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AMD XC3S1200E-4FGG320C
- Part No.:
- XC3S1200E-4FGG320C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 320-BGA
- Datasheet:
-
XC3S1200E-4FGG320C.pdf
- Description:
- IC FPGA 250 I/O 320FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,423
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Product details
Overview
XC3S1200E-4FGG320C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 1,195,000 system gates, 1200 logic cells, 228 I/O pins, and configured in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade and supports 1.2 V core voltage for embedded control and interface bridging in industrial automation systems.
For engineers reviewing the XC3S1200E-4FGG320C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, speed grade compatibility, core voltage tolerance, and FBGA thermal/mechanical footprint constraints.
Technical Context
The XC3S1200E-4FGG320C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, block RAM (288 Kbits), and dedicated multipliers (12 × 18-bit). It supports SelectIO standards including LVCMOS, LVTTL, PCI, and SSTL.
Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan. The device includes Digital Clock Managers (DCMs) supporting frequency synthesis, phase shifting, and duty-cycle correction across up to eight independent clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,200 - defines maximum combinational/sequential logic capacity for custom digital functions |
| System Gates | 1,195,000 - indicates total equivalent gate count for ASIC-style logic mapping |
| I/O Pins | 228 - usable user-defined bidirectional signal interfaces with banked voltage support |
| Block RAM | 288 Kbits - on-chip memory for FIFOs, buffers, or small lookup tables without external SRAM |
| DCMs | 2 - provides clock deskew, frequency multiplication/division, and phase alignment per domain |
| Core Voltage | 1.2 V ± 3% - requires tight-regulation power supply; impacts dynamic power and timing closure |
| Speed Grade | -4 - guarantees timing performance up to 333 MHz for critical paths under worst-case conditions |
Pinout & Package
XC3S1200E-4FGG320C is housed in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package with 22 × 22 array, 0.8 mm pitch, and 15 mm × 15 mm body size. Thermal pad is not present; standard reflow profile applies.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core power supply input for CLBs and DCMs; must be locally decoupled |
| P2 | VCCAUX | 2.5 V auxiliary supply for configuration circuitry and SelectIO banks |
| T14 | PROGRAM_B | Active-low asynchronous reset that clears configuration memory and initiates reload |
| R15 | INIT_B | Open-drain status output indicating configuration completion or error condition |
| V17 | DONE | Open-drain output confirming successful configuration and releasing I/O as user-controlled |
| Y16 | TCK | JTAG test clock input for boundary-scan and in-circuit programming |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated 12×18 multipliers | Enables real-time arithmetic for motor control algorithms without consuming logic resources |
| Eight global clock networks | Supports synchronous design across multiple functional blocks with low skew and jitter |
| SelectIO technology | Allows mixed-voltage I/O interfacing (1.2 V to 3.3 V) within same bank group |
| MultiBoot configuration | Permits field-upgradable firmware by selecting between two internal bitstreams via M[2:0] |
| IEEE 1149.1 JTAG | Enables production testing, debugging, and in-system programming without dedicated debug hardware |
Applications
| Industrial PLC I/O Expansion | Video Interface Bridge |
|---|---|
Use Scenario: Adding isolated analog/digital I/O modules to legacy programmable logic controllers. IC Role / Device Role / Timing Role: FPGA fabric implements protocol translation (Modbus RTU ↔ SPI), isolation control, and real-time sampling logic. Use Value: Replaces discrete glue logic and microcontroller-based bridges while maintaining deterministic <1 µs response latency. | Use Scenario: Converting parallel RGB video signals to LVDS or FPD-Link for display panels in medical imaging equipment. IC Role / Device Role / Timing Role: Timing-critical pixel data serialization, clock domain crossing, and ESD-robust I/O buffering. Use Value: Eliminates external serializer ICs and reduces BOM count by integrating 24-bit parallel-to-serial conversion with DCM-synchronized clocks. |
| Motor Control Encoder Interface | Communications Protocol Gateway |
Use Scenario: Interfacing quadrature encoders and Hall-effect sensors to servo drive microcontrollers. IC Role / Device Role / Timing Role: High-speed edge detection, index pulse filtering, and ABZ counter logic with zero CPU overhead. Use Value: Achieves 10 MHz quadrature input handling and 32-bit position accumulation without interrupt servicing. | Use Scenario: Translating CANopen messages to RS-485 Modbus commands in building automation gateways. IC Role / Device Role / Timing Role: Dual-protocol state machine with CRC generation, frame assembly, and baud-rate independent timing recovery. Use Value: Supports concurrent CAN FD (5 Mbps) and RS-485 (115.2 kbps) operation using dedicated I/O banks and internal dual-clock domains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic integration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FGG320C | 1,000 logic cells, 218 I/O, identical -4 speed grade and FBGA320 package | Suitable for lower-gate-count designs with same board footprint and power delivery | Select when design fits within 1,000-cell limit to reduce cost and static power |
| XC3S1600E-4FGG400C | 1,600 logic cells, 292 I/O, 400-pin FBGA, same 1.2 V core and DCM features | Required for higher-density logic, additional block RAM, or more I/O banks | Choose when XC3S1200E-4FGG320C resource utilization exceeds 90% in place-and-route |
Compared with XC3S1000-4FGG320C and XC3S1600E-4FGG400C, the XC3S1200E-4FGG320C delivers optimal balance of logic capacity, I/O count, and thermal dissipation in the 320-pin FBGA form factor-making it ideal for mid-complexity industrial control and interface consolidation where pin count and board area are constrained.
Availability
XC3S1200E-4FGG320C is available at Aetrix Electronics and suitable for industrial automation, medical imaging subsystems, and motor control electronics requiring stable component supply over extended production lifecycles.
Supply support for XC3S1200E-4FGG320C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family for cost-sensitive, high-volume embedded applications.
The Spartan-3E family was designed specifically for logic replacement, interface bridging, and digital control in industrial, automotive, and communications equipment where low power and predictable timing are essential.
FAQ
What is the maximum operating frequency of the XC3S1200E-4FGG320C?
The XC3S1200E-4FGG320C has a -4 speed grade, guaranteeing 333 MHz operation for critical paths under worst-case voltage and temperature conditions. Actual achievable frequency depends on design complexity, placement, and routing; typical user logic runs between 100–250 MHz in production implementations of the XC3S1200E-4FGG320C.
Does the XC3S1200E-4FGG320C support JTAG programming?
Yes, the XC3S1200E-4FGG320C fully supports IEEE 1149.1 JTAG boundary-scan for in-system programming, debugging, and production testing. Pins TCK, TMS, TDI, and TDO are dedicated for this function and require no additional configuration logic in the XC3S1200E-4FGG320C bitstream.
What power supplies are required for the XC3S1200E-4FGG320C?
The XC3S1200E-4FGG320C requires two regulated supplies: 1.2 V ±3% for VCCINT (core logic) and 2.5 V ±5% for VCCAUX (configuration and I/O banks). Some I/O banks accept 3.3 V externally but derive internal switching levels from VCCAUX; proper bank voltage assignment is mandatory in the XC3S1200E-4FGG320C design.
Can the XC3S1200E-4FGG320C be used in automotive applications?
The XC3S1200E-4FGG320C is rated for commercial temperature range (0°C to +85°C) and is not AEC-Q100 qualified. While used in under-hood-adjacent industrial systems, it is not recommended for safety-critical or engine-compartment automotive applications without additional thermal derating and system-level validation of the XC3S1200E-4FGG320C.
How many block RAMs does the XC3S1200E-4FGG320C contain?
The XC3S1200E-4FGG320C contains 24 block RAM primitives, each 18 Kbits, totaling 288 Kbits of true dual-port synchronous RAM. These are independently configurable as 18K × 1, 9K × 2, 4K × 4, or other combinations, and are accessible by both FPGA fabric and embedded processors in the XC3S1200E-4FGG320C.
XC3S1200E-4FGG320C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 320-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2168
- Number of Logic Elements/Cells:
- 19512
- Total RAM Bits:
- 516096
- Number of I/O:
- 250
- Number of Gates:
- 1200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 320-FBGA (19x19)
XC3S1200E-4FGG320C FAQ
1.How can I place an order for XC3S1200E-4FGG320C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1200E-4FGG320C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1200E-4FGG320C reliable?
The price and inventory of XC3S1200E-4FGG320C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1200E-4FGG320C is usually 5 days.
3.What payment methods are accepted for XC3S1200E-4FGG320C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1200E-4FGG320C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1200E-4FGG320C?
XC3S1200E-4FGG320C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1200E-4FGG320C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1200E-4FGG320C?
For technical support, including XC3S1200E-4FGG320C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1200E-4FGG320C requirements.
6.How does Aetrix verify that XC3S1200E-4FGG320C is sourced from the original manufacturer or authorized distributors?
All XC3S1200E-4FGG320C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1200E-4FGG320C meets industry standards.
7.What is the process for return or replacement of XC3S1200E-4FGG320C?
All XC3S1200E-4FGG320C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1200E-4FGG320C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1200E-4FGG320C part is unused and in its original packaging.
Return procedure for XC3S1200E-4FGG320C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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