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AMD XC3S100E-5TQG144C
- Part No.:
- XC3S100E-5TQG144C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 144-LQFP
- Datasheet:
-
XC3S100E-5TQG144C.pdf
- Description:
- IC FPGA 108 I/O 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,572
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Product details
Overview
XC3S100E-5TQG144C from AMD (formerly Xilinx) is a Spartan-3E FPGA featuring 100,000 system gates, 2,192 logic cells, 24 I/O banks, and embedded block RAM totaling 294,912 bits. It operates at 500 MHz maximum internal clock frequency and supports LVCMOS25/LVCMOS33 I/O standards. It is used in industrial control logic, digital video interface bridging, and low-cost reconfigurable embedded systems.
For engineers reviewing the XC3S100E-5TQG144C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage compatibility, available block RAM depth for buffering, logic cell count for state machine complexity, and TQFP-144 thermal profile for convection-cooled PCB layouts.
Technical Context
The XC3S100E-5TQG144C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated carry logic. It includes eight global clock networks and supports SelectIO technology for single-ended and differential signaling including LVDS and RSDS.
This device uses a 90 nm CMOS process, requires a 1.2 V core supply and dual I/O supply options (2.5 V or 3.3 V), and supports JTAG boundary-scan testing per IEEE 1149.1. Configuration is performed via serial PROM or master/slave parallel mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 2,192 - determines maximum combinational/sequential logic capacity for state machines or datapaths |
| System Gates | 100,000 - industry-standard metric for relative logic density vs. ASIC equivalents |
| Block RAM | 294,912 bits - supports dual-port FIFOs, coefficient storage, or frame buffers up to 128 × 2,048 |
| I/O Pins | 119 user I/O - usable pins after configuration and power/ground allocation in TQFP-144 package |
| Max Clock Freq | 500 MHz - achievable internal routing-limited toggle rate for synchronous logic paths |
| Core Voltage | 1.2 V ±3% - strict regulation required to maintain timing closure and avoid soft errors |
Pinout & Package
TQFP-144 (Thin Quad Flat Package, 20 mm × 20 mm, 0.5 mm pitch) with exposed thermal pad. Pin 1 marked by corner notch; pins arranged in four 36-pin sides.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled locally for signal integrity |
| P2 | IO_L0N_0 | Differential pair negative input - used with P1 for LVDS receive termination |
| R13 | CCLK | Configuration clock output - drives external PROM during slave serial mode |
| T14 | DONE | Open-drain status indicator - pulled high when configuration completes successfully |
| U13 | INIT_B | Active-low initialization flag - asserts low if CRC error or bitstream mismatch detected |
| V12 | VCCAUX | 1.2 V auxiliary supply - powers configuration logic and JTAG circuitry |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Multipliers | 4 × 18-bit × 18-bit - enables real-time FIR filtering without consuming logic cells |
| SelectIO Technology | Supports LVCMOS25/LVCMOS33/LVDS/RSDS - eliminates level-shifter ICs in mixed-voltage systems |
| Embedded Block RAM | 294,912 bits across 32 blocks - allows independent read/write clocks for ping-pong buffering |
| JTAG Boundary Scan | IEEE 1149.1 compliant - enables in-circuit testability without physical probe access |
| Configurable I/O Standards | Per-bank voltage selection - permits interfacing with 2.5 V and 3.3 V peripherals on same device |
Applications
| Industrial PLC Logic | Digital Video Interface Bridge |
|---|---|
Use Scenario: Replacing fixed-function ASICs in programmable logic controllers for motion sequencing and sensor fusion. IC Role / Device Role / Timing Role: Configurable state machine and I/O mapper handling 24 discrete inputs and 16 outputs with deterministic scan cycle timing. Use Value: Enables field-upgradable control algorithms without hardware redesign or firmware flash limitations. | Use Scenario: Converting HDMI source data to LVDS for embedded display panels in kiosks and HMIs. IC Role / Device Role / Timing Role: Pixel clock domain crossing, color space conversion, and parallel-to-serial serialization using embedded multipliers and block RAM. Use Value: Reduces BOM count by integrating serializer, buffer, and timing adjustment logic into one device. |
| Low-Cost Test Equipment | Reconfigurable Sensor Hub |
Use Scenario: Generating precise stimulus waveforms and capturing response signals in handheld DMMs and signal analyzers. IC Role / Device Role / Timing Role: Dual-role waveform generator and digitizer controller synchronized to a common 500 MHz clock domain. Use Value: Achieves sub-10 ns timing resolution using carry chain propagation and deterministic routing delays. | Use Scenario: Aggregating and preprocessing data from multiple I²C/SPI sensors in edge IoT nodes before wireless transmission. IC Role / Device Role / Timing Role: Protocol translator and time-stamped FIFO buffer managing bursty sensor reads with variable latency. Use Value: Offloads host MCU from real-time interrupt handling while maintaining timestamp accuracy within ±1 µs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S200E-5TQG144C | 2x logic cells (4,384), 2x block RAM (589,824 bits), same package and I/O structure | Supports larger state machines and deeper buffers; higher static power draw (≈15% increase) | Choose when design exceeds XC3S100E-5TQG144C resource utilization by >85% |
| LFE5U-12F-8MG285I | ECP5 family, 12K LUTs, 1.2 V core, 285-pin CABGA, no native LVDS but supports it via I/O calibration | Higher performance per watt, integrated SERDES, but requires PCB redesign due to different package and power delivery | Choose for new designs needing PCIe Gen1 or higher bandwidth interfaces |
Compared with XC3S100E-5TQG144C, the XC3S200E-5TQG144C offers scalable resources without layout change, while the LFE5U-12F-8MG285I delivers modern transceiver capability at the cost of migration effort and revised thermal management.
Availability
XC3S100E-5TQG144C is available at Aetrix Electronics and suitable for industrial automation, digital video interface design, and low-cost test equipment requiring stable component supply over extended production lifecycles.
Supply support for XC3S100E-5TQG144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-3E product line for legacy industrial and aerospace applications.
The Spartan-3E family was designed for cost-sensitive, high-volume embedded logic replacement where reprogrammability, moderate gate count, and I/O flexibility outweigh advanced features like DSP slices or transceivers.
FAQ
What is the configuration method supported by XC3S100E-5TQG144C?
The XC3S100E-5TQG144C supports master serial, slave serial, and slave parallel configuration modes. It uses external SPI PROM or microcontroller-driven parallel bus for bitstream loading. JTAG is available for programming and debugging but not for standard configuration boot.
Does XC3S100E-5TQG144C support differential I/O standards?
Yes, XC3S100E-5TQG144C supports LVDS and RSDS differential signaling through its SelectIO technology. Each differential pair requires adjacent pins within the same I/O bank and matching termination resistors placed externally per Xilinx UG331 guidelines.
What is the operating temperature range for XC3S100E-5TQG144C?
The XC3S100E-5TQG144C is rated for commercial temperature range (0 °C to +70 °C). It is not qualified for industrial (–40 °C to +85 °C) or extended temperature operation, and derating is required above 60 °C ambient.
Can XC3S100E-5TQG144C be used with 1.8 V I/O interfaces?
No, XC3S100E-5TQG144C does not support 1.8 V I/O standards. Its I/O banks accept only 2.5 V or 3.3 V VCCO supplies and are compatible with LVCMOS25, LVCMOS33, LVDS, and RSDS - not LVCMOS18 or SSTL.
How many global clock lines does XC3S100E-5TQG144C provide?
The XC3S100E-5TQG144C provides eight dedicated global clock networks driven by BUFG multiplexers. These routes distribute low-skew clocks to all logic regions and support simultaneous use of multiple clock domains with phase alignment.
XC3S100E-5TQG144C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 144-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 240
- Number of Logic Elements/Cells:
- 2160
- Total RAM Bits:
- 73728
- Number of I/O:
- 108
- Number of Gates:
- 100000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 144-TQFP (20x20)
XC3S100E-5TQG144C FAQ
1.How can I place an order for XC3S100E-5TQG144C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S100E-5TQG144C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S100E-5TQG144C reliable?
The price and inventory of XC3S100E-5TQG144C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S100E-5TQG144C is usually 5 days.
3.What payment methods are accepted for XC3S100E-5TQG144C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S100E-5TQG144C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S100E-5TQG144C?
XC3S100E-5TQG144C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S100E-5TQG144C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S100E-5TQG144C?
For technical support, including XC3S100E-5TQG144C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S100E-5TQG144C requirements.
6.How does Aetrix verify that XC3S100E-5TQG144C is sourced from the original manufacturer or authorized distributors?
All XC3S100E-5TQG144C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S100E-5TQG144C meets industry standards.
7.What is the process for return or replacement of XC3S100E-5TQG144C?
All XC3S100E-5TQG144C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S100E-5TQG144C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S100E-5TQG144C part is unused and in its original packaging.
Return procedure for XC3S100E-5TQG144C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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