO2 PLD with 2K LUTs, 128 kbits embedded RAM, 111 I/Os, 1.2 V core - lower gate count but instant-on, non-volatile configuration | Better suited for glue logic, I/O expansion, and power-on-reset sequencing where FPGA reconfiguration delay is unacceptable | Choose when deterministic boot time, single-supply simplicity, or SRAM-less reliability outweighs need for complex RTL synthesis capability |
Compared with XC3S100E-4TQ144C, XC3S200E-4TQ144C offers scalable logic headroom within identical mechanical and thermal constraints, while LCMXO2-2000HC-4TG144C trades programmable fabric flexibility for zero-configuration latency and reduced BOM count.
Availability
XC3S100E-4TQ144C is available at Aetrix Electronics and suitable for industrial automation, embedded vision preprocessing, and legacy system modernization requiring stable component supply and long-term obsolescence management.
Supply support for XC3S100E-4TQ144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for hardware-accelerated workloads.
The Spartan-3E family was designed for cost-sensitive, high-volume embedded applications requiring moderate logic density, flexible I/O, and proven configuration reliability - especially in industrial and automotive subsystems.
FAQ
What is the maximum operating frequency supported by XC3S100E-4TQ144C?
The XC3S100E-4TQ144C has a -4 speed grade specifying 1.14 ns CLB propagation delay. This enables reliable operation of synchronous logic at up to 85 MHz under typical voltage and temperature conditions. Actual maximum frequency depends on design topology, routing congestion, and I/O standard selection - verified through static timing analysis in Xilinx ISE.
Does XC3S100E-4TQ144C support JTAG boundary-scan for in-circuit testing?
Yes, XC3S100E-4TQ144C fully complies with IEEE 1149.1 and includes a dedicated JTAG TAP controller. It supports instruction register scan, device ID readback, and boundary-scan testing of all I/O pins. Configuration can also be performed via JTAG, making it suitable for production test and field firmware updates without requiring external PROM.
Can XC3S100E-4TQ144C operate with mixed I/O voltage standards on different banks?
Yes, XC3S100E-4TQ144C supports independent VCCO supplies per I/O bank (up to 24 banks). Each bank can be set to 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V, enabling simultaneous connection to DDR2 memory, microcontrollers, and legacy TTL peripherals without external level shifters.
How much block RAM is available in XC3S100E-4TQ144C and how is it organized?
XC3S100E-4TQ144C contains 288 kbits of total block RAM, implemented as twenty-four 12-kbit blocks. Each block can be configured as 16K × 1, 8K × 2, 4K × 4, 2K × 9, or 1K × 18, supporting true dual-port operation with independent read/write clocks - ideal for FIFOs, frame buffers, and lookup tables.
Is XC3S100E-4TQ144C pin-compatible with other Spartan-3E devices in TQ144 packaging?
XC3S100E-4TQ144C shares the same 144-pin TQFP footprint and pin assignment with XC3S200E-4TQ144C and XC3S500E-4TQ144C. Power, ground, configuration, and I/O pin locations are identical across this package variant, enabling drop-in replacement within the same speed grade and family for design scalability.
XC3S100E-4TQ144C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 144-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 240
- Number of Logic Elements/Cells:
- 2160
- Total RAM Bits:
- 73728
- Number of I/O:
- 108
- Number of Gates:
- 100000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 144-TQFP (20x20)
XC3S100E-4TQ144C FAQ
1.How can I place an order for XC3S100E-4TQ144C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S100E-4TQ144C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S100E-4TQ144C reliable?
The price and inventory of XC3S100E-4TQ144C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S100E-4TQ144C is usually 5 days.
3.What payment methods are accepted for XC3S100E-4TQ144C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S100E-4TQ144C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S100E-4TQ144C?
XC3S100E-4TQ144C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S100E-4TQ144C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S100E-4TQ144C?
For technical support, including XC3S100E-4TQ144C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S100E-4TQ144C requirements.
6.How does Aetrix verify that XC3S100E-4TQ144C is sourced from the original manufacturer or authorized distributors?
All XC3S100E-4TQ144C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S100E-4TQ144C meets industry standards.
7.What is the process for return or replacement of XC3S100E-4TQ144C?
All XC3S100E-4TQ144C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S100E-4TQ144C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S100E-4TQ144C part is unused and in its original packaging.
Return procedure for XC3S100E-4TQ144C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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