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AMD XC3S1200E-4FG400C
- Part No.:
- XC3S1200E-4FG400C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 400-BGA
- Datasheet:
-
XC3S1200E-4FG400C.pdf
- Description:
- IC FPGA 304 I/O 400FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,449
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Product details
Overview
XC3S1200E-4FG400C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 1,195,200 system gates, 128 I/O pins, and configured in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (4.8 ns CLB delay), supports 3.3V/2.5V/1.2V mixed-voltage I/O, and targets cost-sensitive embedded control and industrial interface applications.
For engineers reviewing the XC3S1200E-4FG400C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage flexibility, CLB count, distributed RAM capacity, global clock routing resources, and JTAG boundary-scan compliance for production testability.
Technical Context
The XC3S1200E-4FG400C implements a hierarchical logic fabric composed of 12,144 configurable logic blocks (CLBs), each containing two slices with four 6-input LUTs and eight flip-flops. It integrates 360 kb of total block RAM, 22 dedicated multipliers, and eight digital clock managers (DCMs) supporting phase shifting, frequency synthesis, and duty-cycle correction.
Configuration occurs via master serial mode using an external PROM or through JTAG boundary-scan IEEE 1149.1 interface. The device supports SelectIO standards including LVCMOS, LVTTL, PCI, and SSTL, with programmable drive strength and slew rate per bank.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 1,195,200 system gates - defines maximum combinational logic density for gate-equivalent designs |
| Configurable Logic Blocks | 12,144 CLBs - provides parallel execution units for synchronous logic and state machines |
| Block RAM | 360 kb total - enables on-chip FIFOs, buffers, and small lookup tables without external memory |
| I/O Pins | 128 user I/O - supports multi-bank voltage assignment and per-pin standard selection |
| Speed Grade | -4 (4.8 ns CLB delay) - guarantees timing closure for designs operating up to 210 MHz in critical paths |
| Digital Clock Managers | 8 DCMs - deliver jitter-reduced clocks, dynamic phase alignment, and frequency multiplication/division |
Pinout & Package
XC3S1200E-4FG400C is housed in a 400-ball fine-pitch BGA (FBGA) package with 20×20 ball array, 0.8 mm pitch, and 27 mm × 27 mm body size. Thermal pad is exposed on underside for enhanced heat dissipation in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2V core supply input - must be filtered and decoupled within 1 cm of ball |
| P2 | VCCAUX | 2.5V auxiliary supply for configuration and DCM circuits |
| A19 | VCCO_0 | 3.3V I/O bank 0 supply - sets voltage level for all pins in Bank 0 |
| T14 | TCK | JTAG test clock input - drives synchronous boundary-scan state machine |
| R15 | TMS | JTAG test mode select - controls TAP controller state transitions |
| P15 | TDO | JTAG test data output - serially shifts out boundary-scan register contents |
| P16 | TDI | JTAG test data input - serially loads boundary-scan register |
| U18 | PROGRAM_B | Active-low configuration reset - forces reinitialization from PROM or JTAG |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Voltage I/O Banks | Four independent I/O banks support simultaneous 3.3V, 2.5V, and 1.2V signaling - eliminates level-shifter ICs in mixed-voltage systems |
| Dedicated Multipliers | 22 18×18-bit hard multipliers - accelerate DSP functions like FIR filtering and motor control without consuming CLB resources |
| Embedded Block RAM | 360 kb distributed across 48 BRAM blocks - enables dual-port memory access for video frame buffering and protocol translation |
| Digital Clock Manager (DCM) | Eight fully independent DCMs - provide deterministic clock deskew and jitter reduction for high-speed serial interfaces |
| JTAG Boundary-Scan | IEEE 1149.1 compliant - enables in-circuit testing and programming without physical probe access |
Applications
| Industrial PLC I/O Module | Automated Test Equipment (ATE) Interface |
|---|---|
Use Scenario: Real-time digital I/O conditioning and protocol bridging between fieldbus (PROFIBUS, CANopen) and host controller. IC Role / Device Role / Timing Role: FPGA acts as programmable logic layer managing signal synchronization, bit-level protocol parsing, and isolation control. Use Value: 128 I/O pins and multi-voltage support allow direct connection to diverse sensor/actuator interfaces without external level shifters. | Use Scenario: High-speed pattern generation and response capture for semiconductor wafer probing. IC Role / Device Role / Timing Role: FPGA serves as timing engine and vector sequencer, generating precise stimulus waveforms and sampling responses with sub-ns alignment. Use Value: Eight DCMs enable independent, jitter-controlled clocks for parallel test channels and synchronized data capture. |
| Medical Imaging Data Preprocessor | Avionics Display Controller |
Use Scenario: On-board preprocessing of ultrasound echo data before transmission to main processor. IC Role / Device Role / Timing Role: FPGA performs real-time beamforming, envelope detection, and pixel mapping using distributed arithmetic and BRAM-based line buffers. Use Value: 360 kb block RAM allows storage of multiple scan-line buffers for pipelined processing without external DRAM latency. | Use Scenario: ARINC 661-compliant cockpit display rendering and touch-input arbitration in certified avionics systems. IC Role / Device Role / Timing Role: FPGA implements deterministic graphics pipeline, overlay composition, and safety-monitoring logic with dual-lockstep capability. Use Value: -4 speed grade ensures guaranteed timing closure for 60 Hz display refresh with <500 ns worst-case path delay. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FG456C | Lower logic capacity (1M gates), same -4 speed grade, 456-ball FBGA package | Fewer CLBs and BRAM limit complex protocol stacks or multi-channel processing | Select when design fits within 1M gate budget and requires larger package for thermal or routing margin |
| XC3S1600E-4FG484C | Higher logic capacity (1.6M gates), same architecture and speed grade, 484-ball FBGA | Additional CLBs and BRAM support expanded peripheral integration and larger state machines | Choose when migrating from XC3S1200E-4FG400C to accommodate feature growth without changing toolflow |
Compared with XC3S1000-4FG456C and XC3S1600E-4FG484C, the XC3S1200E-4FG400C delivers optimal balance of gate count, I/O count, and package size for mid-complexity industrial controllers where board space and BOM cost are constrained.
Availability
XC3S1200E-4FG400C is available at Aetrix Electronics and suitable for industrial automation, medical diagnostics equipment, and avionics subsystems requiring stable component supply over extended production lifecycles.
Supply support for XC3S1200E-4FG400C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops and supports the Spartan family of FPGAs for cost-optimized, high-volume embedded applications.
The Spartan-3E product line was designed specifically for non-volatile, low-power, and pin-efficient logic replacement in industrial control, test instrumentation, and communications infrastructure.
FAQ
What is the maximum operating frequency supported by the XC3S1200E-4FG400C?
The XC3S1200E-4FG400C has a -4 speed grade specifying a 4.8 ns CLB propagation delay, enabling reliable operation up to 210 MHz in critical timing paths. Actual achievable system frequency depends on design topology, placement, and routing; full timing analysis must be performed using Xilinx ISE software targeting the XC3S1200E-4FG400C device model.
Does the XC3S1200E-4FG400C support JTAG boundary-scan for production testing?
Yes, the XC3S1200E-4FG400C fully complies with IEEE 1149.1 JTAG boundary-scan standards. Its TCK, TMS, TDI, and TDO pins enable in-system programming, configuration verification, and interconnect testing without physical probe access-critical for high-reliability manufacturing of industrial PCBs using the XC3S1200E-4FG400C.
Can the XC3S1200E-4FG400C operate with mixed I/O voltages on different banks?
Yes, the XC3S1200E-4FG400C supports true multi-voltage operation: Bank 0 can be set to 3.3V, Bank 1 to 2.5V, and Banks 2–3 to 1.2V simultaneously. Each bank's VCCO must be supplied independently, and I/O standards (LVCMOS, LVTTL, etc.) are selected per bank-enabling direct interfacing with legacy and modern peripherals in the same XC3S1200E-4FG400C design.
How much embedded memory does the XC3S1200E-4FG400C provide?
The XC3S1200E-4FG400C integrates 360 kb of total block RAM, organized as 48 independent 72-bit wide × 1024 deep BRAM primitives. This memory supports dual-port read/write operations and is used for FIFOs, lookup tables, and frame buffers-eliminating need for external SRAM in many XC3S1200E-4FG400C-based systems.
Is the XC3S1200E-4FG400C still in active production and supported by AMD?
The XC3S1200E-4FG400C is in continued production under AMD's long-term support program for legacy Spartan families. AMD provides datasheets, ISE design tools, and technical documentation for the XC3S1200E-4FG400C, with lifecycle notifications issued per industry-standard obsolescence policies.
XC3S1200E-4FG400C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 400-BGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2168
- Number of Logic Elements/Cells:
- 19512
- Total RAM Bits:
- 516096
- Number of I/O:
- 304
- Number of Gates:
- 1200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 400-FBGA (21x21)
XC3S1200E-4FG400C FAQ
1.How can I place an order for XC3S1200E-4FG400C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1200E-4FG400C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1200E-4FG400C reliable?
The price and inventory of XC3S1200E-4FG400C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1200E-4FG400C is usually 5 days.
3.What payment methods are accepted for XC3S1200E-4FG400C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1200E-4FG400C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1200E-4FG400C?
XC3S1200E-4FG400C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1200E-4FG400C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1200E-4FG400C?
For technical support, including XC3S1200E-4FG400C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1200E-4FG400C requirements.
6.How does Aetrix verify that XC3S1200E-4FG400C is sourced from the original manufacturer or authorized distributors?
All XC3S1200E-4FG400C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1200E-4FG400C meets industry standards.
7.What is the process for return or replacement of XC3S1200E-4FG400C?
All XC3S1200E-4FG400C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1200E-4FG400C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1200E-4FG400C part is unused and in its original packaging.
Return procedure for XC3S1200E-4FG400C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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