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AMD XC3S1200E-4FG400I
- Part No.:
- XC3S1200E-4FG400I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 400-BGA
- Datasheet:
-
XC3S1200E-4FG400I.pdf
- Description:
- IC FPGA 304 I/O 400FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,708
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Product details
Overview
XC3S1200E-4FG400I from AMD (formerly Xilinx) is a Spartan-3E FPGA featuring 1,152 logic cells, 228 I/O pins, and a -4 speed grade in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package. It integrates up to 432 Kbits of block RAM, supports LVCMOS/LVTTL I/O standards, and targets low-cost embedded control and industrial interface applications.
For engineers reviewing the XC3S1200E-4FG400I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O count, speed grade timing closure, and FBGA thermal/mechanical compatibility with existing PCB layouts.
Technical Context
The XC3S1200E-4FG400I implements a configurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry logic for arithmetic functions. It includes twelve 18×18 multipliers and supports SelectIO™ technology for programmable I/O standards including LVCMOS, LVTTL, PCI, and SSTL.
Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan. The device lacks internal configuration memory and requires external bitstream loading at power-up, with no on-chip flash or volatile SRAM-based instant-on capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,152 - defines maximum combinational/sequential logic capacity for custom digital functions |
| I/O Pins | 228 - supports high-pin-count peripheral interfacing with banked voltage and standard flexibility |
| Block RAM | 432 Kbits - enables local data buffering, FIFOs, or small lookup tables without external memory |
| Speed Grade | -4 - guarantees maximum clock frequency of 325 MHz for CLB-to-CLB paths under worst-case conditions |
| Package | 400-pin FBGA (F400) - 27 × 27 mm body, 1.0 mm ball pitch, requires reflow-compatible PCB layout |
| Configuration Mode | Master Serial or JTAG - mandates external PROM or host controller for bitstream loading at startup |
Pinout & Package
XC3S1200E-4FG400I is housed in a 400-ball fine-pitch BGA (F400) package with 228 user I/Os distributed across eight I/O banks. Power and ground balls are arranged per Xilinx Spartan-3E packaging conventions, with dedicated configuration pins (INIT_B, PROGRAM_B, DONE) and JTAG test access ports.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PROGRAM_B | Active-Low Configuration Initiate | Asserting low resets configuration logic and clears internal state before new bitstream load |
| INIT_B | Active-Low Initialization Status | Open-drain output indicating configuration memory readiness; pulled high during valid bitstream load |
| DONE | Configuration Completion | Open-drain output signals successful bitstream validation and releases I/Os from high-impedance state |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | Enables IEEE 1149.1-compliant programming, debugging, and interconnect testing without dedicated configuration PROM |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Multipliers | Twelve 18×18-bit signed/unsigned multipliers enable real-time DSP tasks without LUT resource overhead |
| SelectIO™ Technology | Per-bank I/O voltage support (1.2 V to 3.3 V) allows mixed-voltage system interfacing with single device |
| DSP-Optimized Logic | Carry chain and fast arithmetic routing reduce propagation delay in counters, accumulators, and FIR filters |
| Low-Cost Targeting | Non-volatile configuration memory not integrated - reduces die cost but requires external PROM or microcontroller boot loader |
Applications
| Industrial PLC I/O Module | Automated Test Equipment (ATE) Pattern Generator |
|---|---|
Use Scenario: Real-time digital signal conditioning and protocol translation between field sensors and HMI controllers. IC Role / Device Role / Timing Role: Configurable logic engine implementing custom state machines, SPI/I2C masters, and parallel bus glue logic. Use Value: 228 I/O pins and banked voltage support allow direct connection to diverse sensor outputs and actuator drivers without level-shifter ICs. | Use Scenario: Generating synchronized digital stimulus waveforms for semiconductor device functional testing. IC Role / Device Role / Timing Role: High-speed pattern sequencer with deterministic timing control over 100+ digital channels. Use Value: -4 speed grade ensures sub-3 ns path delays for tight setup/hold timing margins in ATE backplane interfaces. |
| Medical Imaging Data Preprocessor | Avionics Display Interface Bridge |
Use Scenario: On-board pixel data formatting and compression preprocessing prior to transmission to host processor. IC Role / Device Role / Timing Role: Parallel-to-serial converter and lightweight image filter accelerator using block RAM and LUT-based logic. Use Value: 432 Kbits of block RAM provides sufficient buffer space for line-based image processing without external SDRAM latency penalties. | Use Scenario: Translating legacy ARINC 429 or discrete discrete signal formats to modern LVDS display driver interfaces. IC Role / Device Role / Timing Role: Protocol-aware bridge with glitch-free signal resynchronization and format conversion logic. Use Value: SelectIO™ per-bank voltage control enables simultaneous 5 V discrete input sampling and 1.8 V LVDS output driving on same device. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FG456C | Same architecture, 1,000 logic cells, 456-pin FBGA, commercial temperature grade | Larger package footprint and lower logic density; rated for 0°C to 85°C only | Choose when board layout accommodates larger F456 package and ambient operating temperature remains within commercial range |
| XC3S1600E-4FG484I | Higher-density variant: 1,584 logic cells, 484-pin FBGA, industrial temperature grade | Requires PCB redesign due to different ball count, pitch, and thermal pad layout | Choose when additional logic resources or I/Os are required and mechanical redesign is feasible |
Compared with XC3S1200E-4FG400I, the XC3S1000-4FG456C offers reduced logic capacity in a physically larger package, while the XC3S1600E-4FG484I delivers higher density at the cost of board-level compatibility - neither is pin-compatible, requiring schematic and layout revision for substitution.
Availability
XC3S1200E-4FG400I is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and avionics subsystems requiring stable component supply and long-term obsolescence management.
Supply support for XC3S1200E-4FG400I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops and supports the Spartan, Artix, Kintex, and Virtex FPGA families originally created by Xilinx.
The Spartan-3E family was designed for cost-sensitive, high-volume applications requiring moderate logic density, flexible I/O, and predictable timing - especially in industrial control and communications infrastructure.
FAQ
What is the maximum operating junction temperature for XC3S1200E-4FG400I?
The XC3S1200E-4FG400I is specified for industrial temperature range operation (–40°C to +100°C). Its maximum allowable junction temperature is 125°C under steady-state thermal conditions, consistent with Xilinx Spartan-3E thermal design guidelines and JEDEC JESD51-2 compliance.
Does XC3S1200E-4FG400I include embedded configuration memory?
No, XC3S1200E-4FG400I does not contain on-chip non-volatile configuration memory. It relies on external serial PROM or microcontroller-driven configuration via Master Serial or JTAG mode. This is a defining characteristic of the Spartan-3E family.
Can XC3S1200E-4FG400I operate with 1.2 V I/O voltage?
Yes, XC3S1200E-4FG400I supports 1.2 V I/O through its SelectIO™ technology - but only in I/O banks powered at 1.2 V and configured for LVCMOS12 or SSTL12 standards. Voltage must be applied per-bank; mixing standards within a bank is not permitted.
What configuration modes does XC3S1200E-4FG400I support?
XC3S1200E-4FG400I supports Master Serial (using external PROM), Slave Serial, JTAG, and Boundary Scan configuration modes. JTAG is used for programming, debugging, and interconnect testing; Master Serial is typical for production deployment.
Is XC3S1200E-4FG400I RoHS compliant?
Yes, XC3S1200E-4FG400I is RoHS-6 compliant (lead-free, halogen-free) and meets EU Directive 2011/65/EU requirements. The F400 package uses matte tin finish on solder balls and complies with IPC/JEDEC J-STD-020 moisture sensitivity level 3 (MSL3).
XC3S1200E-4FG400I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 400-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2168
- Number of Logic Elements/Cells:
- 19512
- Total RAM Bits:
- 516096
- Number of I/O:
- 304
- Number of Gates:
- 1200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 400-FBGA (21x21)
XC3S1200E-4FG400I FAQ
1.How can I place an order for XC3S1200E-4FG400I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1200E-4FG400I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1200E-4FG400I reliable?
The price and inventory of XC3S1200E-4FG400I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1200E-4FG400I is usually 5 days.
3.What payment methods are accepted for XC3S1200E-4FG400I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1200E-4FG400I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1200E-4FG400I?
XC3S1200E-4FG400I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1200E-4FG400I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1200E-4FG400I?
For technical support, including XC3S1200E-4FG400I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1200E-4FG400I requirements.
6.How does Aetrix verify that XC3S1200E-4FG400I is sourced from the original manufacturer or authorized distributors?
All XC3S1200E-4FG400I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1200E-4FG400I meets industry standards.
7.What is the process for return or replacement of XC3S1200E-4FG400I?
All XC3S1200E-4FG400I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1200E-4FG400I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1200E-4FG400I part is unused and in its original packaging.
Return procedure for XC3S1200E-4FG400I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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