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AMD XC3S100E-5TQ144C
- Part No.:
- XC3S100E-5TQ144C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 144-LQFP
- Datasheet:
-
XC3S100E-5TQ144C.pdf
- Description:
- IC FPGA 108 I/O 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,171
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Product details
Overview
XC3S100E-5TQ144C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 100K system gates, 1728 logic cells, 24 I/O banks, 221 user I/Os, and 3.3V LVTTL/LVCMOS compatible interface. It targets low-cost embedded control and industrial interface bridging applications.
For engineers reviewing the XC3S100E-5TQ144C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, logic cell density, configuration mode support (Master Serial, Slave Parallel), and TQFP-144 package thermal profile for board-level integration.
Technical Context
The XC3S100E-5TQ144C implements a fully SRAM-based configurable logic architecture with distributed RAM, block RAM (176 Kbits), and dedicated digital clock managers (DCMs) supporting frequency synthesis, phase shifting, and duty cycle correction. It supports JTAG boundary-scan and IEEE 1149.1 compliance for test and debug.
Configuration is performed via external PROM, serial mode using XCFxxP platform flash, or through microprocessor parallel interface. The device operates at -5 speed grade (5 ns CLB delay) and supports single-ended I/O standards including LVCMOS25, LVCMOS33, LVTTL, PCI, and HSTL Class I.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1728 - provides baseline programmable logic capacity for glue logic replacement and small-state-machine implementation |
| System Gates | 100,000 - indicates approximate ASIC gate-equivalent density for architectural sizing |
| User I/Os | 221 - supports high-pin-count peripheral interfacing with bank-wise voltage assignment |
| Block RAM | 176 Kbits - enables on-chip data buffering, FIFOs, and small lookup tables without external memory |
| DCMs | 2 - delivers jitter-tolerant clock synthesis and phase alignment for synchronous design timing closure |
| Speed Grade | -5 - specifies 5 ns CLB propagation delay, defining maximum operating frequency for combinational paths |
| I/O Standards | LVTTL/LVCMOS33/LVCMOS25/PCI/HSTL Class I - allows direct connection to common microcontrollers and legacy peripherals |
Pinout & Package
TQFP-144 (Thin Quad Flat Package, 20 mm × 20 mm, 0.5 mm pitch) with exposed thermal pad. Pinout conforms to Xilinx DS312 v2.5 (2008) for Spartan-3E family.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCK0–GCK3 | Global Clock Input | Dedicated low-skew routing to all CLBs and DCMs; required for synchronous timing domains |
| PROGRAM_B | Configuration Initiate | Active-low asynchronous reset that clears SRAM configuration and restarts boot sequence |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and internal initialization completion |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan | IEEE 1149.1-compliant test access port for programming, debugging, and interconnect verification |
| VCCO_0–VCCO_5 | I/O Bank Supply | Independent 3.3V/2.5V/1.8V supplies per bank enable mixed-voltage interface operation |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Voltage I/O Banks | Supports simultaneous 3.3V, 2.5V, and 1.8V interfaces on same device - eliminates level-shifter ICs in mixed-peripheral systems |
| Digital Clock Managers (DCMs) | Two fully digital PLL-like circuits enabling precise clock multiplication, division, and phase alignment without external components |
| Embedded Block RAM | 176 Kbits of dual-port RAM blocks - usable as true dual-clock FIFOs or register files in data acquisition pipelines |
| Configurable Logic Blocks (CLBs) | 1728 CLBs each containing two 4-input LUTs and flip-flops - balances density and routability for deterministic timing closure |
| Master Serial Configuration | Supports single-PROM boot from XCF01S/XCF02S/XCF04S - simplifies production programming and field updates |
Applications
| Industrial PLC I/O Expansion | Legacy Bus Interface Bridge |
|---|---|
Use Scenario: Adding isolated digital input/output capability to compact programmable logic controllers using RS-485 or CAN physical layers. IC Role / Device Role / Timing Role: FPGA acts as protocol-agnostic I/O mapper and real-time signal conditioner between microcontroller and field-side terminals. Use Value: XC3S100E-5TQ144C provides 221 user I/Os and multi-voltage banks to directly interface 24V sensors, relay drivers, and isolated transceivers without external level shifters. | Use Scenario: Bridging ISA or PC/104 bus peripherals to modern ARM-based host controllers in test equipment and medical devices. IC Role / Device Role / Timing Role: FPGA implements custom address decode, wait-state generation, and burst-mode handshaking logic. Use Value: XC3S100E-5TQ144C's -5 speed grade and 1728 logic cells support sub-33 MHz ISA timing while fitting within tight PCB area constraints of legacy form factors. |
| Automotive Diagnostic Tool Interface | Low-Cost Video Signal Formatter |
Use Scenario: Enabling ISO 9141-2 and SAE J2284 (CAN) diagnostics in handheld OBD-II scanners via microcontroller co-processing. IC Role / Device Role / Timing Role: FPGA handles physical-layer arbitration, message filtering, and protocol state machine execution independent of host CPU load. Use Value: XC3S100E-5TQ144C's 2 DCMs allow synchronous sampling of K-line signals and precise bit-timing for CAN FD pre-echo suppression. | Use Scenario: Converting parallel RGB video from image sensors into BT.656-compliant YUV streams for SoC video processors in surveillance cameras. IC Role / Device Role / Timing Role: FPGA performs pixel clock domain crossing, chroma subsampling, and sync pulse insertion with deterministic latency. Use Value: XC3S100E-5TQ144C's block RAM enables line buffers for horizontal scaling and real-time color space conversion without frame memory. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S200-5TQ144C | 200K gates, 2848 logic cells, 256 Kbits block RAM - higher density and memory but same package and pinout | Supports larger state machines and deeper FIFOs; suitable when XC3S100E-5TQ144C resource utilization exceeds 85% | Select when additional logic or RAM is needed without changing PCB layout |
| LFE5U-25F-6BG256C | 25K LUTs, embedded SERDES, 1.2V core, non-volatile configuration - different architecture, voltage, and footprint | Enables low-power always-on functions and faster boot; requires new schematic and layout | Choose for new designs prioritizing power efficiency and instant-on capability over legacy compatibility |
Compared with XC3S100E-5TQ144C, XC3S200-5TQ144C offers drop-in scalability within identical thermal and mechanical constraints, while LFE5U-25F-6BG256C shifts to flash-based architecture with SERDES and lower static power - requiring full redesign but enabling next-generation feature sets.
Availability
XC3S100E-5TQ144C is available at Aetrix Electronics and suitable for industrial automation, automotive diagnostics, and legacy interface bridging requiring stable component supply across extended product lifecycles.
Supply support for XC3S100E-5TQ144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-3E product line for long-term industrial support. Xilinx pioneered SRAM-based FPGAs for cost-sensitive embedded applications.
The Spartan-3E family was designed specifically for high-volume, price-sensitive applications requiring reliable I/O expansion, protocol bridging, and real-time logic offload - not general-purpose computing.
FAQ
What configuration modes does the XC3S100E-5TQ144C support?
The XC3S100E-5TQ144C supports Master Serial (via external PROM), Slave Parallel (microprocessor-controlled), and JTAG boundary-scan configuration. It does not support Slave SelectMAP or BPI modes. Configuration bitstream is loaded into volatile SRAM, requiring reprogramming at power-up unless paired with non-volatile storage.
Does the XC3S100E-5TQ144C include on-chip oscillator or PLL resources?
The XC3S100E-5TQ144C includes two Digital Clock Managers (DCMs), which provide digital clock synthesis, phase shifting, and duty cycle correction - but no analog PLL or internal RC oscillator. External crystal or clock source is required for DCM operation.
What is the maximum operating temperature range for the XC3S100E-5TQ144C?
The XC3S100E-5TQ144C is rated for commercial temperature range (0°C to +70°C). It is not qualified for industrial (-40°C to +85°C) or extended temperature operation. Thermal derating applies above 60°C ambient in high-density PCB layouts.
Can the XC3S100E-5TQ144C drive 5V-tolerant I/Os directly?
No. The XC3S100E-5TQ144C I/Os are not 5V-tolerant. They support only 3.3V, 2.5V, and 1.8V signaling standards. Direct connection to 5V logic requires external level-shifting circuitry or bus switches.
Is the XC3S100E-5TQ144C RoHS compliant and lead-free?
Yes. The XC3S100E-5TQ144C is RoHS compliant and manufactured with lead-free (Pb-free) packaging per Xilinx DS312 specification. The TQFP-144 package uses matte tin finish and meets JEDEC J-STD-020 moisture sensitivity level 3.
XC3S100E-5TQ144C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 144-LQFP
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 240
- Number of Logic Elements/Cells:
- 2160
- Total RAM Bits:
- 73728
- Number of I/O:
- 108
- Number of Gates:
- 100000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 144-TQFP (20x20)
XC3S100E-5TQ144C FAQ
1.How can I place an order for XC3S100E-5TQ144C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S100E-5TQ144C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S100E-5TQ144C reliable?
The price and inventory of XC3S100E-5TQ144C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S100E-5TQ144C is usually 5 days.
3.What payment methods are accepted for XC3S100E-5TQ144C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S100E-5TQ144C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S100E-5TQ144C?
XC3S100E-5TQ144C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S100E-5TQ144C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S100E-5TQ144C?
For technical support, including XC3S100E-5TQ144C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S100E-5TQ144C requirements.
6.How does Aetrix verify that XC3S100E-5TQ144C is sourced from the original manufacturer or authorized distributors?
All XC3S100E-5TQ144C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S100E-5TQ144C meets industry standards.
7.What is the process for return or replacement of XC3S100E-5TQ144C?
All XC3S100E-5TQ144C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S100E-5TQ144C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S100E-5TQ144C part is unused and in its original packaging.
Return procedure for XC3S100E-5TQ144C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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