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AMD XC3S1200E-4FT256I
- Part No.:
- XC3S1200E-4FT256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S1200E-4FT256I.pdf
- Description:
- IC FPGA 190 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,875
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Product details
Overview
XC3S1200E-4FT256I from AMD (formerly Xilinx) is a Spartan-3E FPGA with 1,191 logic cells, 228 I/O pins, and 512 kbits of block RAM, configured in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade and supports 3.3V/2.5V/1.2V mixed-voltage I/O banks for industrial control and embedded vision interface applications.
For engineers reviewing the XC3S1200E-4FT256I datasheet, pinout, applications, or equivalent options, key selection criteria include logic cell count, I/O voltage flexibility, block RAM capacity, and -4 speed grade timing compliance for deterministic real-time processing.
Technical Context
The XC3S1200E-4FT256I implements a configurable logic fabric based on 4-input LUTs and distributed RAM, with dedicated carry logic for arithmetic functions. It integrates twelve 18×18 multipliers and supports SelectIO standards including LVCMOS, LVTTL, PCI, and SSTL.
Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan, with full IEEE 1149.1 compliance. The device includes Digital Clock Managers (DCMs) providing phase shifting, frequency synthesis, and duty cycle correction for up to eight independent clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,191 - Configurable units each containing a 4-LUT and flip-flop for combinational and sequential logic implementation. |
| I/O Pins | 228 - Programmable bidirectional pins supporting multiple voltage standards per bank for mixed-signal interfacing. |
| Block RAM | 512 kbits - Dedicated memory blocks usable as FIFOs, buffers, or lookup tables without consuming logic resources. |
| Speed Grade | -4 - Guaranteed timing performance meeting maximum delay specs for critical paths at industrial temperature range. |
| DCMs | 2 - Digital Clock Managers enabling jitter reduction, clock multiplication/division, and phase alignment across system clocks. |
| Multipliers | 12 × 18×18 - Hard IP blocks accelerating arithmetic-intensive tasks like filtering or motor control algorithms. |
Pinout & Package
XC3S1200E-4FT256I is housed in a 256-ball Fine-Pitch Ball Grid Array (FT256) package with 1.0 mm ball pitch, designed for high-density PCB layouts and thermal reliability in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2V core supply input requiring local decoupling for stable internal logic operation. |
| P2 | VCCAUX | 2.5V auxiliary supply for configuration circuitry and DCMs, independent of I/O voltage rails. |
| T14 | PROGRAM_B | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence. |
| R15 | DONE | Open-drain status output indicating successful configuration completion and readiness for user logic execution. |
| U13 | CCLK | Configuration clock input used during Master Serial PROM loading; also serves as JTAG TCK in boundary-scan mode. |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO Technology | Supports 17 I/O standards across 16 banks, enabling direct interfacing with ADCs, sensors, and microcontrollers without level-shifting. |
| Digital Clock Manager (DCM) | Provides zero-delay buffering, frequency synthesis (×2 to ×32), and ±90° phase shift for precise clock domain crossing. |
| Configurable Logic Blocks (CLBs) | Each CLB contains two slices with four LUTs and eight flip-flops, optimized for high-speed synchronous design and pipelining. |
| Embedded Multipliers | Twelve 18×18 signed/unsigned multipliers deliver 216 MAC operations per clock cycle for real-time signal processing. |
Applications
| Industrial Motion Control | Video Interface Bridge |
|---|---|
Use Scenario: Real-time closed-loop servo drive with encoder feedback and PWM generation. IC Role / Device Role / Timing Role: FPGA fabric implements PID controller, encoder counter, and 6-channel PWM generator with sub-microsecond timing resolution. Use Value: Deterministic latency from encoder capture to PWM update ensures jitter-free motor commutation at 20 kHz switching frequency. | Use Scenario: Conversion between MIPI CSI-2 camera output and parallel RGB interface for FPGA-based image preprocessing. IC Role / Device Role / Timing Role: XC3S1200E-4FT256I acts as protocol translator and pixel clock domain synchronizer between sensor and display subsystems. Use Value: Dual DCMs align MIPI byte clock (250 MHz) and RGB pixel clock (75 MHz) with <±50 ps skew for glitch-free frame transfer. |
| Programmable Logic Controller (PLC) | Test Equipment Digital Pattern Generator |
Use Scenario: Modular I/O expansion module with isolated digital inputs/outputs and fieldbus communication. IC Role / Device Role / Timing Role: XC3S1200E-4FT256I manages 32-channel opto-isolated input sampling and 16-channel relay driver timing with deterministic scan cycle. Use Value: 228 I/O pins support simultaneous connection to isolation ICs, CAN transceivers, and status LEDs without external glue logic. | Use Scenario: High-speed digital stimulus generation for ASIC validation with programmable timing and data patterns. IC Role / Device Role / Timing Role: FPGA implements pattern memory, sequencer, and 100 MHz DDR output drivers synchronized to system reference clock. Use Value: Block RAM stores 64k test vectors while DCM-derived clocks ensure setup/hold compliance across all 32 output pins. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FT256I | 1,000 logic cells, 432 kbits block RAM, identical FT256 package and -4 speed grade. | Slightly reduced logic density and memory; suitable where design fits within tighter resource budget. | Select when logic utilization is below 85% and no additional multipliers or DCMs are required beyond XC3S1200E-4FT256I baseline. |
| XC3S1600E-4FT256C | 1,584 logic cells, 640 kbits block RAM, same architecture but commercial temperature grade (0°C to 85°C). | Higher resource count enables larger state machines or wider datapaths; not rated for extended industrial temperature range. | Choose only for non-industrial environments where ambient temperature remains within 0–85°C and extra logic resources justify cost premium. |
Compared with XC3S1200E-4FT256I, XC3S1000-4FT256I offers lower cost and power at the expense of 16% fewer logic cells and 15% less block RAM, while XC3S1600E-4FT256C provides headroom for future design scaling but sacrifices industrial temperature qualification.
Availability
XC3S1200E-4FT256I is available at Aetrix Electronics and suitable for industrial motion control, video interface bridging, and programmable logic controller (PLC) applications requiring stable component supply across long-lifecycle embedded deployments.
Supply support for XC3S1200E-4FT256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for heterogeneous compute acceleration.
The Spartan-3E family was originally designed by Xilinx for cost-sensitive, high-volume embedded applications requiring reliable logic density, flexible I/O, and low-power operation in industrial and automotive environments.
FAQ
What is the maximum operating junction temperature for XC3S1200E-4FT256I?
The XC3S1200E-4FT256I has a maximum operating junction temperature of 100°C, specified for the Industrial temperature grade (-40°C to +100°C). This rating is validated under worst-case voltage, frequency, and ambient conditions defined in the Xilinx DS312 datasheet. Thermal design must maintain junction temperature below this limit using appropriate PCB copper area and airflow. The XC3S1200E-4FT256I thermal characteristics are documented in Table 12 of the official Spartan-3E DC and Switching Characteristics datasheet.
Does XC3S1200E-4FT256I support JTAG boundary-scan for in-circuit testing?
Yes, XC3S1200E-4FT256I fully complies with IEEE 1149.1 (JTAG) standard and supports boundary-scan testing through dedicated TDI, TDO, TMS, and TCK pins. The JTAG interface enables device programming, debug access, and interconnect testing without requiring external configuration PROM. Configuration bitstream verification and readback are supported, and the XC3S1200E-4FT256I's BSCAN_SPARTAN3E primitive allows integration into system-level JTAG chains.
Can XC3S1200E-4FT256I be configured using a serial PROM, and which devices are compatible?
Yes, XC3S1200E-4FT256I supports Master Serial configuration using industry-standard 4-Mbit or 8-Mbit SPI PROMs such as XCF04S and XCF08S. These PROMs store the configuration bitstream and automatically load it on power-up via the CCLK and DIN pins. The XC3S1200E-4FT256I's configuration controller handles CRC checking and fallback mechanisms. Compatibility requires matching VCCO voltage and timing specifications per Xilinx UG332.
What I/O standards are supported by XC3S1200E-4FT256I's SelectIO pins?
XC3S1200E-4FT256I supports 17 SelectIO standards across its 16 I/O banks, including LVCMOS 3.3V/2.5V/1.8V/1.5V, LVTTL, PCI, PCI-X, SSTL2_I, SSTL3_I, HSTL_I, and GTL. Each bank operates independently at a single VCCO voltage, allowing mixed-voltage interfaces on one device. The XC3S1200E-4FT256I's I/O electrical characteristics are detailed in Tables 19–22 of DS312.
Is XC3S1200E-4FT256I still in active production, and what is its obsolescence status?
XC3S1200E-4FT256I is listed as Not Recommended for New Designs (NRND) by AMD/Xilinx, with last-time-buy (LTB) windows managed through authorized distributors. While no formal end-of-life date has been published, Aetrix Electronics maintains inventory and offers lifecycle coordination services including cross-reference support and migration path guidance. Customers using XC3S1200E-4FT256I should consult AMD's Product Change Notifications for updates.
XC3S1200E-4FT256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2168
- Number of Logic Elements/Cells:
- 19512
- Total RAM Bits:
- 516096
- Number of I/O:
- 190
- Number of Gates:
- 1200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S1200E-4FT256I FAQ
1.How can I place an order for XC3S1200E-4FT256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1200E-4FT256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1200E-4FT256I reliable?
The price and inventory of XC3S1200E-4FT256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1200E-4FT256I is usually 5 days.
3.What payment methods are accepted for XC3S1200E-4FT256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1200E-4FT256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1200E-4FT256I?
XC3S1200E-4FT256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1200E-4FT256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1200E-4FT256I?
For technical support, including XC3S1200E-4FT256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1200E-4FT256I requirements.
6.How does Aetrix verify that XC3S1200E-4FT256I is sourced from the original manufacturer or authorized distributors?
All XC3S1200E-4FT256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1200E-4FT256I meets industry standards.
7.What is the process for return or replacement of XC3S1200E-4FT256I?
All XC3S1200E-4FT256I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1200E-4FT256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1200E-4FT256I part is unused and in its original packaging.
Return procedure for XC3S1200E-4FT256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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