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AMD XC3S1200E-4FGG400I
- Part No.:
- XC3S1200E-4FGG400I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 400-BGA
- Datasheet:
-
XC3S1200E-4FGG400I.pdf
- Description:
- IC FPGA 304 I/O 400FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,507
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Product details
Overview
XC3S1200E-4FGG400I from AMD (formerly Xilinx) is a Spartan-3E FPGA with 1,152 logic cells, 228 I/O pins, and 512 Kbits of total block RAM, configured in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package for embedded control and interface bridging applications.
For engineers reviewing the XC3S1200E-4FGG400I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, block RAM depth, speed grade (-4), and thermal performance in industrial temperature range (-40°C to +100°C).
Technical Context
The XC3S1200E-4FGG400I implements a configurable logic fabric based on 4-input LUTs and distributed RAM, with dedicated 18×18 multipliers and digital clock managers (DCMs) supporting phase alignment and frequency synthesis. It supports SelectIO standards including LVCMOS, LVTTL, PCI, and SSTL.
Configuration is performed via master serial mode using external PROM or microcontroller, with JTAG boundary-scan support for testing. The -4 speed grade guarantees timing closure at 333 MHz for internal logic and 200 MHz for I/O interfaces under worst-case industrial conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,152 - determines maximum combinational/sequential logic capacity for custom state machines or protocol engines |
| I/O Pins | 228 - supports high-density peripheral interfacing with bank-wise voltage flexibility (1.2V–3.3V) |
| Block RAM | 512 Kbits - enables dual-port FIFOs, lookup tables, or small buffer memory without external SRAM |
| Speed Grade | -4 - ensures timing compliance at 333 MHz internal clock and 200 MHz I/O toggle rate in industrial temp |
| Package | 400-pin FGG (Fine-Pitch BGA) - 27 × 27 mm body, 1.0 mm ball pitch, JEDEC MO-251 compliant |
| Operating Temp | -40°C to +100°C - qualified for extended industrial environments without derating |
Pinout & Package
XC3S1200E-4FGG400I is housed in a 400-ball fine-pitch BGA (FGG) package with 228 user I/Os distributed across 10 I/O banks, each independently configurable for voltage and standard. Power and ground balls are arranged per Xilinx Spartan-3E PCB layout guidelines to minimize noise and ensure stable core voltage delivery.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input - must be decoupled locally with ≥10 µF ceramic + 100 nF low-ESR capacitors |
| P2 | VCCAUX | 2.5 V auxiliary supply for configuration and DCM circuits - requires separate regulation |
| A1 | PROGRAM_B | Active-low configuration reset - pulls low to reinitialize configuration logic and reload bitstream |
| D3 | DONE | Open-drain status output - goes high when configuration completes successfully and I/Os are released |
| T14 | CLK0 | Primary global clock input - connects to DCM input for jitter-reduced clock distribution |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Multipliers | Four 18×18-bit signed multipliers - enable real-time FIR filtering or motor control math without LUT resource overhead |
| Digital Clock Managers (DCMs) | Two DCMs per device - provide zero-delay buffering, frequency synthesis (×2 to ×32), and phase shifting (±90° steps) |
| SelectIO Technology | Support for 15 I/O standards - allows direct connection to legacy parallel buses, DDR SDRAM, and PCI peripherals |
| Configuration Security | Bitstream encryption option - prevents reverse engineering of design logic when enabled via JTAG programming |
Applications
| Industrial PLC I/O Module | Automotive Diagnostic Interface |
|---|---|
Use Scenario: Real-time scanning of 64 discrete sensor inputs and driving 32 relay outputs in factory automation cabinets. IC Role / Device Role / Timing Role: FPGA acts as deterministic I/O concentrator and protocol translator between fieldbus (CANopen) and backplane (PCI-X). Use Value: 228 I/O pins and -4 speed grade enable sub-10 µs input-to-output latency with no external glue logic. | Use Scenario: OBD-II to USB-C bridge in handheld diagnostic tools supporting UDS and KWP2000 protocols. IC Role / Device Role / Timing Role: FPGA handles physical layer translation, CAN message framing, and USB endpoint management. Use Value: Embedded DCMs generate precise 24 MHz USB clock and 500 kHz CAN bit timing from single crystal oscillator. |
| Medical Imaging Front-End | Test & Measurement Pattern Generator |
Use Scenario: Digitizing and preprocessing analog signals from ultrasound transducer arrays before sending to DSP subsystem. IC Role / Device Role / Timing Role: FPGA performs real-time beamforming delay calculation and 12-bit ADC data aggregation. Use Value: 512 Kbits block RAM buffers 256-sample windows per channel while LUTs execute fixed-point interpolation. | Use Scenario: Generating synchronized multi-channel digital stimulus waveforms for IC validation benches. IC Role / Device Role / Timing Role: FPGA serves as programmable pattern sequencer with independent timing control per 8-bit bus. Use Value: 1,152 logic cells implement 16-state sequencers with 10 ns resolution and glitch-free state transitions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FGG456C | Same architecture, 1,000 logic cells, 456-pin FBGA, commercial temp (0°C to +70°C) | Lacks industrial temperature rating and has fewer I/Os (190 vs. 228) | Choose only for cost-sensitive, non-industrial designs where board space allows larger package |
| XC3S1400A-4FGG484I | Next-generation Spartan-3A, 1,400 logic cells, 484-pin FBGA, same industrial temp range | Higher gate count and improved DCM jitter specs but requires PCB redesign due to different pinout | Prefer for new designs needing >1,152 logic cells; not drop-in compatible with XC3S1200E-4FGG400I |
Compared with XC3S1000-4FGG456C and XC3S1400A-4FGG484I, the XC3S1200E-4FGG400I uniquely balances I/O density, industrial temperature operation, and 400-pin footprint-making it optimal for space-constrained industrial controllers where 228 I/Os and -40°C to +100°C operation are mandatory.
Availability
XC3S1200E-4FGG400I is available at Aetrix Electronics and suitable for industrial automation, automotive diagnostics, and medical imaging systems requiring stable component supply and long-term lifecycle support.
Supply support for XC3S1200E-4FGG400I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Spartan-3E family was designed by Xilinx as a cost-optimized, high-I/O-density FPGA line targeting industrial control, communications infrastructure, and consumer electronics with embedded processing needs.
FAQ
What is the maximum operating frequency of the XC3S1200E-4FGG400I?
The XC3S1200E-4FGG400I has a -4 speed grade, guaranteeing reliable operation up to 333 MHz for internal logic paths and 200 MHz for I/O toggle rates under worst-case industrial temperature and voltage conditions. Actual achievable frequency depends on design complexity and routing, but timing analysis tools confirm this limit for fully constrained implementations.
Does the XC3S1200E-4FGG400I support JTAG boundary-scan testing?
Yes, the XC3S1200E-4FGG400I fully supports IEEE 1149.1 JTAG boundary-scan for PCB-level interconnect testing and in-system programming. TDI, TDO, TMS, TCK, and TCK pins are assigned to dedicated package balls and function per Xilinx UG332 specification without requiring additional configuration.
What configuration modes are supported by the XC3S1200E-4FGG400I?
The XC3S1200E-4FGG400I supports master serial, slave serial, slave parallel, and JTAG configuration modes. Master serial mode uses an external PROM (e.g., XCF02S) to auto-load the bitstream at power-up, while JTAG enables debug and reprogramming without hardware changes.
Is the XC3S1200E-4FGG400I RoHS compliant?
Yes, the XC3S1200E-4FGG400I is RoHS compliant and lead-free, meeting EU Directive 2011/65/EU requirements. The FGG400 package uses matte tin finish on solder balls and complies with IPC/JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) handling guidelines.
Can the XC3S1200E-4FGG400I interface directly with DDR SDRAM?
Yes, the XC3S1200E-4FGG400I supports SSTL_2 and SSTL_18 I/O standards required for DDR and DDR2 SDRAM interfaces. Its 228 I/O pins allow full address/control bus plus multiple data groups, and DCM-generated clocks meet setup/hold timing when used with proper PCB layout and termination.
XC3S1200E-4FGG400I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 400-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2168
- Number of Logic Elements/Cells:
- 19512
- Total RAM Bits:
- 516096
- Number of I/O:
- 304
- Number of Gates:
- 1200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 400-FBGA (21x21)
XC3S1200E-4FGG400I FAQ
1.How can I place an order for XC3S1200E-4FGG400I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1200E-4FGG400I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1200E-4FGG400I reliable?
The price and inventory of XC3S1200E-4FGG400I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1200E-4FGG400I is usually 5 days.
3.What payment methods are accepted for XC3S1200E-4FGG400I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1200E-4FGG400I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1200E-4FGG400I?
XC3S1200E-4FGG400I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1200E-4FGG400I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1200E-4FGG400I?
For technical support, including XC3S1200E-4FGG400I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1200E-4FGG400I requirements.
6.How does Aetrix verify that XC3S1200E-4FGG400I is sourced from the original manufacturer or authorized distributors?
All XC3S1200E-4FGG400I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1200E-4FGG400I meets industry standards.
7.What is the process for return or replacement of XC3S1200E-4FGG400I?
All XC3S1200E-4FGG400I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1200E-4FGG400I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1200E-4FGG400I part is unused and in its original packaging.
Return procedure for XC3S1200E-4FGG400I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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