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AMD XC3S1200E-4FG320C
- Part No.:
- XC3S1200E-4FG320C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 320-BGA
- Datasheet:
-
XC3S1200E-4FG320C.pdf
- Description:
- IC FPGA 250 I/O 320FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,019
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Product details
Overview
XC3S1200E-4FG320C from AMD (formerly Xilinx) is a Spartan-3E FPGA featuring 1,152 logic cells, 228 I/O pins, and a 4 ns input-to-output delay in the FG320 fine-pitch BGA package. It integrates 520 Kbits of block RAM, supports LVCMOS/LVTTL I/O standards, and targets low-cost embedded control and industrial interface applications.
For engineers reviewing the XC3S1200E-4FG320C datasheet, pinout, applications, or equivalent options, key selection considerations include logic density, I/O count, timing grade (-4), and thermal performance in the 320-pin FBGA package.
Technical Context
The XC3S1200E-4FG320C implements a fully configurable logic architecture with dedicated carry chains for arithmetic and distributed RAM for fast lookup tables. Its configuration memory is loaded via JTAG or master serial mode using external PROM.
It supports SelectIO™ technology with programmable slew rate and drive strength per bank, and includes Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty cycle correction across up to eight independent clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,152 - provides combinational and sequential logic capacity for medium-complexity control state machines and data path logic. |
| I/O Pins | 228 - supports high-pin-count peripheral interfacing with bank-wise voltage and standard assignment. |
| Block RAM | 520 Kbits - enables on-chip buffering, FIFOs, and small lookup tables without external memory. |
| DCM Units | 4 - delivers jitter-reduced clock outputs, frequency multiplication/division, and phase alignment for synchronous design. |
| Timing Grade | -4 - guarantees maximum 4 ns input-to-output propagation delay under specified voltage and temperature conditions. |
| Package | FG320 - 320-ball fine-pitch BGA with 0.8 mm pitch, optimized for thermal dissipation and board-level signal integrity. |
Pinout & Package
XC3S1200E-4FG320C is housed in a 320-ball fine-pitch BGA (FG320) package with 228 user I/Os distributed across 10 I/O banks. Power and ground balls are arranged per Xilinx Spartan-3E packaging conventions to support stable core and I/O supply decoupling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled locally to maintain signal integrity for LVCMOS33/LVCMOS25 interfaces. |
| K1 | GND | Ground reference for adjacent I/O and core logic - critical for noise suppression in mixed-signal routing. |
| T1 | PROGRAM_B | Active-low configuration initiation - pulled low to reset and reload bitstream from external PROM or JTAG. |
| R2 | DONE | Open-drain status output - goes high when configuration completes successfully and I/Os become active. |
| P3 | CCLK | Configuration clock input - drives internal shift register during master serial PROM loading. |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated carry logic | Enables high-speed arithmetic (e.g., counters, adders) without LUT resource consumption. |
| Four Digital Clock Managers (DCMs) | Supports multi-clock domain designs with precise phase alignment and jitter reduction. |
| SelectIO™ technology | Allows per-bank I/O standard selection (LVCMOS, LVTTL, PCI) and programmable drive/slew control. |
| Embedded block RAM | Provides 520 Kbits of true dual-port RAM for buffering and data storage without external chips. |
Applications
| Industrial PLC I/O Module | Automated Test Equipment (ATE) Control |
|---|---|
Use Scenario: Real-time digital I/O expansion with deterministic response for sensor/actuator interfacing in factory automation cabinets. IC Role / Device Role / Timing Role: Configurable logic fabric handles parallel I/O scanning, edge detection, and protocol translation (e.g., Modbus RTU framing). Use Value: 228 I/O pins and -4 timing grade enable sub-microsecond loop response without external glue logic. | Use Scenario: Pattern generation and response capture in semiconductor functional test systems requiring synchronized stimulus and sampling. IC Role / Device Role / Timing Role: FPGA implements high-speed digital pattern sequencer and time-aligned comparator logic driven by DCM-synchronized clocks. Use Value: Four DCM units allow independent clock domains for stimulus, capture, and system control-reducing timing skew across test vectors. |
| Medical Imaging Interface Board | Avionics Data Concentrator |
Use Scenario: Interfacing CCD/CMOS image sensors and ADCs to ARM-based processing subsystems in portable ultrasound devices. IC Role / Device Role / Timing Role: Bridges parallel sensor data bus to AXI or APB interface while performing pixel clock domain crossing and line buffering. Use Value: Embedded 520 Kbits block RAM serves as line buffer for real-time image preprocessing without DRAM latency. | Use Scenario: Aggregating ARINC 429, discrete I/O, and MIL-STD-1553B signals into a unified Ethernet backbone in flight control computers. IC Role / Device Role / Timing Role: Implements protocol-specific transceivers, message filtering, and time-stamped packet assembly in hardened logic fabric. Use Value: Per-bank SelectIO™ allows simultaneous LVDS (ARINC), 5V-tolerant (discrete), and differential (1553B) signaling on shared PCB layers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FG320C | 1,000 logic cells, no DCM in base variant; requires -4FG320C speed grade for same timing. | Lacks integrated DCMs - external clock IC needed for phase alignment or frequency synthesis. | Choose if logic density suffices and clock management is handled externally. |
| XC3S1400A-4FG320C | 1,400 logic cells, enhanced DCM features, higher block RAM (702 Kbits), same package and pinout. | Higher resource count supports larger state machines and deeper buffers but increases static power. | Choose when additional logic or RAM is required without changing PCB layout. |
Compared with XC3S1200E-4FG320C, XC3S1000-4FG320C reduces logic and clock resources for cost-sensitive designs, while XC3S1400A-4FG320C extends capability within identical footprint and thermal envelope.
Availability
XC3S1200E-4FG320C is available at Aetrix Electronics and suitable for industrial control, medical imaging interface, and avionics data concentrator applications requiring stable component supply and long-term obsolescence planning.
Supply support for XC3S1200E-4FG320C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family for cost-sensitive, high-volume embedded applications.
The Spartan-3E product line was designed for low-power, high-I/O-count logic implementation in industrial, automotive, and communications equipment where ASIC NRE cost is prohibitive.
FAQ
What is the maximum operating frequency supported by XC3S1200E-4FG320C?
The XC3S1200E-4FG320C supports a maximum system clock frequency of 325 MHz when using its Digital Clock Managers (DCMs) under typical conditions. This value assumes proper PCB layout, adequate decoupling, and operation within the -4 speed grade's specified voltage (1.2 V core) and temperature range (0°C to 85°C). Actual achievable frequency depends on design complexity and routing congestion.
Does XC3S1200E-4FG320C support JTAG boundary-scan testing?
Yes, XC3S1200E-4FG320C includes IEEE 1149.1-compliant JTAG TAP controller for boundary-scan testing, programming, and debugging. The TDI, TDO, TCK, and TMS pins are assigned to dedicated package balls and support full device configuration and verification without requiring external programming hardware beyond standard JTAG adapters.
Can XC3S1200E-4FG320C operate with mixed I/O voltage standards on different banks?
Yes, XC3S1200E-4FG320C supports mixed I/O standards across its 10 I/O banks. Each bank can be independently configured for LVCMOS33, LVCMOS25, LVTTL, or PCI, provided the corresponding VCCO voltage matches the selected standard. Bank 0–9 require separate VCCO supplies, enabling heterogeneous interface integration on a single device.
What configuration modes does XC3S1200E-4FG320C support?
XC3S1200E-4FG320C supports Master Serial, Slave Serial, JTAG, and Boundary Scan configuration modes. Master Serial uses an external PROM and CCLK to auto-load bitstream at power-up. JTAG mode enables in-system programming and debug. Configuration mode is selected via MODE pins (M2:M0) tied to specific voltage levels during power-on reset.
Is XC3S1200E-4FG320C RoHS compliant and lead-free?
Yes, XC3S1200E-4FG320C is RoHS compliant and manufactured with lead-free (Pb-free) packaging. The FG320 package uses matte tin surface finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. Full compliance documentation is available in AMD's official product change notices.
XC3S1200E-4FG320C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 320-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2168
- Number of Logic Elements/Cells:
- 19512
- Total RAM Bits:
- 516096
- Number of I/O:
- 250
- Number of Gates:
- 1200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 320-FBGA (19x19)
XC3S1200E-4FG320C FAQ
1.How can I place an order for XC3S1200E-4FG320C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1200E-4FG320C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1200E-4FG320C reliable?
The price and inventory of XC3S1200E-4FG320C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1200E-4FG320C is usually 5 days.
3.What payment methods are accepted for XC3S1200E-4FG320C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1200E-4FG320C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1200E-4FG320C?
XC3S1200E-4FG320C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1200E-4FG320C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1200E-4FG320C?
For technical support, including XC3S1200E-4FG320C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1200E-4FG320C requirements.
6.How does Aetrix verify that XC3S1200E-4FG320C is sourced from the original manufacturer or authorized distributors?
All XC3S1200E-4FG320C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1200E-4FG320C meets industry standards.
7.What is the process for return or replacement of XC3S1200E-4FG320C?
All XC3S1200E-4FG320C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1200E-4FG320C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1200E-4FG320C part is unused and in its original packaging.
Return procedure for XC3S1200E-4FG320C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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