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AMD XC3S100E-4TQG144I
- Part No.:
- XC3S100E-4TQG144I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 144-LQFP
- Datasheet:
-
XC3S100E-4TQG144I.pdf
- Description:
- IC FPGA 108 I/O 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:9,129
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Product details
Overview
XC3S100E-4TQG144I from AMD (formerly Xilinx) is a Spartan-3E FPGA with 100K system gates, 1728 logic cells, 128 KB of total block RAM, 12 I/O banks supporting LVCMOS/LVTTL/SSTL standards, and operates at -4 speed grade (1.13 ns CLB delay). It is used in industrial control logic, low-cost video interface bridging, and reconfigurable peripheral controllers.
For engineers reviewing the XC3S100E-4TQG144I datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage flexibility (1.2V/1.5V/1.8V/2.5V/3.3V), embedded multipliers (four 18×18-bit), global clock network (eight dedicated clock lines), and JTAG boundary-scan compliance per IEEE 1149.1.
Technical Context
The XC3S100E-4TQG144I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated carry logic for arithmetic. It supports SelectIO technology enabling mixed-voltage I/O operation across 12 independent banks.
Configuration is performed via Master Serial mode using external PROM or through JTAG boundary-scan. The device includes four 18×18-bit signed multipliers, eight global clock buffers, and supports Digital Clock Manager (DCM) functionality for input clock doubling, halving, phase shifting, and duty cycle correction.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,728 - provides combinational and sequential logic capacity for medium-complexity digital control functions |
| Block RAM | 128 KB - enables on-chip data buffering, FIFOs, and small lookup tables without external memory |
| I/O Pins | 108 user I/O - supports parallel bus interfaces, sensor arrays, and multi-protocol peripheral connectivity |
| Speed Grade | -4 - guarantees 1.13 ns CLB propagation delay, suitable for 100 MHz system clock domains |
| DCM Units | 2 - delivers clock synthesis, phase alignment, and jitter reduction for synchronous design timing closure |
| Embedded Multipliers | 4 × 18×18-bit - accelerates fixed-point math in motor control, filtering, and protocol processing |
| Configuration Mode | Master Serial / JTAG - allows field reprogramming and production test via standard boundary-scan infrastructure |
Pinout & Package
TQG144 is a 144-pin Thin Quad Flatpack (TQFP) package with 0.5 mm pitch, lead-free (RoHS-compliant), and thermal pad exposed on underside for enhanced heat dissipation in industrial ambient conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply - must be filtered and decoupled locally to meet noise tolerance for CLB and DCM operation |
| P2 | VCCAUX | 2.5 V auxiliary supply - powers configuration logic, DCM, and JTAG circuitry |
| A14 | PROGRAM_B | Active-low configuration reset - initiates reconfiguration sequence when asserted |
| D13 | DONE | Open-drain status output - goes high when configuration completes successfully |
| R13 | TCK | JTAG clock input - synchronizes boundary-scan test and programming operations |
| R14 | TMS | JTAG mode select - controls state transitions in TAP controller during debug or config |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO Technology | Supports mixed-voltage I/O (1.2V–3.3V) across 12 independent banks - enables direct interfacing with legacy and modern peripherals without level shifters |
| Digital Clock Manager (DCM) | Two fully independent DCMs - provide deterministic clock deskew, frequency synthesis, and jitter attenuation for timing-critical subsystems |
| Embedded Multipliers | Four 18×18-bit signed multipliers - offload arithmetic-intensive tasks from soft CPU cores in microcontroller-like implementations |
| Configurable Logic Blocks | 1,728 CLBs with 4-LUT + flip-flop structure - deliver predictable timing and efficient mapping of finite-state machines and datapaths |
| Boundary-Scan Support | IEEE 1149.1 compliant - enables PCB-level interconnect testing and in-system programming without custom test fixtures |
Applications
| Industrial PLC I/O Expansion | Video Format Converter |
|---|---|
Use Scenario: Adding isolated digital input/output channels to programmable logic controllers in factory automation cabinets. IC Role / Device Role / Timing Role: Reconfigurable glue logic and protocol translation engine between field sensors/actuators and main CPU bus. Use Value: Enables flexible I/O mapping and real-time response (<5 µs latency) using on-chip DCM-synchronized logic. | Use Scenario: Converting VGA (640×480@60Hz) to HDMI 1.3a pixel stream in compact media adapters. IC Role / Device Role / Timing Role: Pixel clock domain crossing, color space conversion pipeline, and TMDS encoding controller. Use Value: Leverages embedded multipliers for RGB-YUV matrix math and block RAM for line buffering with zero external memory. |
| USB-to-Parallel Bridge | Motor Control Sequencer |
Use Scenario: Retrofitting legacy parallel-port printers with USB 2.0 host connectivity in office equipment. IC Role / Device Role / Timing Role: USB endpoint controller + parallel port state machine + FIFO management unit. Use Value: Uses 128 KB block RAM as dual-port buffer to absorb USB burst transfers and smooth parallel output timing. | Use Scenario: Closed-loop commutation sequencing for 3-phase BLDC motors in HVAC blowers and power tools. IC Role / Device Role / Timing Role: Real-time PWM generator with Hall sensor decoding, dead-time insertion, and fault monitoring logic. Use Value: Achieves <100 ns PWM edge resolution using CLB-based counters synchronized to DCM-stabilized clocks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S200E-4TQG144I | 200K gate capacity, 2,712 logic cells, 216 KB block RAM - higher resource density but same package and pinout | Supports larger state machines and deeper FIFOs; suitable for expanded protocol stacks or dual-channel video processing | Choose when XC3S100E-4TQG144I resources are insufficient but board layout and I/O count must remain unchanged |
| LFE5U-25F-6BG256C | 25K LUTs, embedded SERDES, 1.2 V core, 256-pin CABGA - different architecture (ECP5), lower static power, no DCM but PLL-based clocking | Better suited for low-power portable designs and high-speed serial interfaces; lacks native 18×18 multipliers | Prefer for new designs requiring SERDES or sub-1W operation; not pin-compatible with XC3S100E-4TQG144I |
Compared with XC3S100E-4TQG144I, the XC3S200E-4TQG144I offers scalable logic density within identical mechanical and I/O constraints, while the LFE5U-25F-6BG256C shifts focus to serial connectivity and power efficiency at the cost of multiplier-rich arithmetic capability and DCM-based clock control.
Availability
XC3S100E-4TQG144I is available at Aetrix Electronics and suitable for industrial control, video interface bridging, and motor control applications requiring stable component supply and long-term manufacturing continuity.
Supply support for XC3S100E-4TQG144I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and related software tools.
The Spartan-3E family was designed for cost-sensitive, high-volume applications requiring reconfigurable logic with integrated clock management and mixed-voltage I/O - targeting industrial, consumer, and communications endpoints.
FAQ
What is the maximum operating frequency supported by the XC3S100E-4TQG144I?
The XC3S100E-4TQG144I has a -4 speed grade specifying a 1.13 ns CLB propagation delay, enabling reliable operation up to 100 MHz in typical system clock domains. Actual achievable frequency depends on design routing, DCM usage, and I/O timing constraints - verified timing reports must be generated using Xilinx ISE 14.7 for final implementation.
Does the XC3S100E-4TQG144I support JTAG boundary-scan testing?
Yes, the XC3S100E-4TQG144I fully complies with IEEE 1149.1 boundary-scan standards. Its TCK, TMS, TDI, and TDO pins enable in-circuit testing, programming, and debugging without requiring additional test access hardware - a key feature confirmed in the Xilinx DS312 datasheet for Spartan-3E devices.
Can the XC3S100E-4TQG144I operate with multiple I/O voltage standards simultaneously?
Yes, the XC3S100E-4TQG144I supports concurrent use of LVCMOS 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V I/O standards across its 12 independent I/O banks. This capability is enabled by SelectIO technology and requires separate VCCO supplies per bank - detailed in the Spartan-3E Hardware User Guide (UG331).
How many Digital Clock Managers (DCMs) does the XC3S100E-4TQG144I include?
The XC3S100E-4TQG144I integrates two Digital Clock Managers (DCMs). Each DCM provides clock doubling, halving, phase shifting, and duty cycle correction - essential for synchronizing disparate clock domains in video, motor control, and communication subsystems implemented on the XC3S100E-4TQG144I.
Is the XC3S100E-4TQG144I RoHS-compliant and lead-free?
Yes, the XC3S100E-4TQG144I is manufactured in a lead-free, RoHS-compliant process. The "G" in TQG144 denotes green packaging, and the device meets JEDEC J-STD-020 moisture sensitivity level 3 requirements - confirmed in the Xilinx Spartan-3E Packaging Specification (DS313).
XC3S100E-4TQG144I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 144-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 240
- Number of Logic Elements/Cells:
- 2160
- Total RAM Bits:
- 73728
- Number of I/O:
- 108
- Number of Gates:
- 100000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 144-TQFP (20x20)
XC3S100E-4TQG144I FAQ
1.How can I place an order for XC3S100E-4TQG144I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S100E-4TQG144I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S100E-4TQG144I reliable?
The price and inventory of XC3S100E-4TQG144I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S100E-4TQG144I is usually 5 days.
3.What payment methods are accepted for XC3S100E-4TQG144I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S100E-4TQG144I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S100E-4TQG144I?
XC3S100E-4TQG144I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S100E-4TQG144I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S100E-4TQG144I?
For technical support, including XC3S100E-4TQG144I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S100E-4TQG144I requirements.
6.How does Aetrix verify that XC3S100E-4TQG144I is sourced from the original manufacturer or authorized distributors?
All XC3S100E-4TQG144I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S100E-4TQG144I meets industry standards.
7.What is the process for return or replacement of XC3S100E-4TQG144I?
All XC3S100E-4TQG144I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S100E-4TQG144I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S100E-4TQG144I part is unused and in its original packaging.
Return procedure for XC3S100E-4TQG144I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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