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AMD XC3S1200E-4FGG400C
- Part No.:
- XC3S1200E-4FGG400C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 400-BGA
- Datasheet:
-
XC3S1200E-4FGG400C.pdf
- Description:
- IC FPGA 304 I/O 400FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:291
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Product details
Overview
XC3S1200E-4FGG400C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 1,200,000 system gates, 22,656 logic cells, and 512 Kbits of block RAM. It features 376 user I/Os in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package and operates at -4 speed grade (tPD = 4.8 ns). It is used in industrial control logic, video interface bridging, and embedded vision preprocessing.
For engineers reviewing the XC3S1200E-4FGG400C datasheet, pinout, applications, or equivalent options, key selection considerations include I/O count, block RAM depth, DLL support for clock deskew, and compatibility with Xilinx ISE 14.7 design tools.
Technical Context
The XC3S1200E-4FGG400C implements a configurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates twelve Digital Clock Managers (DCMs) supporting phase shifting, frequency synthesis, and duty cycle correction.
It supports SelectIO standards including LVCMOS, LVTTL, PCI, HSTL, and SSTL across its 376 user I/O pins. Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external PROM or processor-controlled loading.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 22,656 - provides combinational and registered logic capacity for medium-complexity digital controllers |
| System Gates | 1,200,000 - indicates total equivalent gate count for logic density estimation |
| Block RAM | 512 Kbits - supports dual-port FIFOs, frame buffers, or lookup tables up to 18 K × 32 bits |
| User I/O Pins | 376 - enables high-pin-count peripheral interfacing without external glue logic |
| DCMs | 12 - allows independent clock domain management for video timing, data capture, and system synchronization |
| Speed Grade | -4 - guarantees maximum 4.8 ns propagation delay for critical path timing closure |
Pinout & Package
XC3S1200E-4FGG400C is housed in a 400-ball Fine-Pitch Ball Grid Array (FBGA) package with 27 × 27 mm body size, 1.0 mm ball pitch, and Pb-free (RoHS-compliant) finish. Pin assignments follow Xilinx Spartan-3E pinout standard FGG400.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input - must be filtered with low-ESR ceramic capacitors near the ball |
| A2 | VCCAUX | 2.5 V auxiliary supply for configuration and I/O banks - shared across multiple banks |
| P1 | PROGRAM_B | Active-low configuration reset - initiates reconfiguration when pulsed low |
| R2 | DONE | Open-drain status output - goes high-Z after successful configuration completion |
| T3 | CCLK | Configuration clock input - drives internal configuration shift register during Master Serial mode |
| Y1 | TCK | JTAG test clock - required for boundary-scan and debug access via IEEE 1149.1 interface |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Multipliers | 32 × 18-bit hardwired multipliers enable real-time FIR filtering and motor control loop computation |
| SelectIO Technology | Supports 12 I/O standards with programmable drive strength and slew rate - reduces signal integrity issues across mixed-voltage interfaces |
| Digital Clock Manager (DCM) | 12 DCMs provide jitter reduction, phase alignment, and frequency multiplication - eliminates need for external clock ICs in timing-critical subsystems |
| Embedded Block RAM | 32 × 16 Kbit blocks - allows implementation of dual-clock FIFOs with independent read/write pointers and full/half-full flags |
| Configurable Logic Blocks (CLBs) | Each CLB contains two slices with four LUTs and eight flip-flops - optimizes resource utilization for pipelined datapaths |
Applications
| Industrial Motion Control | Video Interface Bridging |
|---|---|
Use Scenario: Real-time closed-loop servo positioning in CNC machines and robotic arms. IC Role / Device Role / Timing Role: FPGA logic implements PID controllers, encoder quadrature decoding, and PWM generation with deterministic sub-microsecond latency. Use Value: 12 DCMs synchronize axis timing; 376 I/Os route encoder feedback, limit switches, and motor driver signals without external bus transceivers. | Use Scenario: Converting between HDMI 1.3a and LVDS display interfaces in medical imaging panels. IC Role / Device Role / Timing Role: XC3S1200E-4FGG400C acts as a protocol translator and pixel clock domain crossing bridge. Use Value: Embedded block RAM buffers video lines; SelectIO supports both 3.3 V HDMI receiver inputs and 1.8 V LVDS transmitter outputs. |
| Embedded Vision Preprocessing | Communications Baseband Processing |
Use Scenario: On-camera image enhancement in smart surveillance systems before JPEG compression. IC Role / Device Role / Timing Role: Configurable logic performs Bayer demosaicing, gamma correction, and noise filtering in pipeline stages. Use Value: 22,656 logic cells accommodate parallel pixel processing; 512 Kbits block RAM stores line buffers for 1280×720@60 fps streams. | Use Scenario: Channel coding/decoding and symbol mapping in point-to-point wireless telemetry modules. IC Role / Device Role / Timing Role: XC3S1200E-4FGG400C implements convolutional encoding, Viterbi decoding, and QPSK modulation logic. Use Value: Hardwired multipliers accelerate FEC computations; DCMs align baseband clock domains with RF front-end sampling clocks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FGG400C | 1,000,000 system gates, 17,280 logic cells, 432 Kbits block RAM - lower density and memory capacity | Suitable for simpler control logic or smaller video pipelines where 22,656 LUTs are not required | Select when cost sensitivity outweighs need for extra logic resources or larger FIFO depth |
| XC3S1600E-4FGG400C | 1,600,000 system gates, 28,672 logic cells, 640 Kbits block RAM - higher density and memory bandwidth | Required for multi-channel video processing or complex protocol stacks exceeding XC3S1200E capacity | Choose when additional LUTs or deeper block RAM are needed for future scalability or feature expansion |
Compared with XC3S1200E-4FGG400C, the XC3S1000-4FGG400C reduces logic and memory headroom but lowers unit cost, while the XC3S1600E-4FGG400C increases resource margin at higher power and BOM cost - both share identical FGG400 packaging and I/O voltage compatibility.
Availability
XC3S1200E-4FGG400C is available at Aetrix Electronics and suitable for industrial motion control, video interface bridging, and embedded vision preprocessing requiring stable component supply over extended production lifecycles.
Supply support for XC3S1200E-4FGG400C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops and supports the Spartan FPGA family as part of its adaptive computing portfolio.
The Spartan-3E family was designed for cost-sensitive, high-volume embedded applications requiring predictable timing, low static power, and broad I/O flexibility - especially in industrial automation and video infrastructure.
FAQ
What is the maximum operating frequency supported by the XC3S1200E-4FGG400C?
The XC3S1200E-4FGG400C has a -4 speed grade specifying a maximum I/O toggle rate of 333 MHz and internal logic performance up to 572 MHz for registered outputs. Actual achievable frequency depends on design placement, routing, and clocking structure - verified timing analysis must be performed using Xilinx ISE 14.7.
Does the XC3S1200E-4FGG400C support JTAG boundary-scan testing?
Yes, the XC3S1200E-4FGG400C fully supports IEEE 1149.1 JTAG boundary-scan through dedicated TCK, TMS, TDI, and TDO pins. This enables in-system programming, debugging, and PCB-level interconnect verification without requiring external test fixtures.
What configuration modes does the XC3S1200E-4FGG400C support?
The XC3S1200E-4FGG400C supports Master Serial, Slave Serial, Slave Parallel, and JTAG configuration modes. Configuration bitstream can be loaded from external SPI PROM, microcontroller, or PC via USB-JTAG cable - all modes use the same FGG400 pinout and require no hardware changes.
Is the XC3S1200E-4FGG400C RoHS compliant?
Yes, the XC3S1200E-4FGG400C is manufactured with lead-free (Pb-free) solder balls and complies with EU RoHS Directive 2011/65/EU. The FGG400 package uses matte tin finish on copper pillars and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3).
Can the XC3S1200E-4FGG400C operate with multiple I/O voltage standards simultaneously?
Yes, the XC3S1200E-4FGG400C organizes its 376 user I/Os into eight banks, each independently configurable for VCCO voltages of 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V. This allows concurrent LVDS, SSTL, and LVTTL signaling on the same device without level-shifting components.
XC3S1200E-4FGG400C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 400-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2168
- Number of Logic Elements/Cells:
- 19512
- Total RAM Bits:
- 516096
- Number of I/O:
- 304
- Number of Gates:
- 1200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 400-FBGA (21x21)
XC3S1200E-4FGG400C FAQ
1.How can I place an order for XC3S1200E-4FGG400C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1200E-4FGG400C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1200E-4FGG400C reliable?
The price and inventory of XC3S1200E-4FGG400C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1200E-4FGG400C is usually 5 days.
3.What payment methods are accepted for XC3S1200E-4FGG400C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1200E-4FGG400C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1200E-4FGG400C?
XC3S1200E-4FGG400C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1200E-4FGG400C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1200E-4FGG400C?
For technical support, including XC3S1200E-4FGG400C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1200E-4FGG400C requirements.
6.How does Aetrix verify that XC3S1200E-4FGG400C is sourced from the original manufacturer or authorized distributors?
All XC3S1200E-4FGG400C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1200E-4FGG400C meets industry standards.
7.What is the process for return or replacement of XC3S1200E-4FGG400C?
All XC3S1200E-4FGG400C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1200E-4FGG400C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1200E-4FGG400C part is unused and in its original packaging.
Return procedure for XC3S1200E-4FGG400C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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