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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XC3S1200E-4FT256C

Name: XC3S1200E-4FT256C
Brand: AMD
SKU: XC3S1200E-4FT256C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XC3S1200E-4FT256C

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 256-LBGA

Datasheet:: XC3S1200E-4FT256C.pdf

Description:: IC FPGA 190 I/O 256FTBGA

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Product details

Overview

XC3S1200E-4FT256C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 1200K system gates, 22,176 logic cells, and 512 KB of total block RAM. It features 190 user I/Os in a 256-pin FTBGA package and operates at -4 speed grade (t_PD = 4.5 ns), targeting cost-sensitive embedded control and interface bridging applications.

For engineers reviewing the XC3S1200E-4FT256C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, block RAM depth, DLL support for clock management, and compatibility with Xilinx ISE 14.7 design tools.

Technical Context

The XC3S1200E-4FT256C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It integrates eight Digital Clock Managers (DCMs) supporting phase shifting, frequency synthesis, and duty cycle correction - critical for synchronous interface timing alignment.

Its I/O bank structure supports LVCMOS, LVTTL, PCI, and SSTL standards across four independent banks, enabling mixed-voltage interfacing. Configuration occurs via Master Serial mode using external PROM or JTAG boundary-scan, with full IEEE 1149.1 compliance.

Key Specifications

Parameter	Value and Actual Design Meaning
Logic Cells	22,176 - determines maximum combinational/sequential logic capacity for custom state machines or protocol engines
Block RAM	512 KB - supports dual-port buffering for video frame stores or packet FIFOs up to 256K × 18 bits
User I/O Pins	190 - enables direct connection to multiple peripheral buses without glue logic
DCMs	8 - provides independent clock domain generation for ADC sampling, display refresh, and CPU bus timing
Speed Grade	-4 (t_PD = 4.5 ns) - guarantees maximum combinatorial path delay for 125 MHz system clock domains
I/O Standards	LVCMOS/LVTTL/PCI/SSTL - allows interoperability with legacy microcontrollers, DDR SDRAM, and PCI peripherals

Pinout & Package

XC3S1200E-4FT256C uses a 256-pin Fine-Pitch Thin BGA (FTBGA) package with 1.0 mm ball pitch and 17 × 17 array. Thermal pad exposed on underside requires solder paste stencil opening per Xilinx UG331.

Pin/Terminal	Circuit Role	Design Meaning
P1	PROGRAM_B	Active-Low configuration initiation signal - must be pulled high after power-up to enable startup
R2	DONE	Open-drain status output indicating successful bitstream loading and I/O initialization
T3	CCLK	Configuration clock input - drives internal shift register during Master Serial PROM loading
V1	VCCO_0	I/O bank 0 supply - sets voltage level (1.2–3.3 V) for pins in Bank 0
Y2	GND	Ground reference for core logic and I/O banks - requires low-inductance connection to PCB plane

Key Features

Feature	Design Value
Dedicated 18 × 18 multipliers	40 units - accelerate FIR filtering, motor control PWM generation, and real-time math operations
SelectIO technology	Supports source-synchronous interfaces like SPI, UART, and parallel camera sensors with programmable slew rate and drive strength
Digital Clock Manager (DCM)	8 independent DCMs - eliminate external PLLs for clock multiplication, phase alignment, and jitter reduction
Embedded block RAM	Configurable as true dual-port RAM, ROM, or shift register - enables pipelined dataflow architectures

Applications

Industrial PLC I/O Module	Video Interface Bridge
Use Scenario: Real-time digital I/O expansion for ladder logic execution with deterministic scan cycles. IC Role / Device Role / Timing Role: FPGA fabric implements custom I/O mapping, debounce logic, and fieldbus protocol encoding (e.g., Modbus RTU). Use Value: 190 user I/Os allow direct connection to 32-channel DI/DO modules without multiplexing; DCMs synchronize sensor sampling to PLC scan clock.	Use Scenario: Converting parallel CMOS image sensor output to MIPI CSI-2 serial stream for embedded vision processors. IC Role / Device Role / Timing Role: XC3S1200E-4FT256C acts as a protocol translator and pixel clock domain adapter between asynchronous sensor and host SoC. Use Value: Block RAM buffers full lines of image data; DCMs generate precise pixel clock and MIPI byte clock with < ±50 ps skew.
Medical Patient Monitor Front-End	Automated Test Equipment (ATE) Pattern Generator
Use Scenario: Aggregating analog sensor inputs (ECG, SpO₂, NIBP) and managing isolated communication to central display unit. IC Role / Device Role / Timing Role: Configurable logic handles ADC interface timing, alarm logic, and UART/USB bridge functions. Use Value: SelectIO supports mixed-voltage I/O for connecting 1.8 V ADCs and 3.3 V isolation transceivers; 512 KB RAM stores waveform history buffers.	Use Scenario: Generating high-speed digital stimulus patterns for IC functional testing at 100+ MHz rates. IC Role / Device Role / Timing Role: XC3S1200E-4FT256C serves as pattern memory controller and timing generator with precise edge placement. Use Value: -4 speed grade ensures sub-5 ns path delays for setup/hold compliance; 190 I/Os drive 64-bit wide test buses with programmable drive strength.

Industrial PLC I/O Module

Video Interface Bridge

Use Scenario: Real-time digital I/O expansion for ladder logic execution with deterministic scan cycles.

IC Role / Device Role / Timing Role: FPGA fabric implements custom I/O mapping, debounce logic, and fieldbus protocol encoding (e.g., Modbus RTU).

Use Value: 190 user I/Os allow direct connection to 32-channel DI/DO modules without multiplexing; DCMs synchronize sensor sampling to PLC scan clock.

Use Scenario: Converting parallel CMOS image sensor output to MIPI CSI-2 serial stream for embedded vision processors.

IC Role / Device Role / Timing Role: XC3S1200E-4FT256C acts as a protocol translator and pixel clock domain adapter between asynchronous sensor and host SoC.

Use Value: Block RAM buffers full lines of image data; DCMs generate precise pixel clock and MIPI byte clock with < ±50 ps skew.

Medical Patient Monitor Front-End

Automated Test Equipment (ATE) Pattern Generator

Use Scenario: Aggregating analog sensor inputs (ECG, SpO₂, NIBP) and managing isolated communication to central display unit.

IC Role / Device Role / Timing Role: Configurable logic handles ADC interface timing, alarm logic, and UART/USB bridge functions.

Use Value: SelectIO supports mixed-voltage I/O for connecting 1.8 V ADCs and 3.3 V isolation transceivers; 512 KB RAM stores waveform history buffers.

Use Scenario: Generating high-speed digital stimulus patterns for IC functional testing at 100+ MHz rates.

IC Role / Device Role / Timing Role: XC3S1200E-4FT256C serves as pattern memory controller and timing generator with precise edge placement.

Use Value: -4 speed grade ensures sub-5 ns path delays for setup/hold compliance; 190 I/Os drive 64-bit wide test buses with programmable drive strength.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XC3S1000-4FT256C	1000K gates, 17,280 logic cells, 448 KB block RAM - lower density and memory capacity	Suitable for simpler control logic with fewer concurrent peripherals	Choose when design fits within reduced resource budget and lower cost is prioritized over future scalability
XC3S1600E-4FT256C	1600K gates, 29,952 logic cells, 640 KB block RAM - higher density and memory bandwidth	Required for complex video processing pipelines or multi-protocol interface aggregation	Choose when XC3S1200E-4FT256C resources are insufficient for final RTL utilization

Compared with XC3S1000-4FT256C and XC3S1600E-4FT256C, the XC3S1200E-4FT256C delivers balanced logic, memory, and I/O resources for mid-complexity embedded systems - avoiding overdesign while retaining headroom for feature expansion.

Availability

XC3S1200E-4FT256C is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and test equipment requiring stable component supply throughout long production lifecycles.

Supply support for XC3S1200E-4FT256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains the Spartan-3E product line for legacy industrial and aerospace applications.

The Spartan-3E family was designed for cost-optimized, non-volatile-configurable logic in space-constrained embedded systems where ASIC development cost or time-to-market is prohibitive.

FAQ

What configuration modes does the XC3S1200E-4FT256C support?

The XC3S1200E-4FT256C supports Master Serial, Slave Serial, Slave Parallel, and JTAG configuration modes. Master Serial mode uses an external PROM to auto-load the bitstream at power-up. JTAG is used for programming, debugging, and boundary-scan testing. The XC3S1200E-4FT256C requires proper pull-up/pull-down resistors on INIT_B, PROGRAM_B, and DONE pins to ensure reliable mode selection and startup behavior.

Does the XC3S1200E-4FT256C include built-in configuration memory?

No, the XC3S1200E-4FT256C does not include non-volatile configuration memory. It relies on external configuration PROMs (e.g., XCF02S, XCF04S) or JTAG programming for bitstream loading. The XC3S1200E-4FT256C retains its programmed state only while powered; reconfiguration is required at each power cycle unless a persistent PROM is used.

What is the maximum operating temperature range for the XC3S1200E-4FT256C?

The XC3S1200E-4FT256C is rated for commercial temperature range (0 °C to +70 °C). Its thermal performance depends on PCB layout, airflow, and power dissipation - typical dynamic power at 100 MHz toggle rate is ~1.2 W. The XC3S1200E-4FT256C requires adequate copper pour and thermal vias under the FTBGA package to maintain junction temperature within specification.

Can the XC3S1200E-4FT256C interface directly with DDR SDRAM?

Yes, the XC3S1200E-4FT256C supports SSTL_2 and SSTL_3 I/O standards in dedicated I/O banks, enabling direct connection to DDR SDRAM chips operating at 2.5 V or 3.3 V. Proper termination, controlled impedance routing, and DCM-generated phase-aligned clocks are required. The XC3S1200E-4FT256C does not include hard DDR controller logic - external IP or soft-core controllers must manage command sequencing and refresh.

Is the XC3S1200E-4FT256C supported in modern Xilinx/Vivado toolchains?

No, the XC3S1200E-4FT256C is supported exclusively in the legacy Xilinx ISE Design Suite (v14.7 and earlier). Vivado does not support Spartan-3E devices. Design entry, synthesis, place-and-route, and bitstream generation for the XC3S1200E-4FT256C must be performed using ISE 14.7 with appropriate service packs installed.

XC3S1200E-4FT256C Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Spartan®-3E

Package/Case:: 256-LBGA

Packaging:: Bulk

Product Status:: Obsolete

Programmable:: Not Verified

Number of LABs/CLBs:: 2168

Number of Logic Elements/Cells:: 19512

Total RAM Bits:: 516096

Number of I/O:: 190

Number of Gates:: 1200000

Voltage - Supply:: 1.14V ~ 1.26V

Mounting Type:: Surface Mount

Operating Temperature:: 0°C ~ 85°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 256-FTBGA (17x17)

XC3S1200E-4FT256C FAQ

1.How can I place an order for XC3S1200E-4FT256C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC3S1200E-4FT256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC3S1200E-4FT256C reliable?

The price and inventory of XC3S1200E-4FT256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1200E-4FT256C is usually 5 days.

3.What payment methods are accepted for XC3S1200E-4FT256C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1200E-4FT256C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC3S1200E-4FT256C?

XC3S1200E-4FT256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC3S1200E-4FT256C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC3S1200E-4FT256C?

For technical support, including XC3S1200E-4FT256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1200E-4FT256C requirements.

6.How does Aetrix verify that XC3S1200E-4FT256C is sourced from the original manufacturer or authorized distributors?

All XC3S1200E-4FT256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1200E-4FT256C meets industry standards.

7.What is the process for return or replacement of XC3S1200E-4FT256C?

All XC3S1200E-4FT256C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1200E-4FT256C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC3S1200E-4FT256C part is unused and in its original packaging.

Return procedure for XC3S1200E-4FT256C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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